METHOD AND SYSTEM FOR PRODUCING THIN FILM BIOSENSORS

• US 20090294277A1
• Filed: 05/30/2008
• Published: 12/03/2009
• Est. Priority Date: 05/30/2008
• Status: Abandoned Application

• Current Assignee: Abbott Diabetes Care Incorporated (Abbott Laboratories Incorporated)
• Original Assignee: Abbott Diabetes Care Incorporated (Abbott Laboratories Incorporated)
• Inventors: Khan, Tahir S., Thomas, Christopher Allen
• Application Number:
  US12/131,012
• Publication Number:
  US 20090294277A1
• Time in Patent Office: Days
• US Class Current: 204/192.1
• CPC Class Codes: G01N 27/3272 Test elements therefor, i.e. disposable laminated substrates with electrodes, reagent and channels optical biosensors G01N33/52

Abstract

Method and system for providing a substrate, forming a plurality of electrodes on the substrate, the electrodes including a thin gold layer on the substrate, the gold layer having a thickness of less than approximately 120 nm, and further, each of the formed plurality of electrodes are co-planar relative to each other, and providing a coverlay over at least a portion of the each of the plurality of electrodes are provided.

Claims

1. A method of manufacturing an analyte sensor, comprising:

providing a non-conductive substrate;

depositing a conductive material including a layer of thin gold film having a thickness not exceeding approximately 120 nm on the substrate;

defining electrodes from the deposited conductive material; and

depositing a coverlay material over the substrate such that the coverlay material is disposed over at least a portion of the defined electrodes.

2. The method of claim 1 wherein depositing the coverlay material includes one of photo-imaging, laser imaging, laminating, or ink jet printing.

3. The method of claim 1, wherein the substrate comprises a polymeric material.

4. The method of claim 3, wherein the substrate comprises polyethylene terephthalate.

5. The method of claim 3, wherein the substrate comprises polyimide.

6. The method of claim 1, wherein the gold layer is deposited by sputter or evaporation onto the substrate.

7. The method of claim 1, wherein the electrodes are defined by photo-imaging.

8. The method of claim 1, wherein the coverlay material is a dry film solder material.

9. The method of claim 1, wherein the coverlay material is subtractively defined by photolithography or laser ablation.

10. The method of claim 1, wherein the coverlay material is additively printed.

11. The method of claim 10 wherein the coverlay material is one of screen printed or ink jet printed.

12. The method of claim 1, including depositing an adhesive layer on the substrate.

13. The method of claim 12, wherein the adhesive layer includes one or more of chromium or tungsten.

14. The method of claim 12, wherein the adhesive layer is sputter or evaporation deposited on the substrate.

15. The method of claim 1 wherein the gold layer is approximately 40 nm.

16. A method, comprising:

providing a substrate;

forming a plurality of electrodes on the substrate, the electrodes including a thin gold layer on the substrate, the gold layer having a thickness of less than approximately 120 nm, and further, each of the formed plurality of electrodes are co-planar relative to each other; and

providing a coverlay over at least a portion of the each of the plurality of electrodes.

17. The method of claim 16 wherein the substrate includes polyethylene terephthalate.

18. The method of claim 16 wherein the plurality of electrodes includes a working electrode.

19. The method of claim 16 wherein the coverlay is one of laminated or photoexposed on the substrate.

20. The method of claim 16 including forming a sensing layer on the substrate.

21. The method of claim 20 wherein the sensing layer includes an enzyme.

22. The method of claim 21 wherein the enzyme includes one of glucose oxidase or lactate oxidase.

23. The method of claim 16 wherein the gold layer is approximately 40 nm.