Cabled Signaling System and Components Thereof

• US 20090120668A1
• Filed: 11/14/2007
• Published: 05/14/2009
• Est. Priority Date: 11/16/2002
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Obenhuber, Thomas, Fjelstad, Joseph C., Segaram, Para K., Wiedemann, William F.
• Granted Patent: US 8,338,713 B2
• Time in Patent Office: Days
• US Class Current: 174/250
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01R 12/523 by an interconnection through aligned holes in the boards or multilayer board
• CPC Class Codes: H01R 12/7082 Coupling device supported only by cooperation with PCB
• CPC Class Codes: H01R 12/716 Coupling device provided on the PCB
• CPC Class Codes: H01R 12/79 connecting to rigid printed circuits or like structures
• CPC Class Codes: H05K 2201/044 Details of backplane or midplane for mounting orthogonal PCBs
• CPC Class Codes: H05K 2201/10356 Cables
• CPC Class Codes: H05K 2201/1059 Connections made by press-fit insertion
• CPC Class Codes: H05K 3/222 Completing of printed circuits by adding non-printed jumper connections printed jumper connections H05K3/4685
• CPC Class Codes: H05K 3/308 Adaptations of leads connectors to printed circuits H01R12/00

Abstract

An assembly for conducting an electronic signal. The assembly includes a substrate and an electronic cable. The substrate has distinct first and second regions to enable connection to first and second circuit boards, respectively. First and second through-holes are formed in the substrate in the first and second regions, respectively. The electronic cable is disposed within the first through-hole and extends out of the first through hole, adjacent the substrate and into the second through-hole.

Claims

1. An assembly for conducting an electronic signal, the assembly comprising:

a substrate having distinct first and second regions to enable connection to first and second circuit boards, respectively, the first and second regions including respective first and second through-holes formed in the substrate; and

a first electronic cable disposed within the first through-hole and extending out of the first through hole, adjacent the substrate and into the second through-hole.