Light-emitting diode packaging structure and module and assembling method thereof

• US 20090166661A1
• Filed: 03/19/2008
• Published: 07/02/2009
• Est. Priority Date: 12/31/2007
• Status: Active Grant

• Current Assignee: Everlight Electronics Company Limited
• Original Assignee: Everlight Electronics Company Limited
• Inventors: Pei, Chien-Chang, Sheu, Sheng-Jia
• Granted Patent: US 7,982,308 B2
• Time in Patent Office: Days
• US Class Current: 257/99
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A light-emitting diode packaging structure, a packaging module and the assembling method thereof are disclosed. The assembling method comprises the steps of: providing a light-emitting diode, wherein the light-emitting diode has two electrode leads; providing two metal plates, wherein each of the metal plates has at least a clamping portion; holding the electrode leads against the metal plates respectively; and bending the clamping portion of each of the metal plates to fix the electrode leads on the metal plates. Further, a plurality of light-emitting diodes are allowed to be mounted on the metal plates to form the light-emitting diode packaging module.

Claims

1. A light-emitting diode packaging structure comprising:

a light-emitting diode including two electrode leads; and

two metal plates mounted to the electrode leads respectively in a one-to-one manner, wherein each of the metal plates includes at least one clamping portion to clamp and fix the electrode leads thereon.

2. The light-emitting diode packaging structure as claimed in claim 1, wherein the electrode leads are made of Al, Cu or Fe.

3. The light-emitting diode packaging structure as claimed in claim 1, wherein the clamping portion of each of the metal plates is formed as one piece together with the metal plates.

4. The light-emitting diode packaging structure as claimed in claim 3, wherein the clamping portion of each of the metal plates is formed by a method of punching.

5. The light-emitting diode packaging structure as claimed in claim 1, wherein each of the metal plates includes a plurality of clamping portions to clamp and fix each of the electrode leads thereon.

6. The light-emitting diode packaging structure as claimed in claim 1, wherein each of the electrode leads includes at least one position hole, and each of the metal plates further includes at least one holding portion corresponding to the position hole for passing through the position hole and holding the electrode leads thereon.

7. The light-emitting diode packaging structure as claimed in claim 6, wherein the holding portion of each of the metal plates is formed as one piece together with the metal plates.

8. The light-emitting diode packaging structure as claimed in claim 7, wherein the holding portion of each of the metal plates is formed by a method of punching.

9. The light-emitting diode packaging structure as claimed in claim 1, wherein an electrically conductive bonding material is formed between each of the electrode leads and each of the metal plates.

10. The light-emitting diode packaging structure as claimed in claim 9, wherein the electrically conductive bonding material is an electrically conductive glue or an Ag glue.

11. A method for assembling a light-emitting diode packaging structure comprising:

providing a light-emitting diode, wherein the light-emitting diode includes two electrode leads;

providing two metal plates, wherein each of the metal plates includes at least one clamping portion;

holding the electrode leads on the metal plates respectively in a one-to-one manner; and

bending the clamping portion to clamp and fix the electrode leads on the metal plates respectively.

12. The method as claimed in claim 11, wherein each of the electrode leads includes at least one position hole, and each of the metal plates further includes at least one holding portion corresponding to the position hole, and the method further comprises:

making the holding portion to pass through the position hole of each of the electrode leads; and

bending the holding portion to clamp each of the electrode leads on the metal plates.

13. A light-emitting diode packaging module comprising:

a plurality of light-emitting diodes, wherein each of the light-emitting diodes includes two electrode leads; and

two metal plates mounted to the electrode leads respectively, wherein each of the metal plates includes a plurality of clamping portions to clamp and fix the electrode leads of the light-emitting diodes thereon.

14. The light-emitting diode packaging module as claimed in claim 13, wherein the metal plates are allowed to be bent to form a predetermined three-dimensional structure.

15. The light-emitting diode packaging module as claimed in claim 13, wherein the clamping portions of each of the metal plates are formed as one piece together with the metal plates.

16. The light-emitting diode packaging module as claimed in claim 15, wherein the clamping portions of each of the metal plates are formed by a method of punching.

17. The light-emitting diode packaging module as claimed in claim 13, wherein each of the electrode leads includes at least one position hole, and each of the metal plates further includes a plurality of holding portions corresponding to the position hole of each of the electrode leads for passing through the position holes and holding the electrode leads thereon.

18. The light-emitting diode packaging module as claimed in claim 17, wherein the holding portions of each of the metal plates are formed as one piece together with the metal plates.

19. The light-emitting diode packaging module as claimed in claim 18, wherein the holding portions of each of the metal plates are formed by a method of punching.

20. A method for assembling a light-emitting diode packaging module comprising:

providing a plurality of light-emitting diodes, wherein each of the light-emitting diodes includes two electrode leads;

providing two metal plates, wherein each of the metal plates includes a plurality of clamping portions;

holding the electrode leads on the metal plates respectively; and

bending the clamping portions to clamp and fix the electrode leads on the metal plates respectively.