METHOD AND TOOL FOR REPOSITIONING SOLDER FILL HEAD

• US 20090242614A1
• Filed: 03/27/2008
• Published: 10/01/2009
• Est. Priority Date: 03/27/2008
• Status: Abandoned Application

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: LEENSTRA, BOUWE W., WEISS, THOMAS, BIGGS, GLEN N., PALMATIER, PHILLIP W., GRUBER, PETER A., BUDD, RUSSELL A., TESSLER, CHRISTOPHER L., GARANT, JOHN J.
• Application Number:
  US12/056,573
• Publication Number:
  US 20090242614A1
• Time in Patent Office: Days
• US Class Current: 228/176
• CPC Class Codes: B23K 1/0016 Brazing of electronic components
• CPC Class Codes: B23K 3/0623 for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
• CPC Class Codes: H01L 2224/131 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/742 Apparatus for manufacturing bump connectors
• CPC Class Codes: H01L 24/11 Manufacturing methods for bumps on insulating substrates H01L21/4853
• CPC Class Codes: H01L 24/13 of an individual bump connector
• CPC Class Codes: H01L 24/742 Apparatus for manufacturing bump connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/181 Encapsulation

Abstract

A tool and method is provided for repositioning a solder injection head. The tool includes a first moveable platform positioned on a first side of a workpiece chuck and a second moveable platform positioned on a second side of the workpiece chuck. A solder injection head has a seal configured to seal molten solder within the solder injection head when contacting a surface of the first moveable platform or the second moveable platform. The method includes moving a workpiece chuck and a starting platform to a position such that the starting platform is at a finishing position and a finishing platform is in a starting position.

Claims

1. A tool, comprising:

a first moveable platform positioned on a first side of a workpiece chuck;

a second moveable platform positioned on a second side of the workpiece chuck; and

a solder injection head having a seal configured to seal molten solder within the solder injection head when contacting a surface of the first moveable platform or the second moveable platform.

2. The tool of claim 1, wherein the first moveable platform and the second moveable platform are configured to be moveable in a horizontal direction, independent of the solder injection head.

3. The tool of claim 1, wherein the first moveable platform is configured to be moveable in a vertical direction and remain stationary in a horizontal position and the second moveable platform is independently moveable in the horizontal direction.

4. The tool of claim 1, further comprising a plurality of horizontally stationary lifting mechanisms configured to independently lift the first moveable platform and the second moveable platform.

5. The tool of claim 4, wherein the plurality of horizontally stationary lifting mechanisms lift at least one of the first moveable platform and the second moveable platform when in alignment therewith.

6. The tool of claim 1, wherein the first moveable platform is configured to be in a raised position while the second moveable platform is configured to be in a lowered position while moving in a horizontal direction.

7. The tool of claim 6, wherein the workpiece chuck is moveable in the horizontal direction with the second moveable platform when the first moveable platform is in a raised position with the solder injection head thereon.

8. The tool of claim 1, wherein the solder injection head is stationary with respect to a horizontal movement of the first moveable platform, the second moveable platform and the workpiece chuck.

9. The tool of claim 1, further comprising a moveable carriage with is mounted to the first moveable platform, the second moveable platform and the workpiece chuck.

10. The tool of claim 1, further comprising mechanisms configured to move the first moveable platform and the second moveable platform away from and toward the workpiece chuck in a horizontal direction.

11. The tool of claim 1, further comprising a pressure device configured to apply a pressure against the solder injection head thereby preventing leakage between the seal and the first moveable platform and the second moveable platform.

12. The tool of claim 1, wherein the solder injection head is moveable in a vertical direction when on either of the first moveable platform or the second moveable platform.

13. A tool, comprising:

a workpiece chuck moveable in a horizontal direction and stationary in a vertical direction;

a first moveable platform positioned on a first side of a workpiece chuck and independently moveable in the horizontal direction and the vertical direction;

a second moveable platform positioned on a second side of the workpiece chuck and independently moveable in the horizontal direction and the vertical direction; and

a solder injection head having a seal configured to seal molten solder within the solder injection head when contacting a surface of either the first moveable platform or the second moveable platform, the solder injection head configured to move in the vertical direction when positioned on one of the first moveable platform and the second moveable platform and remain stationary in the horizontal direction.

14. The tool of claim 13, further comprising a carriage to move the workpiece chuck, the first moveable platform and the second moveable platform in the horizontal direction.

15. The tool of claim 13, further comprising a plurality of lifting mechanisms which remain stationary in the horizontal direction and lift the first moveable platform and the second moveable platform in the vertical direction when aligned therewith.

16. A method of injecting solder into molds comprising moving a workpiece chuck and a starting platform initially in a starting position to a finishing position and a finishing platform to the starting position.

17. The method of claim 16, wherein the finishing platform and the starting platform are independently moved in a horizontal direction towards the workpiece chuck prior to injecting solder into a mold and moved away from the workpiece chuck after injecting solder into the mold.

18. The method of claim 16, further comprising lifting the finishing platform in a vertical direction when a solder injection head is placed thereon and lifting the starting platform in the vertical direction while the workpiece chuck is moved in a horizontal position away from the finishing platform and the starting platform.

19. The method of claim 18, further comprising lowering the starting platform and moving the starting platform and the workpiece chuck in a direction past the finishing platform.

20. The method of claim 19, further comprising lowering the finishing platform into the starting position after the starting platform and the workpiece chuck pass the finishing platform.