SEMICONDUCTOR DEVICE

  • US 20080296782A1
  • Filed: 06/04/2007
  • Published: 12/04/2008
  • Est. Priority Date: 06/04/2007
  • Status: Active Grant
First Claim
Patent Images

1. A device comprising:

  • a carrier;

    an electrically insulating layer applied onto the carrier;

    an adhesive layer applied to the electrically insulating layer; and

    a first semiconductor chip applied to the adhesive layer.

View all claims
    ×
    ×

    Thank you for your feedback

    ×
    ×