BUSBAR ASSEMBLY WITH INTEGRATED COOLING

• US 20090161301A1
• Filed: 12/17/2008
• Published: 06/25/2009
• Est. Priority Date: 12/19/2007
• Status: Active Grant

• Current Assignee: GM Global Technology Operations LLC (General Motors Company)
• Original Assignee: GM Global Technology Operations Incorporated (Motors Liquidation Co. GUC Trust)
• Inventors: WOODY, GEORGE R., WARD, TERENCE G.
• Granted Patent: US 7,916,480 B2
• Time in Patent Office: Days
• US Class Current: 361/678
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 7/209 Heat transfer by conduction from internal heat source to heat radiating structure H05K7/20909 takes precedence

Abstract

A busbar assembly is configured such that the power devices (e.g., IGBT die) and diodes are directly mounted to the busbars. The busbars act as heat sinks, and may be cooled using micro channels, micropin fins, direct cooling, or any other heat transfer method. One assembly includes a plurality of busbars, a plurality of power semiconductor devices bonded to the plurality of busbars, and an integrated cooling system within one or more of the busbars.

Claims

1. A busbar assembly comprising:

a plurality of busbars;

a plurality of power semiconductor devices bonded to the plurality of busbars;

wherein at least one of the busbars includes an integrated cooling system.

2. The busbar assembly of claim 1, wherein the integrated cooling system includes one or more channels configured to accept a coolant flowing therethrough.

3. The busbar assembly of claim 2, further including a first header having an inlet for the coolant, and a second header having an outlet for the coolant, wherein the first and second headers are coupled to the at least one busbar.

4. The busbar assembly of claim 2, wherein the integrated cooling system includes one or more microfins.

5. The busbar assembly of claim 2, wherein the integrated cooling system includes one or more microchannels.

6. The busbar assembly of claim 1, wherein the plurality of power semiconductor devices includes at least one IGBT device and at least one diode electrically coupled thereto.

7. The busbar assembly of claim 1, wherein the plurality of busbars includes a first DC busbar, a second DC busbar, and a AC busbar provided therebetween.

8. The busbar assembly of claim 1, further comprising polymeric insulating layers between the plurality of power semiconductor devices.

9. The busbar assembly of claim 3, wherein the outlet is coupled to a stator of a motor.

11. The vehicular inverter module of claim 2, further including a first header having an inlet for the coolant, and a second header having an outlet for the coolant, wherein the first and second headers are coupled to the at least one busbar.

12. The vehicular inverter module of claim 11, wherein the integrated cooling system includes one or more microfins.

13. The vehicular inverter module of claim 11, wherein the integrated cooling system includes one or more microchannels.

16. The vehicular inverter module of claim 11, wherein the outlet is coupled to a stator of a motor.

10. A vehicular inverter module comprising:

a plurality of busbars; and

a plurality of power semiconductor devices bonded to the plurality of busbars, including pairs of IGBT devices and power diodes connected in an inverter configuration;

wherein at least one of the busbars includes an integrated cooling system including one or more channels configured to accept a coolant flowing therethrough.

14. The vehicular inverter module of claim 10, wherein the plurality of busbars includes a first DC busbar, a second DC busbar, and a AC busbar provided therebetween.

15. The vehicular inverter module of claim 10, further comprising polymeric insulating layers between the plurality of power semiconductor devices.

17. A method of cooling an inverter module having a plurality of power semiconductor devices mounted therein, the method comprising:

providing a plurality of busbars having channels formed therein;

mounting the power semiconductor devices to the plurality of busbars;

coupling a fluid inlet and a fluid outlet to the channels of the plurality of busbars;

cycling a cooling fluid through the inlet and the outlet of the plurality of busbars such that heat generated by the power semiconductor devices is transferred thereto.

18. The method of claim 17, wherein the plurality of busbars includes one or more microfins.

19. The method of claim 17, wherein the integrated cooling system includes one or more microchannels.

20. The method of claim 17, wherein the plurality of busbars includes a first DC busbar, a second DC busbar, and a AC busbar provided therebetween.