Method of Forming an Interconnect on a Semiconductor Substrate
First Claim
1. A method of forming a wire bond-free conductive interconnect area on a semiconductor substrate, the method comprising:
- providing a semiconductor substrate, said semiconductor substrate comprising an electrically conductive protrusion defining a bond pad;
providing a plurality of electrically conductive nanofilaments; and
immobilizing the plurality of electrically conductive nanofilaments on the electrically conductive protrusion by allowing at least one random portion of the electrically conductive nanofilaments along the length thereof to attach to the surface of the electrically conductive protrusion, such that an aggregate of loops of electrically conductive nanofilaments is formed on the surface of the electrically conductive protrusion, thereby forming a conductive interconnect area on the electrically conductive protrusion without heat treatment.
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Accused Products
Abstract
The present invention relates to a method of forming a wire bond-free conductive interconnect area on a semiconductor substrate. A semiconductor substrate with an electrically conductive protrusion, defining a bond pad, is provided as well as a plurality of carbon nanotubes. The plurality of carbon nanotubes is immobilized on the bond pad by allowing at least one random portion along the length of the carbon nanotubes to attach to the surface of the bond pad. Thus an aggregate of loops of carbon nanotubes is formed on the surface of the bond pad. Thereby a conductive interconnect area is formed on the electrically conductive protrusion without heat treatment.
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Citations
25 Claims
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1. A method of forming a wire bond-free conductive interconnect area on a semiconductor substrate, the method comprising:
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providing a semiconductor substrate, said semiconductor substrate comprising an electrically conductive protrusion defining a bond pad; providing a plurality of electrically conductive nanofilaments; and immobilizing the plurality of electrically conductive nanofilaments on the electrically conductive protrusion by allowing at least one random portion of the electrically conductive nanofilaments along the length thereof to attach to the surface of the electrically conductive protrusion, such that an aggregate of loops of electrically conductive nanofilaments is formed on the surface of the electrically conductive protrusion, thereby forming a conductive interconnect area on the electrically conductive protrusion without heat treatment. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method of interconnecting two semiconductor substrates in a wire bond-free manner, the method comprising:
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providing a first semiconductor substrate, said first semiconductor substrate comprising a first electrically conductive protrusion defining a first bond pad; providing a second semiconductor substrate, said second semiconductor substrate comprising a second electrically conductive protrusion defining a second bond pad; providing a first plurality of electrically conductive nanofilaments; immobilizing the first plurality of electrically conductive nanofilaments on the first electrically conductive protrusion by allowing at least one random portion of said electrically conductive nanofilaments along the length thereof to attach to the surface of the first electrically conductive protrusion, such that a first aggregate of loops of electrically conductive nanofilaments is formed on the surface of the first electrically conductive protrusion, thereby forming a first conductive interconnect area on the first electrically conductive protrusion without heat treatment; providing a second plurality of electrically conductive nanofilaments; immobilizing the second plurality of electrically conductive nanofilaments on the second electrically conductive protrusion by allowing at least one random portion of said electrically conductive nanofilaments along the length thereof to attach to the surface of the second electrically conductive protrusion, such that a second aggregate of loops of electrically conductive nanofilaments is formed on the surface of the second electrically conductive protrusion, thereby forming a second conductive interconnect area on the second electrically conductive protrusion without heat treatment; and contacting the first electrically conductive protrusion, on which the first plurality of electrically conductive nanofilaments is immobilized, with the second electrically conductive protrusion, on which the second plurality of electrically conductive nanofilaments is immobilized, thereby allowing non-covalent interaction between the first and the second aggregate of loops of electrically conductive nanofilaments to join the first and the second electrically conductive protrusion together. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19)
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20. A method of interconnecting two semiconductor substrates in a wire bond-free manner, the method comprising:
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providing a first semiconductor substrate, said first semiconductor substrate comprising an electrically conductive protrusion defining a first bond pad; providing a first plurality of electrically conductive nanofilaments; immobilizing the first plurality of electrically conductive nanofilaments on the first electrically conductive protrusion by at least one random portion of the electrically conductive nanofilaments along the length thereof to attach to the surface of the first electrically conductive protrusion, such that an aggregate of loops of electrically conductive nanofilaments is formed on the surface of the first electrically conductive protrusion, thereby forming a first conductive interconnect area on the first electrically conductive protrusion without heat treatment; providing a second semiconductor substrate, said second semiconductor substrate comprising a second electrically conductive protrusion defining a second bond pad, wherein on the second electrically conductive protrusion there is immobilized a second plurality of electrically conductive nanofilaments, wherein each electrically conductive nanofilament of the second plurality of electrically conductive nanofilaments has a free end; and contacting the first electrically conductive protrusion, on which the first plurality of electrically conductive nanofilaments is immobilized, with the second electrically conductive protrusion, on which the second plurality of electrically conductive nanofilaments is immobilized, thereby allowing the free ends of the second plurality of electrically conductive nanofilaments on the second electrically conductive protrusion to enter the loops of the aggregate of the first plurality of electrically conductive nanofilaments on the first electrically conductive protrusion. - View Dependent Claims (21, 22, 23, 24, 25)
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Specification