METHODS AND APPARATUS FOR EMI SHIELDING IN MULTI-CHIP MODULES

• US 20080315371A1
• Filed: 06/19/2007
• Published: 12/25/2008
• Est. Priority Date: 06/19/2007
• Status: Active Grant

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Freescale Semiconductor, Inc. (NXP Semiconductors NV)
• Inventors: Lin, Jong-Kai, Tang, Jinbang
• Granted Patent: US 7,648,858 B2
• Time in Patent Office: Days
• US Class Current: 257/659
• CPC Class Codes: H01L 23/29 characterised by the material , e.g. carbon interlayer dielectrics H01L23/5329
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/165 Containers
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H05K 1/0218 by printed shielding conductors, ground planes or power plane H05K1/0236 takes precedence
• CPC Class Codes: H05K 1/185 Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit semiconductor chips encapsulated by interconnect and support structures H01L23/5389, H01L24/00
• CPC Class Codes: H05K 2201/0215 Metallic fillers
• CPC Class Codes: H05K 2203/1316 Moulded encapsulation of mounted components
• CPC Class Codes: H05K 3/4644 by building the multilayer layer by layer, i.e. build-up multilayer circuits making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602
• CPC Class Codes: H05K 9/0047 being rigid plastic containers having conductive particles, fibres or mesh embedded therein

Abstract

Methods and structures provide a shielded multi-layer package for use with multi-chip modules and the like. A substrate (102) (e.g., chip carrier) has an adhesive layer (104), where electronic components (106, 108) are attached. An insulating layer (110) is formed over the plurality of electronic components, and a conductive encapsulant structure (115) is formed over the insulating layer. The adhesive layer is detached from the electronic components, and multi-layer circuitry (140) is formed over, and in electrical communication with, the plurality of electronic components. A shielding via (150) is formed through the multilayer circuitry such that it contacts the conductive encapsulant.

Claims

1. A method of manufacturing a multi-layer package structure, comprising:

providing a substrate having an adhesive layer thereon;

attaching a plurality of electronic components to the adhesive layer;

forming an insulating layer over the plurality of electronic components;

forming a conductive encapsulant structure over the insulating layer;

detaching the adhesive layer from the electronic components;

forming multi-layer circuitry over, and in electrical communication with, the plurality of electronic components; and

forming a shielding via through the multilayer circuitry such that it contacts the conductive encapsulant.

2. The method of claim 1, further including forming a local insulating layer on the adhesive layer prior to forming the conductive encapsulant.

3. The method of claim 1, further including reducing the thickness of the conductive encapsulant layer.

4. The method of claim 1, further including the step of forming a top shielding layer on the conductive encapsulant structure.

5. The method of claim 1, wherein the conductive encapsulant comprises conductive plastic mold compound.

6. The method of claim 1, wherein forming the insulating layer includes depositing a polymer layer.

7. The method of claim 1, wherein forming the multilayer circuitry includes forming at least one signal via for transmitting signals between the plurality of components.

11. The method of claim 1, wherein the conductive encapsulant comprises a conductive plastic mold compound.

12. The method of claim 1, wherein forming the insulating layer includes depositing a polymer layer.

8. A shielded multi-layer package structure comprising:

a conductive encapsulant structure;

a plurality of electronic components embedded within the conductive encapsulant structure, wherein an insulating layer is provided between the conductive encapsulant structure and the electronic components;

multi-layer circuitry provided on and in electrical communication with the plurality of electronic components; and

at least one shielding via extending through the multilayer circuitry such that it contacts the conductive encapsulant.

9. The package structure of claim 8, further including a local insulating cover layer between at least one of the plurality of electronic components and the conductive encapsulant.

10. The package structure of claim 8, further including a top shielding layer provided on the conductive encapsulant structure.

13. A method of shielding a plurality of electronic components from electromagnetic interference (EMI), comprising:

embedding the plurality of electronic components within a conductive encapsulant structure such that insulating layer is provided between the conductive encapsulant structure and the electronic components; and

forming at least one shielding via in electrical contact with the conductive encapsulant.

14. The method of claim 13, further including forming multi-layer circuitry in electrical communication with the plurality of electronic components.

15. The method of claim 14, further including forming a local insulating layer between at least one of the plurality of electronic components and the conductive encapsulant.

16. The method of claim 15, wherein forming the local shielding layer includes forming a layer of epoxy or ceramic.

17. The method of claim 13, further including a top shielding layer provided on the conductive encapsulant structure.

18. The method of claim 13, wherein the conductive encapsulant comprises a material selected from the group consisting of aluminum, copper, nickel iron, tin, and zinc.

19. The method of claim 13, wherein the insulating layer is provided by depositing a polymer layer.

20. The method of claim 18, wherein depositing the polymer layer includes depositing a polyimide layer.