Semiconductor Light Emitting Device, Illumination Module, Illumination Apparatus, Method For Manufacturing Semiconductor Light Emitting Device, and Method For Manufacturing Semiconductor Light Emitting Element
First Claim
1. A semiconductor light emitting device comprising:
- a base substrate; and
three light emitting elements each including a semiconductor multilayer structure with a light emission layer, and having a rhombus shape with interior angles of approximately 60° and
approximately 120°
in plan view, whereinthe three light emitting elements are arranged on one main surface of the base substrate so as to together form a substantially regular hexagonal shape in plan view.
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Accused Products
Abstract
A semiconductor light emitting device (10) is provided with a base substrate (12) and three LED chips (14A, 14B, and 14C) disposed on the base substrate (12). Each LED chip (14A, 14B, and 14C) includes a semiconductor multilayer structure (20) and has a rhombus shape with interior angles of approximately 60 and approximately 120 in plan view. Each semiconductor multilayer structure (20) has an HCP single crystal structure and includes a light emission layer (24). The LED chips (14A, 14B, and 14C) are arranged on the base substrate (12) so as to face one another at a vertex forming the larger interior angle in plan view. With this arrangement, the LED chips (14A, 14B, and 14C) as a whole form a substantially regular hexagonal shape.
123 Citations
17 Claims
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1. A semiconductor light emitting device comprising:
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a base substrate; and three light emitting elements each including a semiconductor multilayer structure with a light emission layer, and having a rhombus shape with interior angles of approximately 60° and
approximately 120°
in plan view, whereinthe three light emitting elements are arranged on one main surface of the base substrate so as to together form a substantially regular hexagonal shape in plan view. - View Dependent Claims (2, 3, 7, 8)
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4. A semiconductor light emitting device comprising:
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a base substrate; and six light emitting elements each including a semiconductor multilayer structure with a light emission layer, and having a substantially regular triangular shape in plan view, wherein the six light emitting elements are arranged on one main surface of the base substrate so as to together form a substantially regular hexagonal shape in plan view. - View Dependent Claims (5, 6, 9, 10)
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11. A manufacturing method for a semiconductor light emitting device, comprising:
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a growing step of growing a semiconductor multilayer structure that includes a light emission layer, on one main surface of a substrate of which crystal structure is a hexagonal closest-packed single crystal structure having a (0001) plane; a partitioning step of forming guide grooves in [1-210], [2-1-10], and [11-20] orientations in at least one of two main surfaces of the substrate so as to partition said at least one main surface, except along a periphery thereof, into a plurality of areas of a uniform shape; a cleaving step of cleaving the substrate into a plurality of separate chips along the guide grooves; and a combining step of arranging two or more of the chips so as to together form a substantially regular hexagonal shape in plan view. - View Dependent Claims (12, 13, 14)
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15. A manufacturing method for a semiconductor light emitting device comprising:
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a growing step of growing a semiconductor multilayer structure that includes a light emission layer, on one main surface of a substrate of which crystal structure is a hexagonal closest-packed single crystal structure having a (0001) plane; a partitioning step of forming guide grooves in [1-210], [2-1-10], and [11-20] orientations in at least one of two main surfaces of the substrate so as to partition said at least one main surface, except along a periphery thereof, into a honeycomb pattern with a plurality of substantially regular hexagonal areas; and a cleaving step of cleaving the substrate into a plurality of separate chips along the guide grooves. - View Dependent Claims (16, 17)
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Specification