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TECHNIQUE FOR EVALUATING A FABRICATION OF A DIE AND WAFER

  • US 20080315196A1
  • Filed: 08/21/2008
  • Published: 12/25/2008
  • Est. Priority Date: 08/25/2003
  • Status: Active Grant
First Claim
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1. A test structure for evaluating a fabrication of a wafer, the test structure comprising:

  • a combination of device and interconnect elements that are provided on an active region of a die on the wafer prior to the fabrication of the wafer being completed, wherein the combination can be activated to cause electrical activity that is detectable without affecting a usability of the die or wafer andwherein the combination of device and interconnect elements is configured so that the electrical activity (i) emphasizes a first fabrication step in the fabrication sequence over another step in the fabrication sequence, and (ii) indicates a value or variation of an attribute or result, of the first fabrication step on at least a segment of the die.

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