Fine Grained, Non Banded, Refractory Metal Sputtering Targets with a Uniformly Random Crystallographic Orientation, Method for Making Such Film, and Thin Film Based Devices and Products Made Therefrom

  • US 20080271779A1
  • Filed: 11/08/2007
  • Published: 11/06/2008
  • Est. Priority Date: 05/04/2007
  • Status: Active Grant
First Claim
Patent Images

1. A sputtering target which comprises a fine uniform equiaxed grain structure of less than 44 microns, no preferred texture orientation as measured by electron back scattered diffraction (“

  • EBSD”

    ) and that displays no grain size banding or texture banding throughout the body of the target.

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