Three-Dimensional Adhesive Device Having a Microelectronic System Embedded Therein

• US 20080275327A1
• Filed: 03/09/2006
• Published: 11/06/2008
• Est. Priority Date: 03/09/2005
• Status: Abandoned Application

• Current Assignee: Braemar Incorporated, Coloplast A/S
• Original Assignee: Braemar Incorporated
• Inventors: Hoppe, Karsten, Faarbaek, Susanne Holm, Branebjerg, Jens, Samuelsen, Peter Boman
• Application Number:
  US11/886,032
• Publication Number:
  US 20080275327A1
• Time in Patent Office: Days
• US Class Current: 600/382
• CPC Class Codes: A61B 2560/0412 Low-profile patch shaped housings
• CPC Class Codes: A61B 2562/08 Sensors provided with means for identification, e.g. barcodes or memory chips
• CPC Class Codes: A61B 5/0002 Remote monitoring of patients using telemetry, e.g. transmission of vital signals via a communication network A61B5/07 takes precedence; transmission systems for measured values G08C; transmission H04B; transmission of digital information H04L; wireless communication networks H04W
• CPC Class Codes: A61B 5/02 Detecting, measuring or recording pulse, heart rate, blood pressure or blood flow; Combined pulse/heart-rate/blood pressure determination; Evaluating a cardiovascular condition not otherwise provided for, e.g. using combinations of techniques provided for in this group with electrocardiography or electroauscultation; Heart catheters for measuring blood pressure
• CPC Class Codes: A61B 5/024 Detecting, measuring or recording pulse rate or heart rate A61B5/0205, A61B5/021 take precedence
• CPC Class Codes: A61B 5/14532 for measuring glucose, e.g. by tissue impedance measurement
• CPC Class Codes: A61B 5/14539 for measuring pH
• CPC Class Codes: A61B 5/14542 for measuring blood gases A61B5/14551 takes precedence
• CPC Class Codes: A61B 5/14546 for measuring analytes not otherwise provided for, e.g. ions, cytochromes
• CPC Class Codes: A61B 5/259 using conductive adhesive means, e.g. gels
• CPC Class Codes: A61B 5/291 for electroencephalography [EEG]
• CPC Class Codes: A61B 5/296 for electromyography [EMG]
• CPC Class Codes: A61B 5/411 Detecting or monitoring allergy or intolerance reactions to an allergenic agent or substance
• CPC Class Codes: A61B 5/6833 Adhesive patches
• CPC Class Codes: A61B 5/68335 including release sheets or liners
• CPC Class Codes: Y10T 29/49002 Electrical device making
• CPC Class Codes: Y10T 428/14 Layer or component removable to expose adhesive

Abstract

Accordingly, the present invention relates to a three-dimensional adhesive device to be attached to the body surface of a mammal comprising a microelectronic sensing system characterized by

• (a) a three-dimensional adhesive body made of a pressure sensitive adhesive having an upper surface and a bottom surface;
• (b) a microelectronic system embedded in the body of the pressure sensitive adhesive;
• (c) one or more cover layer(s) attached to the upper surface; and
• (d) optionally a release liner releasable attached to the bottom surface of the adhesive device.

Suitably the microelectronic system is a microelectronic sensing system capable of sensing physical input such as pressure, vibration, sound, electrical activity (e.g. from muscle activity), tension, blood-flow, moisture, temperature, enzyme activity, bacteria, pH, blood sugar, conductivity, resistance, capacitance, inductance or other chemical, biochemical, biological, mechanical or electrical properties.

Claims

1. :

A three-dimensional adhesive device to be attached to the body surface of a

mammal comprising an microelectronic system characterized by

(a) a three-dimensional adhesive body made of a pressure sensitive adhesive having an upper surface and a bottom surface;

(b) a microelectronic system embedded in the body of the pressure sensitive adhesive;

(c) one or more cover layer(s) attached to the upper surface; and

(d) optionally a release liner releasable attached to the bottom surface of the adhesive device.

2. An adhesive device according to claim 1 wherein the micro electronic system is a microelectronic sensing system.

3. The adhesive device according to claim 1 wherein the three-dimensional adhesive body has an essentially planar bottom surface adapted to adhere to the body surface of a mammal and an smooth upper surface, the adhesive device being thickest at the central part of the body and thinnest at the periphery of the body.

4. The adhesive device according to claim 1 wherein the thickness of the adhesive device at the periphery is less than 50% of the thickness of the adhesive device where it is thickest, suitably the thickness at the periphery is less than 25% of the thickness of the adhesive device where it is thickest, preferred the thickness at the periphery is less than 10% of the thickness of the adhesive device where it is thickest and most preferred the thickness at the periphery is less than 5% of the thickness of the adhesive device where it is thickest.

5. The adhesive device according to claim 4 wherein the thickness at the periphery of the adhesive device is more than 0.05 mm, suitably between 0.05 and 0.4 mm and the thickness where the adhesive device is thickest, is between 0.5 and 15 mm, suitably between 1 and 5 mm.

6. The adhesive device according to claim 1 wherein the angle between the bottom surface of the adhesive device and a line drawn from any point on the circumference of the and the point at the upper surface where the adhesive body is thickest is below 60 degrees, preferably below 45 degrees and most preferably below 30 degrees.

7. The adhesive device according to claim 1 wherein the pressure sensitive adhesive making up the three-dimensional adhesive body is a mouldable thermoplastic pressure sensitive adhesive having a flexibility enabling the adhesive device to conform to the curvature of body parts while retaining its adhesive properties even under movements.

8. The adhesive device according to claim 1 wherein the pressure sensitive adhesive is an adhesive based on polymers selected from block-copolymers such as styrene-block-copolymers, and hydrogenated styrene-block-copolymers, amorphous poly-alpha-olefins (APAO), polyacrylics, polyvinylethers, polyurethanes, polyelhylenevinylacetate, silicone, or from the group of hydrogel pressure sensitive adhesives.

9. The adhesive device according to claim 8 wherein the block-copolymers such as styrene-block-copolymers, and hydrogenated styrene-block-copolymers is selected from Styrene/ethylene-Butylene/Styrene (SEBS), Styrene/Isoprene/Styrene (SIS), and Styrene/Ethylene-Propylene/Styrene (SEPS).

10. The adhesive device according to claim 8 wherein the adhesive is a PolyDiMethylSiloxane based adhesive, such as a PolyDiMethylSiloxane gel.

11. The adhesive device according to claim 1 wherein the pressure sensitive adhesive making up the adhesive body comprises hydrocolloids.

12. The adhesive device according to claim 1 wherein the pressure sensitive adhesive making up the adhesive body is a foamed adhesive.

13. The adhesive device according to claim 1 wherein the entire microelectronic system is integrated in the adhesive body and is completely covered by the adhesive body on all sides.

14. The adhesive device according to claim 1 wherein one or more components of the microelectronic system is integrated into the adhesive body and is covered by the adhesive body on all sides and the rest of the component(s) of the microelectronic system are located elsewhere in the adhesive body, the components of the microelectronic system having the necessary mechanical and electrical connection to each other.

15. The adhesive device according to claim 1 wherein the entire microelectronic system is contained in one or more recesses provided in the upper surface of the adhesive body facing the cover layer(s).

16. The adhesive device according to claim 14 wherein one or more components of the microelectronic sensing system is integrated into the adhesive body and is covered by the adhesive body on all sides and the rest of the microelectronic system is contained in one or more recesses provided in the upper surface of the adhesive body facing the cover layer(s).

17. The adhesive device according to claim 1 wherein the entire microelectronic system is contained in one or more recesses provided in the adhesive bottom surface of the adhesive body.

18. The adhesive device according to claim 14 wherein a one or more components of the microelectronic system is integrated into the adhesive body and is covered by the adhesive body at all sides and the rest of the microelectronic sensing system is contained in one or more recesses provided in the adhesive bottom surface of the adhesive body.

19. The adhesive device according to claim 1 wherein the entire microelectronic system is contained in one or more through hole(s) in the adhesive body and is accessible from both the upper surface facing the cover layer(s) and the adhesive bottom surface.

20. The adhesive device according to claim 14 wherein a one or more components of the microelectronic sensing system is integrated into the adhesive body and is covered by the adhesive body and the rest of the microelectronic system is contained in one or more through hole(s) in the adhesive body and is accessible from both the upper surface facing the cover layer and the adhesive bottom surface.

21. The adhesive device according to claim 14 wherein one or more components of the microelectronic system is integrated into the adhesive body and is covered by the adhesive body, other components of the microelectronic system is contained in one or more through holes in the adhesive body and is accessible from both the upper surface facing the cover layer and the adhesive bottom surface, and the rest of the microelectronic system is contained in one or more recesses in the upper and/or bottom surface of the adhesive body.

22. The adhesive device according to claim 1 wherein one or more components of the microelectronic system is contained in one or more through holes in the adhesive body and is accessible from both the upper surface facing the cover layer and the adhesive bottom surface and the rest of the microelectronic system is contained in one or more recesses in the upper and/or bottom surface of the adhesive body.

23. The adhesive device according to claim 1 wherein one or more components of the micro electronic system is contained in one or more recesses in the upper surface of the adhesive body and the rest of the microelectronic system is contained in one or more recesses in the bottom surface of the adhesive body.

24. The adhesive device according to claim 1 wherein the microelectronic system or one or more components thereof is encapsulated in a material different from the adhesive body.

25. The adhesive device according to claim 24 wherein the microelectronic system or components thereof is encapsulated in a polymer film, a polymer foil, or a polymer coating or the microelectronic system or components thereof is moulded into a polymer material, or is encapsulated in a glass or ceramic material.

26. The adhesive device according to claim 25 wherein the polymer used for encapsulation is silicone rubber.

27. The adhesive device according to claim 1 wherein the one or more components of the microelectronic system is accessible from outside the adhesive body, and may be replaced by a similar component during the life time of the adhesive device.

28. The adhesive device according to claim 27 wherein the component, which may be exchanged, is the energy source, e.g. the battery.

29. The adhesive device according to claim 1 wherein the one or more components of the microelectronic system is accessible from outside the adhesive device, and the component(s) may be reused.

30. The adhesive device according to claim 27 wherein the replaceable component(s) or the reusable component(s) is encapsulated and form a package, which fit a recess or a through hole in the adhesive body.

31. The adhesive device according to claim 30 wherein the package of encapsulated, replaceable or reusable component(s) is fixed into the adhesive body by a mechanical doubling, suitably snap lock mechanism.

32. The adhesive device according to claim 30 wherein the package of encapsulated, replaceable or reusable component(s) is fixed to the surface of the adhesive in the recess or through hole of the adhesive body.

33. The adhesive device according to claim 30 wherein the package of encapsulated, replaceable or reusable component(s) is fixed in a recess or through hole in the adhesive body, where said recess or trough hole is provided with an inner non-adhesive surface, such as a PDMS coating.

34. The adhesive device according to claim 1 wherein the microelectronic system comprises components selected from communication component(s), CPU, power source, storage component(s), transducer component(s), actuator component(s) and mechanical and/or electrical interconnection between the components.

35. The adhesive device according to claim 1 wherein microelectronic system is a system enabling wireless communication.

36. The adhesive device according to claim 34 wherein the transducer has a detecting element selected from electrodes (polar, bipolar), a pressure sensor, a needle with an electrode, an accelerometer, a photo detector, a microphone, ISFET, an NTC resistor, a band gab detector, an ion membrane, an enzyme detector or a condenser.

37. The adhesive device according to claim 36 wherein the transducer has a non-invasive detecting element, such as electrodes, e.g. steel electrodes.

38. The adhesive device according to claim 36 wherein the transducer has an

invasive detecting element, such as a needle containing an electrode.

39. The adhesive device according to claim 34 where there is no physical contact between the detector and the skin of the mammal.

40. The adhesive device according to claim 34 wherein the microelectronic system comprises a Network HUB, a gateway or a coordinator system.

41. The adhesive device according to claim 34 wherein the microelectronic system includes a GPS.

42. The adhesive device according to claim 34 wherein the microelectronic system includes a RFID tag.

43. The adhesive device according to claim 40 wherein the microelectronic system is a gateway comprising storage and communication components, CPU and a battery encapsulated in plastic and working as a dedicated network coordinator for transmission of data to a central unit (CU).

44. The adhesive device according to claim 41 wherein the microelectronic system is a system selected from:

a system comprising storage and communication components, CPU, battery, GPS,

components for wireless synchronisation of real time clock for data logging of GPS data

optionally encapsulated in plastic, and

a system comprising storage and communication components, CPU, battery, GPS,

components for wireless synchronisation of real time clock for data logging of GPS data,

mobile net for data logging and transmission of data and position to mobile phones,

optionally encapsulated in plastic,

45. The adhesive device according to claim 34 wherein the microelectronic system is useful for nerve stimulation and comprises storage and communication components, CPU, power source and transducer for transmitting data and power to an implant for nerve stimulation.

46. The adhesive device according to claim 34 wherein the microelectronic system is a system useful for electromyography and comprises a transducer, CPU, power source, communication and storage components and an optionally an actuator.

47. The adhesive device according to claim 1, wherein the device comprises a power source element for powering said microelectronic system, wherein

the adhesive body is releasable attached to one or more of the components of the microelectronic system,

the adhesive body has at least a first area for adhering to the body surface, and

48. The adhesive device according to claim 47, wherein the power source element is attached to the adhesive body and the adhesive body has at least a second area for adhering to one or more of the components of the microelectronic system.

49. The adhesive device according to claim 48, wherein a first peel force between the second area and the microelectronic circuit is smaller than a second peel force between the power source and the adhesive body.

50. The adhesive device according to claim 47, wherein the power source element is at least partly contained in the adhesive body.

51. The adhesive device according to claim 47, wherein the adhesive device is adapted to be releasable connectable to a housing containing the microelectronic system and that the housing is formed of a proximal housing part and a distal housing part.

52. The adhesive device according to claim 51, wherein the at least one power source is adapted to be received in a recess, the recess is formed in the distal housing part and that at least one electrical contact is provided in the distal housing providing electrical connection between the power source and the microelectronic circuit.

58. A multi-sensor network comprising one or more adhesive devices according to claim 1.

59. A multi-sensor network according to claim 58 comprising an adhesive device comprising a network coordinator, at least two adhesive devices comprising a microelectronic system useful for electromyography and comprises a transducer, CPU, power source, communication and storage components and an optionally an actuator and adhesive devices comprising a microelectronic system useful for suitable for measuring heart rate.

60. A method for producing an adhesive device according to claim 1 having embedded a microelectronic system in an adhesive, said device having a cover film and a release liner characterised by the adhesive body being compression moulded.

61. A method for producing an adhesive device according to claim 1 having embedded a microelectronic system in an adhesive, said device having a cover film and a release liner characterised by the adhesive body being injection moulded.

62. A method for producing an adhesive device according to claim 1 having embedded a microelectronic system in an adhesive, said device having a cover film and a release liner characterised by the adhesive body being formed by reaction moulding.

63. An adhesive device according to claim 1 having embedded a microelectronic system in the adhesive body and being connected to other electronic systems by wiring.

53. A sensor assembly adapted to be attached to the body surface of a mammal, comprising

a sensor circuit, comprising a number of electrical components,

a device comprising at least one power source for powering at least one of the electrical components and at least one adhesive for attaching the sensor assembly to the body surface of a mammal, and

that the device is adapted to be releasable connected to sensor circuit.

54. A sensor assembly according to claim 53, wherein the sensor circuit is at least partly contained in a housing and that the housing is formed of a proximal housing part and a distal housing part.

55. A sensor assembly according to claim 54, wherein a first peel force between the adhesive and the housing is smaller than a second peel force between the adhesive and the battery.

56. A sensor assembly according to claim 54, wherein the at least one transducer is attached to the proximal surface of the proximal part.

57. A sensor assembly according to claim 54, wherein

a recess is formed in the distal housing part, the recess is adapted to receive the at least one power source, and

at least one electrical contact is provided in the distal housing providing electrical connection between the at least one power source and the electrical components.

64. The use of a device comprising an adhesive element and a power source element, and where the device is used for attaching an electronic circuit to a surface and to power said electronic circuit, wherein said electronic circuit is releasable connectable to the adhesive element and the power source element.