CAMERA MODULES AND METHODS OF FABRICATING THE SAME

• US 20090130791A1
• Filed: 11/20/2008
• Published: 05/21/2009
• Est. Priority Date: 11/20/2007
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: CHO, Tae-Je, JANG, Hyung-Sun, KWON, Yong-Hwan, KANG, Un-Byoung, LEE, Chung-Sun, KWON, Woon-Seong
• Granted Patent: US 8,114,701 B2
• Time in Patent Office: Days
• US Class Current: 438/65
• CPC Class Codes: H01L 2224/02377 Fan-in arrangement
• CPC Class Codes: H01L 2224/05001 Internal layers
• CPC Class Codes: H01L 2224/05022 the internal layer being at least partially embedded in the surface
• CPC Class Codes: H01L 2224/05024 the internal layer being disposed on a redistribution layer on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/05099 Material
• CPC Class Codes: H01L 2224/05548 Bonding area integrally formed with a redistribution layer on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/13 of an individual bump connector
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H04N 23/51 Housings
• CPC Class Codes: H04N 23/54 Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• CPC Class Codes: H04N 23/57 Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Abstract

Provided are camera modules capable of effectively shielding electromagnetic (EM) waves and methods of fabricating the same. A method of fabricating a camera module includes, preparing a first wafer including an array of lens units. Then, a second wafer including an array of image sensor CSPs (chip-scale packages) is prepared. Each of the image sensor CSPs includes an image sensor chip corresponding to one of the lens units. The first wafer is stacked on the second wafer. The first wafer and the second wafer are cut to form a trench exposing the top surface of the image sensor chip at the interface between adjacent lens units. The trench is filled with a first material used for forming a housing. The first material and the image sensor chip are cut at the interface between the adjacent lens units.

Claims

1. A method of fabricating a camera module, the method comprising:

preparing a first wafer including an array of lens units;

preparing a second wafer including an array of image sensor chip-scale packages (CSPs), each image sensor CSP including an image sensor chip corresponding to one of the lens units;

stacking the first wafer on the second wafer;

cutting the first wafer and the second wafer to form a trench exposing a top surface of the image sensor chip at an interface between adjacent lens units;

filling the trench with a first material used for forming a housing; and

cutting the first material and the image sensor chip at the interface between the adjacent lens units.

2. The method of claim 1, wherein the image sensor chip has a connection structure using a through via.

3. The method of claim 2, wherein the preparing of the second wafer comprises forming a ground pad on the top surface of the image sensor chip.

4. The method of claim 3, wherein the cutting of the first and second wafers is performed to form the trench exposing the ground pad formed on the top surface of the image sensor chip.

5. The method of claim 3, wherein the cutting of the first material and the image sensor chip is performed on an interface between adjacent ground pads.

6. The method of claim 1, wherein the filling of the trench with the first material comprises filling the trench with the first material to an outer portion of the lens unit by which light is cut off so as to form an aperture in the lens unit.

7. The method of claim 1, wherein the first material includes a conductive material.

8. The method of claim 1, wherein the first material includes a light blocking material.

9. The method of claim 1, wherein the first material includes a conductive material and a light blocking material.

10. The method of claim 1, wherein the filling of the trench with the first material is performed using one of a dispensing process and a molding process.

11. The method of claim 1, wherein the filling of the trench with the first material is performed using one of a chemical vapor deposition process and a physical vapor deposition process.

12. The method of claim 1, wherein the cutting of the first and second wafers is performed using a first cutting blade with a first width such that the trench is formed to have the first width.

13. The method of claim 12, wherein the cutting of the first material and the image sensor chip is performed using a second cutting blade with a second width smaller than the first width.

14. The method of claim 12, wherein the cutting of the first material and the image sensor chip is performed using a laser or a water-jet, which has a second width smaller than the first width.

15. The method of claim 1, further comprising forming a solder ball on a bottom surface of the image sensor chip.

16-20. -20. (canceled)