SEMICONDUCTOR LIGHT EMITTING MODULE AND METHOD FOR MANUFACTURING THE SAME

• US 20090242927A1
• Filed: 03/27/2009
• Published: 10/01/2009
• Est. Priority Date: 03/28/2008
• Status: Active Grant

• Current Assignee: ROHM Co., Ltd.
• Original Assignee: ROHM Co., Ltd.
• Inventors: KOBAYAKAWA, Masahiko, YASUDA, Shintaro
• Granted Patent: US 8,148,745 B2
• Time in Patent Office: Days
• US Class Current: 257/99
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A light emitting module includes a semiconductor light source, a first lead with a bonding pad to which the light source is attached, and a second lead spaced from the first lead in a first direction contained in the plane of the first die bonding pad. The second lead includes a wire bonding pad connected to the light source via a wire. The module also includes a case formed with a space elongated in the first direction for accommodating the light source. The first lead includes an extension extending from the first die bonding pad, and a mounting terminal connected to the extension. The extension extends in a second direction that is perpendicular to the first direction and contained in the plane of the first die bonding pad. The mounting terminal extends perpendicularly to the second direction. The extension overlaps the light source in the first direction.

Claims

1. A semiconductor light emitting module comprising:

a semiconductor light emitting element;

a first lead including a first die bonding pad to which the semiconductor light emitting element is attached;

a second lead spaced from the first lead in a first direction contained in a plane of the first die bonding pad, the second lead including a wire bonding pad connected to the semiconductor light emitting element via a wire; and

a case formed with a space elongated in the first direction and accommodating the semiconductor light emitting element;

wherein the first lead is provided with an extension extending from the first die bonding pad and with a mounting terminal connected to the extension, the extension extending in a second direction perpendicular to the first direction and contained in the plane of the first die bonding pad, the mounting terminal extending perpendicularly to the second direction, and wherein the extension overlaps the semiconductor light emitting element in the first direction.

2. The semiconductor light emitting module according to claim 1, further comprising a zener diode, wherein the first lead includes a second die bonding pad extending from the first die bonding pad in the first direction toward the second lead and located at a position deviated toward an end of the space in the second direction, the zener diode being attached to the second die bonding pad,

wherein the wire bonding pad of the second lead is located at a position deviated toward another end of the space in the second direction and overlaps the second die bonding pad in the first direction.

3. The semiconductor light emitting module according to claim 1, further comprising a plating layer covering an end surface of the mounting terminal and having a higher solder wettability than the mounting terminal, wherein the end surface of the mounting terminal faces in a third direction perpendicular to both the first direction and the second direction.

4. The semiconductor light emitting module according to claim 1, wherein the case includes a holding surface opposite to the mounting terminal in the second direction and extending in parallel with the mounting terminal.

5. The semiconductor light emitting module according to claim 1, wherein the space includes a wider portion accommodating the semiconductor light emitting element and two narrower portions sandwiching the wider portion in the first direction, the narrower portions being smaller than the wider portion in dimension in the second direction,

wherein a portion of the case on the mounting terminal side has a non-flat side surface defining the wider portion and the two narrower portions, whereas a portion of the case on the opposite side of the mounting terminal in the second direction has a flat surface.

6. The semiconductor light emitting module according to claim 1, wherein the case includes a placing surface offset in the first direction toward the second lead relative to the mounting terminal, the placing surface being flush with the mounting terminal.

7. A method for manufacturing a semiconductor light emitting module, the method comprising:

preparing a lead frame extending in a first direction and a second direction perpendicular to the first direction, the lead frame including a die bonding pad for bonding a semiconductor light emitting element, an extension extending from the die bonding pad in the second direction, a mounting terminal connected to the extension, and a frame portion to which the mounting terminal is connected via a connecting portion smaller than the mounting terminal in dimension in the first direction;

plating the lead frame with a material having a higher solder wettability than the lead frame;

bonding a semiconductor light emitting element on the die bonding pad at a position overlapping the extension in the first direction;

forming a case including a space that is elongated in the first direction and accommodates the semiconductor light emitting element;

cutting the connecting portion; and

bending the extension so that the mounting terminal extends perpendicularly to the second direction.