Temperature probes having a thermally isolated tip

• US 20090022205A1
• Filed: 07/19/2007
• Published: 01/22/2009
• Est. Priority Date: 07/19/2007
• Status: Active Grant

• Current Assignee: Lam Research Corporation
• Original Assignee: Lam Research Corporation
• Inventors: Comendant, Keith
• Granted Patent: US 7,651,269 B2
• Time in Patent Office: Days
• US Class Current: 374/161
• CPC Class Codes: G01K 1/143 for measuring surface temperatures
• CPC Class Codes: G01K 1/16 Special arrangements for conducting heat from the object to the sensitive element

Abstract

Temperature probes for measuring the temperature of objects are disclosed. The temperature probes include a housing and a tip in thermal contact with an end of the housing. The tip is adapted to contact a surface of the object whose temperature is to be measured by the temperature probe. A portion of the housing in contact with the tip has a high thermal resistance effective to thermally isolate the tip from an adjacent portion of the housing. A sensor is located inside of the housing and adapted to measure the temperature of the tip.

Claims

1. A temperature probe for measuring the temperature of an object, comprising:

a housing comprising first and second portions comprised of the same material, and a bore including a first section extending through the first portion and a second section extending through the second portion, the second portion of the housing comprising a first end adjacent the first portion, a second end, a wall including an outer surface and an inner surface defining the second section, and at least one opening extending through the wall;

a tip mounted to the second end of the second portion, with the tip adapted to contact a surface of the object whose temperature is to be measured; and

a sensor located in the bore and adapted to measure a temperature of the tip;

wherein the second portion has a thermal resistance effective to thermally isolate the tip from the first portion.

2. The temperature probe of claim 1, wherein the sensor is in physical contact with the tip.

3. The temperature probe of claim 1, wherein:

a luminescent material is provided on the tip; and

the sensor comprises an optical waveguide located in the bore of the housing, the optical waveguide including an end spaced from and facing the luminescent material, the optical waveguide adapted to transmit light emitted by the luminescent material.

4. The temperature probe of claim 3, wherein:

the luminescent material is a phosphor;

a light source is arranged to emit light into the optical waveguide to irradiate the phosphor and cause the phosphor to emit light; and

a light processing system is arranged to process the light emitted by the phosphor and transmitted by the optical waveguide to determine a temperature of the phosphor which corresponds to a temperature of the tip.

5. The temperature probe of claim 3, wherein:

the luminescent material is a blackbody material; and

a light processing system is arranged to process the light emitted by the blackbody material and transmitted by the optical waveguide to determine a temperature of the blackbody material which corresponds to a temperature of the tip.

6. The temperature probe of claim 1, wherein:

the second portion of the housing has a length from the first end to the second end;

the at least one opening is configured such that heat is conducted between the first end and second end in a turning pattern having a length exceeding the length of the second portion, and each opening has a width of about 0.1 mm to about 0.5 mm;

the material of the second portion defining the respective one or more openings has a width of about 0.3 mm to about 2.5 mm;

the wall of the second portion has a thickness of about 0.5 mm to about 2 mm; and

the second portion of the housing resiliently biases the tip.

7. The temperature probe of claim 1;

wherein the entire housing is comprised of a polymeric material.

8. The temperature probe of claim 1, wherein the entire housing is comprised of a metal.

9. The temperature probe of claim 1, wherein:

the first section of the bore has a first diameter;

the second section of the bore has a second diameter larger than the first diameter; and

the first portion of the housing includes a base with external threads.

10. A substrate support for supporting a semiconductor substrate in a plasma processing chamber, the substrate support comprising:

a metallic base including a bore;

a heater layer on the base;

a target layer on the heater layer, the target layer including a first surface adapted to support the semiconductor substrate and a second surface; and

a temperature probe according to claim 1 located in the bore of the base with the tip in contact with the second surface of the target layer, the temperature probe adapted to determine the temperature of the target layer.

11. The substrate support of claim 10, wherein the sensor is in physical contact with the tip.

12. The substrate support of claim 10, wherein:

a luminescent material is provided on the tip;

the sensor comprises an optical waveguide located in the bore of the housing, the optical waveguide includes an end spaced from and facing the luminescent material, the optical waveguide adapted to transmit light emitted by the luminescent material;

a light source is arranged to emit light which is transmitted by the optical waveguide and irradiates the luminescent material to cause the luminescent material to emit light which is transmitted by the optical waveguide; and

a light processing system is arranged to process the light emitted by the luminescent material and transmitted by the optical waveguide to determine a temperature of the luminescent material which corresponds to a temperature of the tip.

13. The substrate support of claim 10, wherein:

the entire housing is comprised of a polymeric material;

the wall of the second portion has a thickness of about 0.5 mm to about 2 mm;

the at least one opening is configured such that heat is conducted between the first end and second end of the second portion in a turning pattern having a length exceeding the length of the second portion, and each opening has a width of about 0.1 mm to about 0.5 mm;

the material of the second portion defining the respective one or more openings has a width of about 0.3 mm to about 2.5 mm; and

the second portion of the housing resiliently biases the tip against the second surface of the target layer in a self-aligning manner.

14. The substrate support of claim 10, wherein:

the base is adapted to be in fluid communication with a source of temperature controlled liquid for controlling the temperature of the base;

the first portion of the housing includes a base with external threads; and

the base includes internal threads which engage the external threads of the base of the housing.

15. A temperature probe for measuring the temperature of an object, comprising:

a housing comprising a first portion, a second portion, and a bore including a first section extending through the first portion and a second section extending through the second portion, the entire housing being comprised of the same material, the first section of the bore having a larger diameter than the second section, the second portion of the housing comprising a first end adjacent the first portion, a second end, a wall including an outer surface and an inner surface defining the second section, and at least one opening extending through the wall and configured such that heat is conducted between the first and second ends of the second portion in a turning pattern having a length exceeding the length of the second portion;

a tip mounted to the second end of the second portion, the tip adapted to contact a surface of the object whose temperature is to be measured; and

a sensor located in the bore and adapted to measure a temperature of the tip;

wherein the second portion (i) has a thermal resistance effective to thermally isolate the tip from the first portion and (ii) resiliently biases the tip.

16. The temperature probe of claim 15, wherein the sensor is in physical contact with the tip.

17. The temperature probe of claim 15, wherein:

a luminescent material is provided on the tip;

the sensor comprises an optical waveguide located in the bore of the housing, the optical waveguide including an end spaced from and facing the luminescent material, the optical waveguide adapted to transmit light emitted by the luminescent material;

a light source is arranged to emit light into the optical waveguide to irradiate the luminescent material and cause the luminescent material to emit light; and

a light processing system is arranged to process light emitted by the luminescent material and transmitted by the optical waveguide to determine a temperature of the luminescent material which corresponds to the temperature of the tip.

18. The temperature probe of claim 15, wherein:

the second portion of the housing has a length from the first end to the second end;

each opening has a width of about 0.1 mm to about 0.5 mm;

the material of the second portion defining the respective one or more openings has a width of about 0.3 mm to about 2.5 mm; and

the wall of the second portion of the housing has a thickness of about 0.5 mm to about 2 mm.

19. A substrate support for supporting a semiconductor substrate in a plasma processing chamber, the substrate support comprising:

a base including a bore;

a heater layer on the base;

a target layer on the heater layer, the target layer including a first surface adapted to support the semiconductor substrate and a second surface; and

a temperature probe according to claim 15 located in the bore of the base with the tip in contact with the second surface of the target layer, the temperature probe adapted to determine the temperature of the target layer.

20. A temperature probe for measuring the temperature of an object, comprising:

a one-piece housing comprising first and second portions and a longitudinal bore extending through the first portion and the second portion, the second portion of the housing comprising a first end adjacent the first portion, a second end, a wall including an outer surface and an inner surface defining a portion of the longitudinal bore, and at least one opening extending through the wall and configured such that heat is conducted between the first and second ends of the second portion in a turning pattern having a length exceeding the length of the second portion;

a tip mounted to the second end of the second portion, with the tip adapted to contact a surface of the object whose temperature is to be measured, wherein the second portion is effective to resiliently bias the tip against the surface; and

a sensor located in the bore and adapted to measure a temperature of the tip.