ENHANCED VOID BOARD

• US 20080311334A1
• Filed: 06/12/2007
• Published: 12/18/2008
• Est. Priority Date: 06/12/2007
• Status: Abandoned Application

• Current Assignee: Illinois Tool Works Inc.
• Original Assignee: Illinois Tool Works Inc.
• Inventors: Kruelle, John, Duke, David, Brister, Antonio W
• Application Number:
  US11/761,609
• Publication Number:
  US 20080311334A1
• Time in Patent Office: Days
• US Class Current: 428/43
• CPC Class Codes: B65B 27/02 Bundling bricks or other building blocks
• CPC Class Codes: B65D 2571/00104 Forms or jigs for use in making the load
• CPC Class Codes: B65D 2571/00117 with protecting or supporting elements arranged between binder and articles or materials, e.g. for preventing chafing of binder
• CPC Class Codes: B65D 71/0088 Palletisable loads, i.e. loads intended to be transported by means of a fork-lift truck
• CPC Class Codes: Y10T 428/15 Sheet, web, or layer weakened to permit separation through thickness
• CPC Class Codes: Y10T 428/24306 Diamond or hexagonal

Abstract

An enhanced polymeric void board for placement between adjacent horizontal layers of masonry materials to maintain an opening in a lower of the layers, the enhanced void board comprising a relatively thin planar element having a plurality of ribs extending along the length of the planar element and a plurality of holes through the planar element.

Claims

1. An enhanced polymeric void board for placement between adjacent horizontal layers of bricks to maintain an opening in a lower of the layers, the enhanced void board comprising:

a relatively thin planar element having a plurality of ribs extending along the length of the planar element; and

a plurality of holes through the planar element.

2. The enhanced polymeric void board in accordance with claim 1 wherein the planar element is extruded from a die.

3. The enhanced polymeric void board in accordance with claim 1 wherein the planar element is formed from a thermoplastic material.

4. The enhanced polymeric void board in accordance with claim 1 wherein the planar element is formed from a thermoplastic-blend material.

5. The enhanced polymeric void board in accordance with claim 1 wherein the planar element is formed from a filled polymer.

6. The enhanced polymeric void board in accordance with claim 1 including weakened regions formed in the planar element so as to provide a plurality of frangible regions for separating a portion of the planar element from a remaining portion of the planar element.

7. The enhanced polymeric void board in accordance with claim 1 wherein the ribs of the planar element provide a stiffness to the planar element.

8. The enhanced polymeric void board in accordance with claim 1 wherein the ribs are formed by embossing the surface of the planar element.

9. The enhanced polymeric void board in accordance with claim 8 wherein the ribs of the planar element are parallel.

10. The enhanced polymeric void board in accordance with claim 9 wherein an on-center distance between the ribs is about 2.500 inches.

11. The enhanced polymeric void board in accordance with claim 9 wherein spaces are defined between adjacent ribs of the planar element, and wherein the spaces contain holes.

12. The enhanced polymeric void board of claim 8 wherein the ribs of the planar element are cross-hatched, defining diamond-shaped spaces.

13. The enhanced polymeric void board in accordance with claim 9 wherein the diamond-shaped spaces contain holes.

14. The enhanced polymeric void board in accordance with claim 13 wherein the holes are positioned a distance about 3.000 inches on-center.