METHOD AND DEVICE FOR PACKAGING A SUBSTRATE
First Claim
Patent Images
1. A display device, comprising:
- a transparent substrate;
an interferometric modulator configured to modulate light transmitted light said transparent substrate; and
a thin film backplane disposed on said modulator and sealing said modulator within a package between said transparent substrate and said thin film backplane.
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Abstract
A package structure and method of packaging for an interferometric modulator. A thin film material is deposited over an interferometric modulator and transparent substrate to encapsulate the interferometric modulator. A gap or cavity between the interferometric modulator and the thin film provides a space in which mechanical parts of the interferometric modulator may move. The gap is created by removal of a sacrificial layer that is deposited over the interferometric modulator.
30 Citations
1 Claim
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1. A display device, comprising:
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a transparent substrate; an interferometric modulator configured to modulate light transmitted light said transparent substrate; and a thin film backplane disposed on said modulator and sealing said modulator within a package between said transparent substrate and said thin film backplane.
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Specification