Camera Module

• US 20090128681A1
• Filed: 11/21/2008
• Published: 05/21/2009
• Est. Priority Date: 11/21/2007
• Status: Active Grant

• Current Assignee: LG Innotek Company Limited (LG Corporation)
• Original Assignee: LG Innotek Company Limited (LG Corporation)
• Inventors: KIM, MIN SOO
• Granted Patent: US 8,564,716 B2
• Time in Patent Office: Days
• US Class Current: 348/335
• CPC Class Codes: H04N 23/54 Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• CPC Class Codes: H04N 23/55 Optical parts specially adapted for electronic image sensors; Mounting thereof
• CPC Class Codes: H04N 23/57 Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Abstract

Provided are a camera modules. The camera module includes a lens unit including a lens unit; a holder coupled to the lens unit; an image sensor for converting a light through the lens into an electric signal; and a ceramic board coupled to the holder, the ceramic board having a concave portion where the image sensor is inserted. Another camera module includes a lens unit including a lens barrel; a holder including an infrared ray (IR) cut off filter, the holder being coupled to the lens unit; an image sensor for converting a light through the lens into an electric signal; a ceramic board coupled to the holder, one surface of the ceramic board having a first concave portion; and an image signal processor (ISP) inserted into the first concave portion. Another camera module includes a lens unit including at least one lens; and a ceramic board coupled to the lens unit; the ceramic board including an image sensor and an IR cut off filter; wherein the image sensor is inserted into the ceramic board.

Claims

1. A camera module comprising:

a lens unit including a lens barrel;

a holder coupled to the lens unit;

an image sensor for converting a light through the lens into an electric signal; and

a ceramic board coupled to the holder, the ceramic board having a concave portion where the image sensor is inserted.

2. The camera module according to claim 1, wherein the ceramic board is coupled to the image sensor through an adhesive material disposed at a bottom of the concave portion.

3. The camera module according to claim 1, further comprising a first pad formed on the ceramic board and a second pad formed on the image sensor, the first pad and the second pad being electrically connected through a wire, a conductive tape or a solder.

4. The camera module according to claim 1, wherein a top surface of the ceramic board and a top surface of the image sensor are disposed on the same parallel plane.

5. The camera module according to claim 1, wherein the ceramic board comprises at least one hole within an area where the image sensor is disposed.

6. The camera module according to claim 5, wherein the ceramic board is formed by coupling a first substrate with a second substrate and the at least one hole penetrates the first substrate disposed below the image sensor.

7. The camera module according to claim 5, further comprising an adhesive material is disposed on a sidewall of the concave portion in order to couple the ceramic board with the image sensor.

8. A camera module comprising:

a lens unit including a lens barrel;

a holder including an infrared ray (IR) cut off filter, the holder being coupled to the lens unit;

an image sensor for converting a light through the lens into an electric signal;

a ceramic board coupled to the holder, one surface of the ceramic board having a first concave portion; and

an image signal processor (ISP) inserted into the first concave portion.

9. The camera module according to claim 8, wherein the image sensor is disposed between the ISP and the IR cut off filter, the camera module further comprising a spacer disposed between the image sensor and the ISP.

10. The camera module according to claim 8, wherein the one surface of the ceramic board having the first concave portion is a surface where the holder is coupled in the ceramic board or a bottom surface of the ceramic board.

11. The camera module according to claim 8, wherein:

the ceramic board includes a second concave portion where the image sensor is inserted; and

the first concave portion is formed in a bottom of the second concave portion.

12. The camera module according to claim 8, wherein the ISP is electrically connected to a circuit of the ceramic board through a first pad formed on the ISP and a second pad formed on the ceramic board, the first pad and the second pad being electrically connected through a wire, a conductive tape, or a solder;

or through using a ball grid array (BGA) type ISP.

13. The camera module according to claim 8, further comprising a third pad formed on the image sensor and a fourth pad formed on the ceramic board, the third pad and the fourth pad being electrically connected through a wire bonding, a conductive tape, or a solder.

14. The camera module according to claim 8, wherein a top surface of the image sensor and a top surface of the ceramic board are disposed on the same parallel plane.

15. The camera module according to claim 8, wherein the one surface having the first concave portion is a bottom surface of the ceramic board, and wherein the ceramic board includes a second concave portion where the image sensor is inserted in a top surface of the ceramic board.

16. The camera module according to claim 8, further comprising:

a first molding material covering the ISP;

a peripheral device inserted into the ceramic board around the image sensor and the ISP; and

a second molding material covering the peripheral device.

17. The camera module according to claim 16, wherein the first and second molding materials comprise an opaque insulation material.

18. A camera module comprising:

a lens unit including at least one lens; and

a ceramic board coupled to the lens unit, the ceramic board including an image sensor and an IR cut off filter,

wherein the image sensor is inserted into the ceramic board.

19. The camera module according to claim 18, further comprising a spacer formed between the IR cut off filter and the ceramic board, such that the IR cut off filter and the image sensor are spaced apart from each other.

20. The camera module according to claim 18, wherein the IR cut off filter is larger than a cell area of the image sensor while being smaller than the image sensor, the cell area detecting light in the image sensor, and wherein the IR cut off filter is coupled to the image sensor.