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RADIO FREQUENCY IDENTIFICATION (RFID) TAG LAMINATION PROCESS USING LINER

  • US 20080311704A1
  • Filed: 08/06/2008
  • Published: 12/18/2008
  • Est. Priority Date: 03/14/2005
  • Status: Active Grant
First Claim
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1. A method of constructing an RFID unit comprising:

  • attaching an integrated circuit chip to a substrate with an antenna unit using an electrically conductive adhesive; and

    laminating a protective layer over at least part of the integrated circuit chip while the electrically conductive adhesive has not yet fully set.

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