DEVICE AND METHOD INCLUDING A SOLDERING PROCESS

  • US 20090134501A1
  • Filed: 11/26/2007
  • Published: 05/28/2009
  • Est. Priority Date: 11/26/2007
  • Status: Active Grant
First Claim
Patent Images

1. A method, comprising:

  • providing a substrate;

    providing a semiconductor chip having a first surface with a roughness of at least 100 nm; and

    performing a diffusion soldering process to join the first surface of the semiconductor chip to the substrate.

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