Method of Producing a Thin Semiconductor Chip

  • US 20090098684A1
  • Filed: 10/07/2008
  • Published: 04/16/2009
  • Est. Priority Date: 04/21/2006
  • Status: Active Grant
First Claim
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1. A method of fabricating a semiconductor chip, the method comprising:

  • providing an adhesive layer on the outer area of an active surface of a device wafer;

    bonding a rigid body to the active surface of the device wafer by the adhesive layer;

    thinning the device wafer by treating a passive surface of the device wafer that is opposite to the active surface;

    bonding a first backing tape to the passive surface of the device wafer;

    separating an outer portion of the rigid body from a central portion of the rigid body and separating an outer portion of the device wafer from a central portion of the device wafer;

    removing the central portion of the rigid body from the first backing tape;

    removing the outer portion of the device wafer and the outer portion of the rigid body from the first backing tape; and

    dicing the device wafer into semiconductor chips.

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