RADIO FREQUENCY IDENTIFICATION (RFID) TAG LAMINATION PROCESS USING LINER
First Claim
Patent Images
1. A method of constructing an RFID unit comprising:
- attaching an integrated circuit chip to a substrate with an antenna unit using an electrically conductive adhesive; and
laminating a protective layer over at least part of the integrated circuit chip while the electrically conductive adhesive has not yet fully set.
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Abstract
A method of constructing an RFID unit can include using a protective layer to hold an integrated circuit chip module to a substrate layer with an antenna unit while a conductive adhesive has not yet fully set.
32 Citations
17 Claims
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1. A method of constructing an RFID unit comprising:
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attaching an integrated circuit chip to a substrate with an antenna unit using an electrically conductive adhesive; and laminating a protective layer over at least part of the integrated circuit chip while the electrically conductive adhesive has not yet fully set. - View Dependent Claims (2, 3, 4, 5, 6, 7, 9, 10)
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8. The method of claim 8, wherein the electrically conductive adhesive is solder paste.
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11. An apparatus to construct an RFID device comprising:
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a unit to attach an integrated circuit chip to a substrate with an antenna using an electrically conductive adhesive; and a unit to laminate a protective layer over at least part of the integrated circuit chip while the electrically conductive adhesive has not yet fully set.
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- 12. The apparatus of claim 12, wherein the integrated circuit chip is part of a chip module.
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17. A method of constructing an flexible circuit comprising:
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attaching an integrated circuit chip to a substrate with an circuit traces using an electrically conductive adhesive; and
;laminating a protective layer over at least part of the integrated circuit chip while the adhesive has not yet fully set.
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Specification