CIRCUIT SUBSTRATE AND LIGHT EMITTING DIODE PACKAGE
First Claim
Patent Images
1. A circuit substrate, comprising:
- a base layer, having a plurality of through grooves; and
a plurality of lead units, arranged as an array and disposed on the base layer, wherein each of the lead units comprises;
a common terminal, divided into a plurality of electrodes, wherein the electrodes are connected with each other; and
at least three leads, extended from an edge of the common terminal, wherein each of the leads is respectively extended from an edge of one of the electrodes, and the through grooves expose the common terminals of the lead units.
2 Assignments
0 Petitions
Accused Products
Abstract
A circuit substrate including a base layer and a plurality of lead units arranged as an array is provided, wherein the base layer has a plurality of through grooves, and the lead units are disposed on the base layer. Each of the lead units includes a common terminal and at least three leads. The common terminal is capable of being divided into a plurality of electrodes connected with each other. The leads are extended outwards from the edge of the common terminal, and each of the leads is extended outwards from the edge of one of the electrodes. The through grooves expose the common terminals of the lead units.
31 Citations
20 Claims
-
1. A circuit substrate, comprising:
-
a base layer, having a plurality of through grooves; and a plurality of lead units, arranged as an array and disposed on the base layer, wherein each of the lead units comprises; a common terminal, divided into a plurality of electrodes, wherein the electrodes are connected with each other; and at least three leads, extended from an edge of the common terminal, wherein each of the leads is respectively extended from an edge of one of the electrodes, and the through grooves expose the common terminals of the lead units. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
-
-
17. A light emitting diode (LED) package, comprising:
-
a carrier, comprising; a substrate, having two through grooves; a first electrode, disposed on the substrate, wherein one of the through grooves exposes the first electrode; a first lead, disposed on the substrate and connected to the edge of the first electrode; a second electrode, disposed on the substrate, wherein the other one of the through grooves exposes the second electrode; a second lead, disposed on the substrate and connected to the edge of the second electrode; and a LED chip, disposed on the first lead and electrically connected to the first lead and the second lead; and an encapsulant, disposed on the substrate and covering the first lead, the second lead, and the LED chip, wherein each of the first electrode and the second electrode has two adjacent cutting edges located at a corner, and the two cutting edges are not parallel to each other. - View Dependent Claims (18, 19, 20)
-
Specification