LIGHT EMITTING DEVICE HAVING FUNCTION OF HEAT-DISSIPATION AND MANUFACTURING PROCESS FOR SUCH DEVICE

• US 20090140285A1
• Filed: 09/02/2008
• Published: 06/04/2009
• Est. Priority Date: 11/30/2007
• Status: Abandoned Application

• Current Assignee: Advanced-Connectek Incorporated (ACON Holding, Inc.), Tysun Inc.
• Original Assignee: Advanced-Connectek Incorporated (ACON Holding, Inc.), Tysun Inc.
• Inventors: Lin, Wen-Chin, Wu, Sin-Sian, Lin, Shun-Tian, Huang, Jyun-Wei, Chien, Wen-Hsiang
• Application Number:
  US12/202,439
• Publication Number:
  US 20090140285A1
• Time in Patent Office: Days
• US Class Current: 257/100
• CPC Class Codes: F21K 9/233 specially adapted for generating a spot light distribution, e.g. for substitution of reflector lamps
• CPC Class Codes: F21V 29/505 of reflectors
• CPC Class Codes: F21V 29/745 the fins or blades being planar and inclined with respect to the joining surface from which the fins or blades extend
• CPC Class Codes: F21V 29/767 the planes containing the fins or blades having directions perpendicular to the light emitting axis
• CPC Class Codes: F21V 7/28 characterised by coatings
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/642 characterized by the shape
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 2201/10242 Metallic cylinders small solder preforms other than balls H05K2203/0415
• CPC Class Codes: H05K 2201/10378 Interposers
• CPC Class Codes: H05K 2201/10424 Frame holders
• CPC Class Codes: H05K 2201/10962 Component not directly connected to the PCB
• CPC Class Codes: H05K 3/32 electrically connecting electric components or wires to printed circuits
• CPC Class Codes: H05K 3/4015 using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres

Abstract

A light-emitting device of a light-emitting diode (LED) and a manufacture method thereof are provided. The light-emitting device includes a post-like metal material, a printed circuit board, conductors, insulators, light-emitting diodes, wires, and an encapsulating material. The light-emitting device has through holes, in which conductors are disposed and surrounded with the insulators. One end of each conductor is connected to the printed circuit board to form a composite structure heat-dissipation substrate. The light-emitting diodes are disposed on the post-like metal material, connected to the conductors via the wires, and encapsulated by the encapsulating material. Furthermore, the light-emitting diodes, the wires, and the encapsulating material can be combined into a light-emitting unit. Moreover, red, blue, and green light-emitting diodes can be combined and the color of output light thereof can be adjusted by controlling the input signal.

Claims

1. A light-emitting device, comprising:

a post-like metal material having a first surface and a second surface, and provided with a plurality of through holes communicating the first surface and the second surface;

a plurality of conductors, each disposed in the through hole respectively;

a plurality of insulators, each disposed in the through hole respectively and insulating the corresponding conductor from the post-like metal material;

a printed circuit board having a top surface and a plurality of electrodes disposed on the top surface, the top surface facing the second surface of the post-like metal material;

at least one light-emitting diode disposed on the first surface of the post-like metal material and having electrodes;

a plurality of wires, one end of each wire being electrically connected to the corresponding electrode of the light-emitting diode; and

an encapsulating material, covering the first surface of the post-like metal material,

wherein one end of each conductor is electrically connected with the corresponding electrode of the printed circuit board and the other end of each conductor is electrically connected with the corresponding wire.

2. The light-emitting device according to claim 1, wherein material of the post-like metal material is selected from a group consisting of pure copper, copper alloy, pure aluminum, aluminum alloy, a composite material of copper and aluminum and a combination thereof.

3. The light-emitting device according to claim 1, wherein two ends of each conductor are plated with gold or silver.

4. The light-emitting device according to claim 1, wherein material of the insulators is selected from a group consisting of polymer material, ceramic material, a composite material of the two and a combination thereof.

5. The light-emitting device according to claim 1, wherein the post-like metal material and the printed circuit board are bonded together by screwing, gluing with resin, or soldering with soldering tin.

6. The light-emitting device according to claim 1, further comprising phosphors disposed around the light-emitting diodes.

7. The light-emitting device according to claim 1, further comprising phosphors doped into the encapsulating material.

8. The light-emitting device according to claim 1, wherein the light-emitting diodes are attached on the post-like metal material by solder paste, conductive silver glue, or soldering tin.

9. The light-emitting device according to claim 1, further comprising a lamp holder including a metallic tube-like stand and a cup-like shade disposed at one end of the stand, the shade having an inner side and an outer side, the light-emitting diode being installed at the inner side of the shade.

10. The light-emitting device according to claim 9, wherein an inner wall of the shade is plated with aluminum, nickel, or silver to form a reflective layer.

11. The light-emitting device according to claim 9, further comprising a heat sink disposed at the outer side of the shade, the heat sink including a main body and a plurality of fins, the fins being parallel and isolated from each other and being perpendicularly connected to the main body.

12. A light-emitting device, comprising:

a post-like metal material, having a first surface and a second surface, and provided with a plurality of through holes communicating the first surface and second surface;

a plurality of conductors, each disposed in the through hole respectively;

a plurality of insulators, each disposed in the through hole respectively and insulating the corresponding conductor from the post-like metal material;

a printed circuit board having a top surface and a plurality of electrodes disposed on the top surface, the top surface facing the second surface of the post-like metal material; and

at least one light-emitting unit disposed on the first surface of the post-like metal material, the light-emitting unit including;

a substrate being an insulator and having a first surface, a through hole and an electrical circuit on the first surface;

a post-like heat-dissipation base disposed in the through hole of the substrate, and having a top surface and a bottom surface attached to the first surface of the post-like metal material;

at least one light-emitting diode attached to the top surface of the heat-dissipation base;

a plurality of wires electrically connecting the light-emitting diode to the electrical circuit on the substrate;

two electrode terminals, one end of each electrode terminal being connected to the electrical circuit on the substrate, wherein one end of each conductor is electrically connected with the corresponding electrode of the printed circuit board and the other end of each conductor is electrically connected with the corresponding electrode terminal; and

an encapsulating material covering the first surface of the substrate.

13. The light-emitting device according to claim 12, wherein material of the post-like metal material is selected from a group consisting of pure copper, copper alloy, pure aluminum, aluminum alloy, a composite material of copper and aluminum and a combination thereof.

14. The light-emitting device according to claim 12, wherein the two ends of each conductor are plated with gold or silver.

15. The light-emitting device according to claim 12, wherein material of the insulators is selected from a group consisting of polymer material, ceramic material, a composite material of the two and a combination thereof.

16. The light-emitting device according to claim 12, wherein the post-like metal material and the printed circuit board are bonded together by screwing, gluing with resin, or soldering with soldering tin.

17. The light-emitting device according to claim 12, further comprising phosphors disposed around the light-emitting diodes.

18. The light-emitting device according to claim 12, further comprising phosphors doped into the encapsulating material.

19. The light-emitting device according to claim 12, wherein the light-emitting diodes are attached on the post-like metal material by solder paste, conductive silver glue, or soldering tin.

20. The light-emitting device according to claim 12, further comprising a lamp holder including a metallic tube-like stand and a cup-like shade disposed at one end of the stand, the shade having an inner side and an outer side, the light-emitting unit being installed at the inner side of the shade.

21. The light-emitting device according to claim 20, wherein an inner wall of the shade is plated with aluminum, nickel, or silver to form a reflective layer.

22. The light-emitting device according to claim 20, further comprising a heat-sink disposed at the outer side of the shade, the heat-sink including a main body and a plurality of fins, the fins being parallel and isolated from each other and being perpendicularly connected to the main body.

23. A manufacturing method of a light-emitting device, the manufacturing method comprising:

providing a post-like metal material having a first surface and a second surface, and provided with a plurality of through holes communicating the first surface and the second surface;

providing a plurality of post-like conductors, each surrounded with an insulator and disposed in the through hole respectively;

providing a printed circuit board having a top surface and a plurality of electrodes disposed on the top surface;

facing the second surface of the post-like metal material to the top surface of the printed circuit board, and electrically connecting one end of each conductor to the corresponding electrode;

providing at least one light-emitting diode including electrodes, and attaching the light-emitting diode to the post-like metal material;

providing a plurality of wires, wherein one end of each wire is electrically connected to the corresponding electrode of the light-emitting diode, and the other end of each conductor is electrically connected with the corresponding wire; and

providing an encapsulating material for covering the first surface of the post-like metal material.

24. The manufacturing method according to claim 23, further comprising providing phosphors around the light-emitting diodes or doping phosphors into the encapsulating material.

25. A manufacturing method of a light-emitting device, the manufacturing method comprising:

providing a post-like metal material having a first surface and a second surface, and provided with a plurality of through holes communicating the first surface and the second surface;

providing a plurality of post-like conductors, each disposed in the through hole respectively;

providing a plurality of insulators, each disposed in the through hole respectively and insulating the corresponding conductor from the post-like metal material;

performing a high-temperature sintering process to integrate the conductors, the insulators, and the post-like metal material as a whole;

providing a printed circuit board having a top surface and a plurality of electrodes disposed on the top surface;

facing the second surface of the post-like metal material to the top surface of the printed circuit board, and electrically connecting one end of each conductor to the corresponding electrode;

providing at least one light-emitting diode including electrodes, and attaching the light-emitting diode to the post-like metal material;

providing a plurality of wires, wherein one end of each wire is electrically connected to the corresponding electrode of the light-emitting diode, and the other end of each conductor is electrically connected with the corresponding wire; and

providing an encapsulating material for covering the first surface of the post-like metal material.

26. The manufacturing method according to claim 25, further comprising providing phosphors around the light-emitting diodes or doping phosphors into the encapsulating material.

27. A manufacturing method of a light-emitting device, the manufacturing method comprising:

providing a post-like metal material having a first surface and a second surface, and provided with a ring groove on the first surface, a part of the post-like metal material surrounded by the ring groove forming a conductor;

providing an insulator to fill the ring groove;

performing a high-temperature sintering process to integrate the conductor, the insulator, and the post-like metal material as a whole;

decreasing the thickness of the post-like metal material by grinding, scraping, or digging the post-like metal material along the direction from the second surface to the first surface to expose the conductor and the insulator from the second surface;

providing a printed circuit board having a top surface and a plurality of electrodes disposed on the top surface;

facing the second surface of the post-like metal material to the top surface of the printed circuit board and electrically connecting one end of the conductor to the corresponding electrode;

providing at least one light-emitting diode including electrodes, and attaching the light-emitting diode to the post-like metal material;

providing a plurality of wires, wherein one end of each wire is electrically connected to the corresponding electrode of the light-emitting diode, and the other end of the conductor is electrically connected with the corresponding wire; and

providing an encapsulating material for covering the first surface of the post-like metal material.

28. The manufacturing method according to claim 27, further comprising providing phosphors around the light-emitting diodes or doping phosphors into the encapsulating material.