Ic Holder
First Claim
1. An integrated circuit (IC) holder comprising:
- a case into which an IC package is inserted;
a fastening unit for fastening the case to a printed circuit board (PCB);
a heat-dissipation unit for transferring heat from the IC package to the case; and
a guide panel allowing the external connection terminal of the IC package to precisely contact an electric pattern of the PCB by guiding an outer surface of the IC package.
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Accused Products
Abstract
Provided is an integrated circuit (IC) holder that includes: a case into which an IC package is inserted; a fastening unit for fastening the case to a printed circuit board (PCB); and a heat-dissipation unit for transferring heat generated from the IC package to the case, so that the IC holder is not in contact with the PCB or designed to avoid devices or circuits adjacent to the IC package even though it is contact with the PCB, thereby reducing an unnecessary area not used for layout of the PCB and providing a layout structure similar to that using only the IC package. Further, the IC holder can have a solderless structure to make the devices be readily replaced, solve an environment problem, and be easily applied to various kinds of the IC packages.
11 Citations
23 Claims
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1. An integrated circuit (IC) holder comprising:
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a case into which an IC package is inserted; a fastening unit for fastening the case to a printed circuit board (PCB); a heat-dissipation unit for transferring heat from the IC package to the case; and a guide panel allowing the external connection terminal of the IC package to precisely contact an electric pattern of the PCB by guiding an outer surface of the IC package. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. An IC holder comprising:
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four case bodies for fastening a corner of an IC package; a first fastening unit for fastening the case bodies to a PCB; a case cover placed on the case bodies and pressing the IC package to make an external connection terminal of the IC package contact an electric pattern of the PCB; a heat-dissipation unit for transferring heat from the IC package to the case cover; and a second fastening unit for fastening the case cover to the case bodies. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21, 22, 23)
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Specification