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CIRCUIT SUBSTRATE AND LIGHT EMITTING DIODE PACKAGE

  • US 20090283790A1
  • Filed: 02/11/2009
  • Published: 11/19/2009
  • Est. Priority Date: 05/15/2008
  • Status: Active Grant
First Claim
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1. A circuit substrate, comprising:

  • a base layer, having a plurality of through grooves; and

    a plurality of lead units, arranged as an array and disposed on the base layer, wherein each of the lead units comprises;

    a common terminal, divided into a plurality of electrodes, wherein the electrodes are connected with each other; and

    at least three leads, extended from an edge of the common terminal, wherein each of the leads is respectively extended from an edge of one of the electrodes, and the through grooves expose the common terminals of the lead units.

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