LIQUID EJECTION HEAD

• US 20090315958A1
• Filed: 06/15/2009
• Published: 12/24/2009
• Est. Priority Date: 06/18/2008
• Status: Active Grant

• Current Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Original Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Inventors: Hatsui, Takuya, Ibe, Satoshi, Sakuma, Sadayoshi, Komuro, Hirokazu
• Granted Patent: US 8,075,107 B2
• Time in Patent Office: Days
• US Class Current: 347/71
• CPC Class Codes: B41J 2/1603 of the front shooter type
• CPC Class Codes: B41J 2/1628 dry etching
• CPC Class Codes: B41J 2/1629 wet etching
• CPC Class Codes: B41J 2/1631 photolithography
• CPC Class Codes: B41J 2/1639 sacrificial molding
• CPC Class Codes: B41J 2/1646 thin film formation by sputtering

Abstract

Provided is a liquid ejection head having a structure in which an organic resinous member is formed in contact with a substrate. The substrate includes heat generators for generating heat energy used to eject ink, when being energized, and a metallic line portion for energizing the heat generators. The organic resinous member is provided with ejection openings corresponding to the heat generators. In the liquid ejection head, the substrate and the organic resinous member have an improved adhesion therebetween, and are prevented from being separated from each other. To improve the adhesion, the metallic line portion is cut so that no line portion exists under an end part of the organic resinous member (nozzle formation member). Then, two members of the line portion thus cut are connected to each other through a roundabout line formed under an insulating layer which has a good adhesion to the organic resin.

Claims

1. A liquid ejection head having an ejection opening which ejects liquid, comprising:

an element substrate provided with, on a surface thereof, an element which generates energy utilized for ejecting liquid; and

a resin layer provided on the surface of the element substrate, the resin layer having a wall for a liquid passage communicated with the ejection opening,

wherein the element substrate has a first electrode layer and a second electrode layer at the surface side, the first electrode layer is provided in such a manner that the first electrode layer is positioned at a portion corresponding to an end of the resin layer with respect to a direction along the surface, and the second electrode layer electrically connected to the first electrode layer is provided on an upper side of the first electrode layer in such a manner that the second electrode layer is not positioned at the portion.

2. A liquid ejection head as claimed in claim 1, wherein an insulating layer having a penetrating portion is provided on the first electrode layer, and the first and second electrode layers are connected to each other through the penetrating portion.

3. A liquid ejection head as claimed in claim 1, wherein the second electrode layer is provided as two members independent of each other, and each of the members is connected to the first electrode layer.

4. A liquid ejection head as claimed in claim 3, wherein the two members of the second electrode layer are separated from each other by 10 μ

m or more but not exceeding 30 μ

m.

5. A liquid ejection head as claimed in claim 3, wherein the resin layer is formed in such a manner that the end of the resin layer is positioned in a vicinity of a center between the two members of the second electrode layer.

6. A liquid ejection head as claimed in claim 3, wherein an insulating layer having two penetrating portions is provided on the first electrode layer, and the two members of the second electrode layer are connected to the first electrode layer through the two penetrating portions.

7. A liquid ejection head as claimed in claim 1, wherein the second electrode layer is formed of any one of Au, Ag, Cu, and Ni.

8. A liquid ejection head having an ejection opening which ejects liquid, comprising:

an element substrate provided with, on a surface thereof, an element which generates energy utilized for ejecting liquid; and

a resin layer provided above the surface of the element substrate, the resin layer having a wall for a liquid passage communicated with the ejection opening,

wherein the element substrate has a first electrode layer and a second electrode layer at the surface side, the first electrode layer is provided in such a manner that the first electrode layer is positioned at a portion corresponding to an end of the resin layer with respect to a direction along the surface, and the second electrode layer electrically connected to the first electrode layer is provided on an upper side of the first electrode layer in such a manner that the second electrode layer is not positioned at the portion, and wherein a adhesion improvement layer is provided in such a manner that the adhesion improvement layer is positioned between the surface of the element substrate and the resin layer to be in contact with them, and is positioned at the portion corresponding to the end of the resin layer.

9. A liquid ejection head as claimed in claim 8, wherein the adhesion improvement layer is formed of a polyetheramide resin.