HEAT DISSIPATION DEVICE

• US 20090310304A1
• Filed: 06/13/2008
• Published: 12/17/2009
• Est. Priority Date: 06/13/2008
• Status: Active Grant

• Current Assignee: Foxconn Technology Co., Ltd., Fuzhun Precision Industry Company Limited (Foxconn Technology Co., Ltd.)
• Original Assignee: Foxconn Technology Co., Ltd., Fuzhun Precision Industry Company Limited (Foxconn Technology Co., Ltd.)
• Inventors: GONG, WEI-PING, ZHOU, SHI-WEN, CAO, JUN
• Granted Patent: US 8,047,266 B2
• Time in Patent Office: Days
• US Class Current: 361/696
• CPC Class Codes: H01L 23/467 by flowing gases, e.g. air H01L23/473 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A heat dissipation device includes a first heat sink, a second heat sink located on the first heat sink, a third heat sink located on the second heat sink, and a heat conducting member formed by bending a flat, plate-like member and connecting the first, second and third heat sinks. The heat conducting member includes a heat absorbing section contacting with the first heat sink, and first and second heat dissipating sections extending inwards from upper ends of first and second connecting sections extending upwardly from two ends of the heat absorbing section, respectively. The first heat dissipating section is sandwiched between the first and second heat sinks, and the second heat dissipating section is sandwiched between the second and third heat sinks. A width of the first and second heat dissipating sections is identical to that of the second heat sink.

Claims

1. A heat dissipation device, comprising:

a first heat sink;

a second heat sink located on the first heat sink; and

a heat conducting member formed by bending a flat, plate-shaped member and connecting the first and second heat sinks, the heat conducting member comprising a heat absorbing section contacting with the first heat sink and adapted for connecting with a heat-generating electronic component, and first and second heat dissipating sections extending inwards from two ends of the heat absorbing section, respectively, wherein the first heat dissipating section is sandwiched between the first and second heat sinks, and the second heat dissipating section contacts with a top of the second heat sink.

2. The heat dissipation device as claimed in claim 1, wherein the heat conducting member is formed by bending a copper plate.

3. The heat dissipation device as claimed in claim 1, wherein the heat conducting member is formed by bending a vapor chamber with a work fluid filled therein.

4. The heat dissipation device as claimed in claim 1, wherein the heat conducting member further comprising a first connecting section interconnecting the heat absorbing section and the first heat dissipating section, and a second connecting section interconnecting the heat absorbing section and the second heat dissipating section.

5. The heat dissipation device as claimed in claim 4, wherein the heat absorbing section, the first and second connecting sections and the first and second heat dissipating sections are flat plates, and the heat absorbing section is perpendicular relative to the first and second connecting sections, the first connecting section is perpendicular relative to the first heat dissipating section and the second connecting section is perpendicular relative to the second heat dissipating section.

6. The heat dissipation device as claimed in claim 4, wherein a width of the first and second connecting sections and the first and second heat dissipating sections is identical to that of the second heat sink, and the first and second heat dissipating sections completely cover on tops of the first and second heat sinks respectively.

7. The heat dissipation device as claimed in claim 1, wherein the first heat sink comprises a base and a plurality of fins parallel to each other and arranged on the base, and the second heat sink comprises a plurality of fins parallel to each other.

8. The heat dissipation device as claimed in claim 7, wherein a protrusion extends downwardly from a middle portion of the base, the protrusion contacting with the heat absorbing section of the heat conducting member and a width of the protrusion is identical to that of the heat absorbing section.

9. The heat dissipation device as claimed in claim 1, further comprising a third heat sink located on the second heat sink and contacting with the second heat dissipating section of the heat conducting member.

10. The heat dissipation device as claimed in claim 1, further comprising a fan located at rears of the first and second heat sinks.

11. A heat dissipation device, comprising:

a first heat sink;

a second heat sink located on the first heat sink;

a third heat sink located on the second heat sink; and

a heat conducting member formed by bending a flat, plate-shaped member and connecting the first, second and third heat sinks, the heat conducting member comprising a heat absorbing section contacting with the first heat sink and adapted for connecting with a heat-generating electronic component, and first and second heat dissipating sections extending inwards from two ends of the heat absorbing section, respectively, wherein the first heat dissipating section is sandwiched between the first and second heat sinks, and the second heat dissipating section is sandwiched between the second and third heat sinks, and wherein a width of the first and second heat dissipating sections is identical to that of the second heat sink.

12. The heat dissipation device as claimed in claim 11, wherein the heat conducting member is formed by bending a copper plate.

13. The heat dissipation device as claimed in claim 11, wherein the heat conducting member is formed by bending a vapor chamber with a work fluid filled therein.

14. The heat dissipation device as claimed in claim 11, wherein the heat conducting member further comprising a first connecting section interconnecting the heat absorbing section and the first heat dissipating section and a second connecting section interconnecting the heat absorbing section and the second heat dissipating section.

15. The heat dissipation device as claimed in claim 14, wherein the heat absorbing section, the first and second connecting sections and the first and second heat dissipating sections are flat plates, and the heat absorbing section is perpendicular relative to the first and second connecting sections respectively, the first connecting section is perpendicular relative to the first heat dissipating section and the second connecting section is perpendicular relative to the second heat dissipating section.

16. A heat dissipation device, comprising:

a first heat sink;

a second heat sink located on the first heat sink;

a third heat sink located on the second heat sink; and

a heat conducting member formed by bending a flat, plate-shaped member and connecting the first, second and third heat sinks, the heat conducting member comprising a heat absorbing section contacting with the first heat sink and adapted for connecting with a heat-generating electronic component, and first and second heat dissipating sections extending inwards from two ends of the heat absorbing section, respectively, wherein the first heat dissipating section is sandwiched between the first and second heat sinks, and the second heat dissipating section is sandwiched between the second and third heat sinks.