Light Source Module

• US 20090103005A1
• Filed: 10/21/2008
• Published: 04/23/2009
• Est. Priority Date: 10/23/2007
• Status: Active Grant

• Current Assignee: Maxell, Ltd.
• Original Assignee: Hitachi Consumer Electronics Company Limited (Hitachi, Ltd.)
• Inventors: Hatakeyama, Atsushi, Oyama, Hiroshi, Yotsumoto, Naoki, Maruyama, Takaaki, Akai, Hiroshi, NAKAZATO, Norio, Tanabe, Kouichi, Sasaki, Shigeyuki, SUDO, Kimihiko
• Granted Patent: US 8,547,502 B2
• Time in Patent Office: Days
• US Class Current: 349/62
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48471 the other connecting portion not on the bonding area being a ball bond, i.e. wedge-to-ball, reverse stitch
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/92247 the second connecting process involving a wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/483 Containers
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/60 Reflective elements

Abstract

It is to provide a light source module capable of downsizing an edge-light type backlight in thickness and reducing the usage amount of resin. A method of manufacturing a light source module includes a process of preparing a substrate with a first reflector including a reflecting surface mounted thereon, a process of mounting a plurality of light emitting elements on the substrate, a process of mounting a wiring board having an electrode on the substrate, a process of connecting the electrode of the light emitting element and the electrode of the wiring board with metal wire, a process of mounting a second reflector having a reflecting surface on the wiring board, and a process of filling the space between the first reflector and the second reflector, with resin.

Claims

1. A method of manufacturing a light source module, comprising:

a first process of preparing a substrate with a first reflector including a reflecting surface mounted thereon;

a second process of mounting a plurality of light emitting elements on the substrate so that each of the light emitting elements is put near the reflecting surface of the first reflector to reflect light from the light emitting element on the reflecting surface;

a third process of mounting a wiring board including an electrode, on the substrate so that the electrode of the wiring board approaches to the light emitting element and that the light emitting element is sandwiched between the first reflector and the wiring board;

a fourth process of connecting the electrode of the light emitting element and the electrode of the wiring board with metal wire;

a fifth process of mounting a second reflector including a reflecting surface, on the wiring board so that the light from the light emitting element is reflected on the reflecting surface of the second reflector and that the light emitting element is sandwiched between the first reflector and the second reflector; and

a sixth process of filling a space between the first reflector and the second reflector, with resin, to seal the light emitting element.

2. The method of manufacturing a light source module, according to claim 1, wherein

in the second process, the light emitting element is mounted on the substrate while being attached to a submount, and a space between the first reflector and the light emitting element is more than a thickness of the light emitting element.

3. The method of manufacturing a light source module, according to claim 1, in which

a space between the submount mounted on the substrate and the wiring board is 50 micron meters or more, or double or more of a diameter of the metal wire.

4. The method of manufacturing a light source module, according to claim 1, in which

the size of the electrode on the wiring board in a wire extending direction is four times or more than the diameter of the metal wire.

5. The method of manufacturing a light source module, according to claim 1, in which

the substrate is formed of a high heat conductive material.

6. The method of manufacturing a light source module, according to claim 1, in which

the first reflector is formed of a high heat conductive material.

7. The method of manufacturing a light source module, according to claim 1, in which

at least one of the reflecting surface of the first reflector and the reflecting surface of the second reflector is inclined with respect to the substrate.

8. The method of manufacturing a light source module, according to claim 1, in which

a recess for housing the wiring board is formed in the substrate.

9. A light source module semiconductor light emitting device having a substrate, a first reflector including a reflecting surface, which is provided on the substrate, a light emitting element attached to the substrate, a wiring board provided on the substrate, a second reflector provided on the wiring board, and a resin for sealing the light emitting element sandwiched between the reflecting surface of the first reflector and the reflecting surface of the second reflector, wherein

the light emitting element is mounted on the substrate while being attached to a submount, and a space between the first reflector and the light emitting element is more than a thickness of the light emitting element.

10. The light source module, according to claim 9, in which a space between the submount mounted on the substrate and the wiring board is 50 micron meters or more, or double or more of a diameter of the metal wire

11. The light source module, according to claim 9, in which

the first reflector is formed integrally with the substrate.

12. The light source module, according to claim 9, wherein

a third reflector is provided which extends in a direction orthogonal to the first and second reflectors, the light emitting element is surrounded by the three reflectors, and a space is formed in one side or both sides of the third reflector.

13. The light source module, according to claim 12, in which

the resin is formed into a shape having a uniform liquid surface.

14. A backlight module having the light source module according to claim 11 and a light guide plate, wherein

the light guide plate is arranged on the first reflector and the second reflector.

15. A liquid crystal display device having the backlight module according to claim 14, a radiation heat sink, and a liquid crystal panel module, wherein

the radiation heat sink is arranged in a rear side opposite to the reflecting surface of the first reflector and connected to the first reflector thermally.

16. The liquid crystal display device, according to claim 15, wherein

a recess is formed in an upper portion of the first reflector, with which a lower edge of the light guide plate engages.

17. The liquid crystal display device, according to claim 16, in which a supporting unit for supporting the liquid crystal panel module is formed in an upper portion of the second reflector.