LIGHTING DEVICE AND SEMICONDUCTOR LIGHT SOURCE DEVICE

• US 20090302343A1
• Filed: 06/09/2009
• Published: 12/10/2009
• Est. Priority Date: 06/09/2008
• Status: Active Grant

• Current Assignee: Stanley Electric Company Limited
• Original Assignee: Stanley Electric Company Limited
• Inventors: SATO, Masanori, Ebisutani, Takashi
• Granted Patent: US 8,258,527 B2
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: F21S 41/143 the main emission direction of the LED being parallel to the optical axis of the illuminating device
• CPC Class Codes: F21S 41/145 the main emission direction of the LED being opposite to the main emission direction of the illuminating device
• CPC Class Codes: F21S 41/148 the main emission direction of the LED being perpendicular to the optical axis
• CPC Class Codes: F21V 7/0016 on lighting devices that also provide for direct lighting, e.g. by means of independent light sources, by splitting of the light beam, by switching between both lighting modes
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H05K 1/0274 Optical details, e.g. printed circuits comprising integral optical means H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42

Abstract

A small-sized lighting device can achieve wider light distribution patterns. The lighting device can include a semiconductor light emitting element configured to emit light from a first face and a second face thereof. A mounting substrate can be provided on which the semiconductor light emitting element is mounted. Light emitted from the second face can transmit through the mounting substrate, and a first optical system can be provided and configured to impart a first light distribution pattern to the light emitted from the first face of the semiconductor light emitting element. A second optical system can be provided and configured to impart a second light distribution pattern to light emitted from the second face of the semiconductor light emitting element.

Claims

1. A lighting device comprising:

a semiconductor light emitting element having a first face and a second face on an opposite side of the first face, the semiconductor light emitting element configured to emit light from the first face and the second face;

a mounting substrate on which the semiconductor light emitting element is mounted, the light emitted from the second face being transmitted through the mounting substrate;

a first optical system configured to impart a first light distribution pattern to the light emitted from the first face of the semiconductor light emitting element; and

a second optical system configured to impart a second light distribution pattern to the light emitted from the second face of the semiconductor light emitting element.

2. The lighting device according to claim 1, wherein the mounting substrate has at least one of a transparent portion and a through hole at an area where the semiconductor light emitting element is mounted.

3. The lighting device according to claim 1, wherein the semiconductor light emitting element includes side faces connecting the first and second faces, the side faces including at least one of a reflection film and a white member with high reflectivity.

4. The lighting device according to claim 2, wherein the semiconductor light emitting element includes side faces connecting the first and second faces, the side faces including at least one of a reflection film and a white member with high reflectivity.

5. The lighting device according to claim 1, further comprising:

an optical member configured to control light emitted from the second face of the semiconductor light emitting element, the optical member being disposed at an opposite side of the mounting substrate as compared to a side of the mounting substrate where the semiconductor light emitting element is disposed.

6. The lighting device according to claim 2, further comprising:

an optical member configured to control light emitted from the second face of the semiconductor light emitting element, the optical member being disposed at an opposite side of the mounting substrate as compared to a side of the mounting substrate where the semiconductor light emitting element is disposed.

7. The lighting device according to claim 5, wherein the optical member is configured to at least one of shield and reflect light in a predetermined direction at least in part so as to guide the light toward the second optical system.

8. The lighting device according to claim 6, wherein the optical member is configured to at least one of shield and reflect light in a predetermined direction at least in part so as to guide the light toward the second optical system.

9. The lighting device according to claim 7, wherein the optical member is configured to at least one of shield and reflect light in a light path toward the first optical system at least in part so as to guide the light emitted from the second face, not toward the first optical system, but toward the second optical system.

10. The lighting device according to claim 8, wherein the optical member is configured to at least one of shield and reflect light in a light path toward the first optical system at least in part so as to guide the light emitted from the second face, not toward the first optical system, but toward the second optical system.

11. The lighting device according to claim 1, further comprising:

a wavelength-conversion layer located adjacent at least one of the first face and the second face of the semiconductor light emitting element.

12. The lighting device according to claim 2, further comprising:

a wavelength-conversion layer located adjacent at least one of the first face and the second face of the semiconductor light emitting element.

13. The lighting device according to claim 5, further comprising:

a wavelength-conversion layer provided adjacent at least one of the first face and the second face of the semiconductor light emitting element.

14. The lighting device according to claim 2, further comprising:

a wavelength-conversion layer provided on at least one of,

a face of the mounting substrate where the semiconductor light emitting element is mounted,

a face of the mounting substrate opposite to the face where the semiconductor light emitting element is mounted, and

the through hole formed in the mounting substrate.

15. The lighting device according to claim 11, wherein the wavelength-conversion layer located adjacent at least one of the first face and the second face of the semiconductor light emitting element is configured to wavelength-convert light emitted from at least one of the first face and the second face so as to emit various white light with different color temperatures or chromaticity.

16. The lighting device according to claim 14, wherein the wavelength-conversion layer is configured to wavelength-convert light emitted from at least one of the first face and the second face so as to emit various white light with different color temperatures or chromaticity.

17. The lighting device according to claim 1, further comprising:

a light-shielding member disposed adjacent the first face of the semiconductor light emitting element.

18. The lighting device according to claim 17, wherein the light-shielding member is configured to impart a predetermined low-beam light distribution pattern to light emitted from the first face of the semiconductor light emitting element.

19. The lighting device according to claim 1, wherein the lighting device has an illumination direction, and optical axes of the first and second faces of the semiconductor light emitting element are aligned with the illumination direction of the lighting device,

wherein at least one of the first optical system and the second optical system includes a projection lens configured to allow light from a corresponding one of the first face and the second face to enter, and

wherein the other of the first optical system and the second optical system includes a reflector configured to reflect light from a corresponding one of the first face and the second face in the illumination direction.

20. The lighting device according to claim 19, further comprising:

a wavelength-conversion layer located adjacent at least one of the first face and the second face of the semiconductor light emitting element.

21. The lighting device according to claim 1, wherein the lighting device has an illumination direction, and optical axes of the first and second faces of the semiconductor light emitting element are aligned perpendicular to the illumination direction of the lighting device,

wherein the first optical system includes a reflector configured to reflect light emitted from the first face and a projection lens configured to allow the light reflected by the reflector to enter, and

wherein the second optical system includes a reflector configured to reflect light emitted from the second face in the illumination direction.

22. The lighting device according to claim 21, further comprising:

a movable shutter adjacent the mounting substrate and configured to allow at least one of the first light distribution pattern and the second light distribution pattern to be variable.

23. The lighting device according to claim 21, further comprising:

a wavelength-conversion layer provided adjacent to at least one of the first face and the second face of the semiconductor light emitting element.

24. A semiconductor light source device comprising:

a semiconductor light emitting element having a first face and a second face on an opposite side of the first face, the semiconductor light emitting element configured to emit light from the first face and the second face;

a mounting substrate located adjacent the semiconductor light emitting element such that light emitted from the second face is transmitted through the mounting substrate; and

a wavelength-conversion layer located adjacent at least one of the first face and the second face of the semiconductor light emitting element.

25. The semiconductor light source device according to claim 24, wherein the mounting substrate has a through hole at an area where the semiconductor light emitting element is mounted to the mounting substrate, and the wavelength-conversion layer is disposed within the through hole.