LIQUID JET HEAD, METHOD FOR MANUFACTURING LIQUID JET HEAD, AND METHOD FOR FORMING STRUCTURE FOR LIQUID JET HEAD

• US 20090191487A1
• Filed: 01/22/2009
• Published: 07/30/2009
• Est. Priority Date: 01/28/2008
• Status: Active Grant

• Current Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Original Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Inventors: Watanabe, Keiji, Watanabe, Makoto, Murayama, Hiroyuki, Tagawa, Yoshinori, Takeuchi, Souta
• Granted Patent: US 8,152,276 B2
• Time in Patent Office: Days
• US Class Current: 430/320
• CPC Class Codes: B41J 2/14024 Assembling head parts
• CPC Class Codes: B41J 2/1603 of the front shooter type
• CPC Class Codes: B41J 2/1623 bonding and adhesion
• CPC Class Codes: B41J 2/1629 wet etching
• CPC Class Codes: B41J 2/1631 photolithography
• CPC Class Codes: B41J 2/1632 machining
• CPC Class Codes: B41J 2/1639 sacrificial molding
• CPC Class Codes: B41J 2/1645 thin film formation by spincoating

Abstract

A liquid ejecting head including a coating resin layer including a plurality of ejection outlets for ejecting liquid and flow paths which are in fluid communication with the ejection outlets, respectively; an energy generating element for generating energy for ejecting liquid; and an adhesion improving layer provided between the coating resin layer and the substrate, wherein the coating resin layer further includes a first resin material layer closest to the substrate and at least one second resin material layer, and the first resin material layer provides at least one stepped portion continuing from a periphery of the second resin material layer.

Claims

1. A liquid ejecting head comprising:

a coating resin layer including a plurality of ejection outlets for ejecting liquid and flow paths which are in fluid communication with the ejection outlets, respectively;

an energy generating element for generating energy for ejecting liquid; and

an adhesion improving layer provided between said coating resin layer and said substrate,

wherein said coating resin layer further includes a first resin material layer closest to said substrate and at least one second resin material layer, and said first resin material layer provides at least one stepped portion continuing from a periphery of said second resin material layer.

2. A liquid ejection head according to claim 1, wherein said stepped portion has a height from an interface between said adhesion improving layer and said coating resin layer to a surface of said stepped portion is smaller than one half of a maximum thickness of said coating resin layer.

3. A liquid ejection head according to claim 1, wherein said second resin material layer has a corner portion in the form of a curved surface.

4. A liquid ejection head according to claim 1, wherein a corner portion of said first resin material layer is formed by crossing surfaces.

5. A liquid ejection head according to claim 1, wherein said second resin material layer is provided with a groove surrounding a flow path formation region constituted by said ejection outlet and said flow path.

6. A liquid ejection head according to claim 5, wherein said groove includes an inner side having pits and projections.

7. A liquid ejection head according to claim 5, wherein said groove includes a flat inner side.

8. A liquid ejection head according to claim 5, further comprising a plurality of connecting portions connecting between outer and inner sides of said groove.

9. A manufacturing method for a liquid ejecting head having ejection outlets for ejecting liquid and flow paths which are in fluid communication with ejection outlets, said method comprising the steps of:

forming a pattern corresponding to a configuration of the flow paths on a substrate;

providing a first layer of a negative type photosensitive resin composition so as to coat said pattern;

providing an exposed portion on said first layer by exposing at least a part of said first layer outside of and remote from said pattern to light;

providing a second layer of a negative type photosensitive resin composition on said first layer;

exposing said second layer to light while masking an outer portion of a part thereof corresponding to said exposed portion;

removing a portion of said first layer and said second layer not exposed to the light; and

providing said flow paths by removing said pattern.

10. A method according to claim 9, further comprising curing the exposed portion by heating said first layer after said exposed portion is provided.

11. A method according to claim 9, wherein said first layer is thinner than said second layer.

12. A method according to claim 9, wherein said first layer and said second layer are made of the same negative type photosensitive resin compositions.

13. A manufacturing method for a liquid ejecting head having ejection outlets for ejecting liquid and flow paths which are in fluid communication with ejection outlets, said method comprising the steps of:

forming a pattern corresponding to a configuration of the flow paths on a substrate;

providing a first layer of a negative type photosensitive resin composition so as to coat said pattern; and

providing an exposed portion on said first layer by exposing at least a part of said first layer outside of and remote from said pattern to light;

removing a portion of said first layer other than said exposed portion;

providing a second coating layer of a negative type photosensitive resin composition on said exposed portion;

exposing said second layer to light while masking an outer portion of a part thereof corresponding to said exposed portion;

removing a portion of said first layer and said second layer not exposed to the light; and

providing said flow paths by removing said pattern.

14. A method according to claim 13, wherein said first layer and said second layer are made of the same negative type photosensitive resin compositions.

15. A manufacturing method for a liquid ejecting head including an ejection outlet forming member having ejection outlets for ejecting liquid and liquid flow paths which are in fluid communication with said ejection outlets, said method comprising the steps of:

providing a side wall formation member for forming, on substrate, a side wall of said flow paths of a cured negative type photosensitive resin composition;

providing, on said side wall formation member, a layer of a negative type photosensitive resin composition for said ejection outlet forming member;

exposing said second layer to light while masking an outer portion of a part thereof corresponding to said side wall; and

removing a non-exposed part of the negative type photosensitive resin composition for said ejection outlet forming member.

16. A forming method for a structure, said method comprising:

providing a first layer of a negative type photosensitive resin composition on a substrate;

providing an exposed portion on said first layer by exposing a part of said first layer to light;

providing a second layer of a negative type photosensitive resin composition on said first layer;

exposing said second layer to light while masking an outer portion of a part thereof corresponding to said exposed portion of said first layer; and

removing non-exposed portions of said first and second layers.

17. A method according to claim 16, further comprising heating said first layer after said exposed portion is provided.

18. A liquid ejecting head comprising:

an orifice plate including a plurality of ejection outlets for ejecting liquid and flow paths which are in fluid communication with the ejection outlets, respectively;

an energy generating element for generating energy for ejecting liquid; and

a stepped portion provided at an outer periphery of said orifice plate, wherein the outer periphery of said orifice plate has a thickness not more than one half of a maximum thickness of said orifice plate.