METHOD AND SYSTEM FOR FORMING AN ELECTRONIC ASSEMBLY HAVING INERTIAL SENSORS MOUNTED THERETO

• US 20090255335A1
• Filed: 04/14/2008
• Published: 10/15/2009
• Est. Priority Date: 04/14/2008
• Status: Active Grant

• Current Assignee: Honeywell International Inc.
• Original Assignee: Honeywell International Inc.
• Inventors: Fly, Brian E., Moya, Dave
• Granted Patent: US 8,100,010 B2
• Time in Patent Office: Days
• US Class Current: 73/493
• CPC Class Codes: G01C 19/5719 using planar vibrating masses driven in a translation vibration along an axis
• CPC Class Codes: G01C 21/166 Mechanical, construction or arrangement details of inertial navigation systems
• CPC Class Codes: G01P 1/023 for acceleration measuring devices
• CPC Class Codes: G01P 15/125 by capacitive pick-up
• CPC Class Codes: G01P 15/18 in two or more dimensions
• CPC Class Codes: G01P 2015/0831 the mass being of the paddle type having the pivot axis between the longitudinal ends of the mass, e.g. see-saw configuration

Abstract

Systems and methods for forming an electronic assembly are provided. A first inertial sensor having a first sense axis is attached to a bracket. A second inertial sensor having a second sense axis is attached to the bracket such that the second sense axis is substantially orthogonal to the first sense axis. The bracket is attached to a circuit board having at least one microelectronic device mounted thereto.

Claims

1. A method for forming an electronic assembly comprising:

attaching a first inertial sensor having a first sense axis to a bracket;

attaching a second inertial sensor having a second sense axis to the bracket such that the second sense axis is substantially orthogonal to the first sense axis; and

attaching the bracket to a circuit board having at least one microelectronic device mounted thereto.

2. The method of claim 1, further comprising attaching a third inertial sensor having a third sense axis to the bracket such that the third sense axis is substantially orthogonal to the first and second sense axes.

3. The method of claim 2, wherein said attachment of at least some of the first, second, and third inertial sensors to the bracket occurs before said attachment of the bracket to the circuit board.

4. The method of claim 3, wherein said attachment of the first, second, and third inertial sensors to the bracket occurs before said attachment of the bracket to the circuit board.

5. The method of claim 4, wherein each of the first, second, and third inertial sensors is a micro-electromechanical system (MEMS) device.

6. The method of claim 5, wherein each of the first, second, and third inertial sensors are MEMS gyroscopes or MEMS accelerometers.

7. The method of claim 5, wherein the first, second, and third inertial sensors are MEMS gyroscopes.

8. The method of claim 7, further comprising attaching a fourth inertial sensor having a fourth sense axis to the bracket before said attachment of the bracket to the circuit board such that the fourth sense axis is substantially parallel to the first sense axis and substantially orthogonal to the second and third sense axes.

9. The method of claim 7, further comprising:

attaching a fifth inertial sensor having a fifth sense axis to the bracket before said attachment of the bracket to the circuit board such that the fifth sense axis is substantially parallel to the second sense axis and substantially orthogonal to the first and third sense axes; and

attaching a six inertial sensor having a six sense axis to the bracket before said attachment of the bracket to the circuit board such that the six sense axis is substantially parallel to the third sense axis and substantially orthogonal to the first and second sense axes.

10. The method of claim 9, wherein the fourth, fifth, and six inertial sensors are MEMS accelerometers.

11. A method for constructing an inertial measurement unit comprising:

attaching first, second, and third micro-electromechanical system (MEMS) inertial sensors, having respective first, second, and third sense axes, to a bracket such that the first, second, and third sense axes are substantially orthogonal;

attaching fourth, fifth, and sixth MEMS inertial sensors, having respective fourth, fifth, and sixth sense axes, to the bracket such that the fourth, fifth, and sixth sense axes are substantially parallel to the respective first, second, and third sense axes; and

attaching the bracket to a circuit board having at least one integrated circuit mounted thereto such that the first, second, third, fourth, fifth, and sixth MEMS inertial sensors are in operable communication with the at least one integrated circuit.

12. The method of claim 11, wherein the first, second, and third MEMS inertial sensors are MEMS gyroscopes and the fourth, fifth, and sixth MEMS inertial sensors are MEMS accelerometers.

13. The method of claim 12, wherein said attachment of the first, second, third, fourth, fifth, and sixth MEMS inertial sensors occurs before said attachment of the bracket to the circuit board.

14. An inertial measurement unit comprising:

a circuit board;

a plurality of conductive traces formed on the circuit board;

an integrated circuit mounted to the circuit board and electrically connected to the conductive traces; and

a sensor assembly comprising;

a bracket connected to the circuit board;

a first micro-electromechanical system (MEMS) inertial sensor connected to the bracket, the first inertial sensor having a first sense axis;

a second MEMS inertial sensor connected to the bracket, the second inertial sensor having a second sense axis, the second sense axis being substantially orthogonal to the first sense axis; and

a plurality of conductive leads electrically connected to the first and second MEMS inertial sensors and the conductive traces such that the first and second MEMS inertial sensors are in operable communication with the integrated circuit through the conductive traces.

15. The inertial measurement unit of claim 14, wherein the conductive traces have first portions adjacent the integrated circuit and second portions adjacent the bracket.

16. The inertial measurement unit of claim 15, wherein the sensor assembly further comprises:

a first portion of flex-tape extending between the first MEMS inertial sensor and the second portions of at least some of the conductive traces; and

a second portion of flex-tape extending between the second MEMS inertial sensor and the second portions of at least some of the conductive traces,

wherein the conductive leads are embedded within the first and second portions of the flex-tape.

17. The inertial measurement unit of claim 16, wherein the conductive leads are embedded within the bracket and the sensor assembly further comprises a plurality of solder balls interconnecting the second portions of the conductive traces, the conductive leads, and the first and second MEMS inertial sensors.

18. The inertial measurement unit of claim 17, wherein the sensor assembly further comprises a third MEMS inertial sensor having a third sense axis connected to the bracket such that the third sense axis is substantially orthogonal to the first and second sense axes, and wherein the first, second, and third MEMS inertial sensors are MEMS gyroscopes or MEMS accelerometers.

19. The inertial measurement unit of claim 18, further comprising fourth, fifth, and sixth MEMS inertial sensors having respective fourth, fifth, and sixth sense axes connected to the bracket such that the fourth, fifth, and sixth sense axes are orthogonal to the respective first, second, and third sense axes.

20. The inertial measurement unit of claim 18, wherein the first, second, and third inertial sensors are MEMS gyroscopes and the fourth, fifth, and six inertial sensors are MEMS accelerometers.