LED FLAT-PLATE TYPE MULTI-CHIP HIGH POWER LIGHT SOURCE

• US 20090010009A1
• Filed: 03/06/2008
• Published: 01/08/2009
• Est. Priority Date: 07/06/2007
• Status: Active Grant

• Current Assignee: Shenzhen Haiman Optoelectronic Company Limited
• Original Assignee: Shenzhen Haiman Optoelectronic Company Limited
• Inventors: Xu, Zheng, Yang, Xianghong, Chang, Baoyan
• Granted Patent: US 7,686,479 B2
• Time in Patent Office: Days
• US Class Current: 362/373
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21V 29/505 of reflectors
• CPC Class Codes: F21V 29/70 characterised by passive heat-dissipating elements, e.g. heat-sinks
• CPC Class Codes: F21Y 2105/10 comprising a two-dimensional array of point-like light-generating elements
• CPC Class Codes: F21Y 2105/12 characterised by the geometrical disposition of the light-generating elements, e.g. arranging light-generating elements in differing patterns or densities

Abstract

The present invention provides a LED flat-plate type multi-chip high power light source comprising a heat dissipating substrate, a reflecting cover mounted on the heat dissipating substrate, LEDs mounted on the heat dissipating substrate and in the reflecting cover, a circuit board embedded in the heat dissipating substrate connecting to the LEDs, and the circuit board also connecting to a socket set in the heat dissipating substrate. The heat dissipating substrate is made of high heat conduction metal. In the present invention, the heat dissipating substrate is made of high heat conduction metal, and the heat conducting pole is abolished. Comparing with the conventional art, the present invention decreases the heat dissipating path, increases the sectional area, and eliminates the intermediate link of high thermal resistance.

Claims

1. A LED flat-plate type multi-chip high power light source comprising a heat dissipating substrate, a reflecting cover mounted on the heat dissipating substrate, LEDs mounted on the heat dissipating substrate and in the reflecting cover, a circuit board embedded in the said heat dissipating substrate connecting to the LEDs, and the circuit board also connecting to a socket set in the heat dissipating substrate.

2. The LED flat-plate type multi-chip high power light source of claim 1, wherein the said circuit board has a circle shape;

on the said heat dissipating substrate, a circle shape groove matching the shape of the circuit board is provided;

on the heat dissipating substrate, a jamming groove opened from the side wall of the heat dissipating substrate to the circle shape groove is provided;

the said socket is fixed into the said jamming groove.

3. The LED flat-plate type multi-chip high power light source of claim 2, wherein the said reflecting cover has a circle shape, and the internal wall of the reflecting cover is an arc shape bevel, at its bottom provided with an inner groove;

the said reflecting cover is also provided with a gap matching the shape of the said socket and corresponding to the said jamming groove;

the said circle shape groove is on the said heat dissipating substrate under the said inner groove.

4. The LED flat-plate type multi-chip high power light source of claim 3, wherein the said heat dissipating substrate is provided with a number of LED groups, and each LED group is formed by LEDs being arranged in a “

V”

shape;

every LED group is arranged in a circle in turn;

the LEDs of each group are connected to each other in series and then connected to the circuit board.

5. The LED flat-plate type multi-chip high power light source of claim 4, wherein the said heat dissipating substrate is provided with a number of LED groups, and each LED group is formed by LEDs being arranged in a line;

every LED group is arranged in an array in turn;

the LEDs of each group are connected to each other in series and then connected to the circuit board.

6. The LED flat-plate type multi-chip high power light source of claim 1, wherein the said heat dissipating substrate is made of high heat conduction metal.