WIRELESS IC DEVICE

• US 20090302121A1
• Filed: 08/31/2009
• Published: 12/10/2009
• Est. Priority Date: 04/09/2007
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: SHIOYA, Shigeyuki, DOKAI, Yuya, KATO, Noboru
• Granted Patent: US 8,360,324 B2
• Time in Patent Office: Days
• US Class Current: 235/492
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01Q 1/2208 associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems methods or arrangements for sensing record carriers, e.g. for reading patterns G06K7/00; record carrier for use with machines and with at least a part designed to carry digital markings G06K19/00
• CPC Class Codes: H01Q 1/2225 used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 21/30 Combinations of separate antenna units operating in different wavebands and connected to a common feeder system
• CPC Class Codes: H01Q 9/27 Spiral antennas
• CPC Class Codes: H01Q 9/285 Planar dipole H01Q9/065 takes precedence; patch antenna H01Q9/0407
• CPC Class Codes: H01Q 9/40 Element having extended radiating surface

Abstract

A wireless IC device that is operable in a wide band and is suitable for RFID systems includes a radiating plate and an electromagnetically coupled module constituted by a wireless IC that processes transmitted/received signals and a feeding circuit board having a feeding circuit and coupled with the wireless IC. The radiating plate includes a linear electrode bent at a bent portion and apparently sectioned into two linear electrode portions having different lengths. The electromagnetically coupled module is arranged such that the feeding circuit board and the linear electrode portions are electromagnetically coupled. The wireless IC is operated by signals received by the radiating plate, and response signals from the wireless IC are radiated outward from the radiating plate.

Claims

1. A wireless IC device comprising:

a radiating plate including a linear electrode bent at a predetermined position so as to be apparently sectioned into two linear electrode portions having different lengths, both ends of the linear electrode being open;

a wireless IC arranged to process transmitted/received signals; and

a feeding circuit board including a feeding circuit arranged to match impedance of the wireless IC with impedance of the radiating plate and/or set resonant frequencies of the transmitted/received signals;

wherein

the wireless IC is coupled with the feeding circuit so as to define an electromagnetically coupled module;

the electromagnetically coupled module is arranged such that the feeding circuit board and the two linear electrode portions of the radiating plate are electromagnetically coupled; and

the wireless IC is operated by signals received by the radiating plate, and response signals from the wireless IC are radiated outward from the radiating plate.

2. The wireless IC device according to claim 1, wherein the feeding circuit board includes a multilayer substrate.

3. The wireless IC device according to claim 1, wherein the radiating plate is provided on a flexible substrate.

4. A wireless IC device comprising:

a radiating plate including two linear electrode portions disposed side by side so as to form a helix, both ends of the linear electrode portions being open; and

a wireless IC chip arranged to process transmitted/received signals;

wherein

a terminal electrode of the wireless IC chip is electrically connected to each of the open ends of the linear electrode portions in a central portion of the helix.

5. The wireless IC device according to claim 4, wherein at least one of the linear electrode portions that form the helix extends outward from the helix.

6. The wireless IC device according to claim 5, wherein currents passing through two adjacent linear electrode portions are in phase at the lead portion from which the at least one of the linear electrode portions extends.

7. The wireless IC device according to claim 4, wherein the feeding circuit board includes a multilayer substrate.

8. The wireless IC device according to claim 4, wherein the radiating plate is provided on a flexible substrate.

9. A wireless IC device comprising:

a radiating plate including a linear electrode apparently sectioned into two linear electrode portions disposed side by side so as to form a double helix, both ends of the linear electrode being open;

a wireless IC arranged to process transmitted/received signals; and

a feeding circuit board including a feeding circuit arranged to match impedance of the wireless IC with impedance of the radiating plate and/or set resonant frequencies of the transmitted/received signals;

wherein

the wireless IC is coupled with the feeding circuit so as to form an electromagnetically coupled module;

the electromagnetically coupled module is arranged such that the feeding circuit board and the two linear electrode portions of the radiating plate are electromagnetically coupled; and

the wireless IC is operated by signals received by the radiating plate, and response signals from the wireless IC are radiated outward from the radiating plate.

10. The wireless IC device according to claim 9, wherein at least one of the linear electrode portions that form the double helix extends outward from the helix.

11. The wireless IC device according to claim 10, wherein currents passing through two adjacent linear electrode portions are in phase at the lead portion from which the at least one of the linear electrode portions extends.

12. The wireless IC device according to claim 9, wherein the feeding circuit board includes a multilayer substrate.

13. The wireless IC device according to claim 9, wherein the radiating plate is provided on a flexible substrate.

14. A wireless IC device comprising:

a radiating plate including a linear electrode apparently sectioned into two linear electrode portions disposed side by side so as to form a meandering shape, both ends of the linear electrode being open;

a wireless IC arranged to process transmitted/received signals; and

a feeding circuit board including a feeding circuit arranged to match impedance of the wireless IC with impedance of the radiating plate and/or set resonant frequencies of the transmitted/received signals;

wherein

the wireless IC is coupled with the feeding circuit so as to define an electromagnetically coupled module;

the electromagnetically coupled module is arranged such that the feeding circuit board and the two linear electrode portions of the radiating plate are electromagnetically coupled; and

the wireless IC is operated by signals received by the radiating plate, and response signals from the wireless IC are radiated outward from the radiating plate.

15. The wireless IC device according to claim 14, wherein the feeding circuit board includes a multilayer substrate.

16. The wireless IC device according to claim 14, wherein the radiating plate is provided on a flexible substrate.