METHOD FOR PACKAGING A DISPLAY DEVICE AND THE DEVICE OBTAINED THEREOF

• US 20090323165A1
• Filed: 06/25/2008
• Published: 12/31/2009
• Est. Priority Date: 06/25/2008
• Status: Active Grant

• Current Assignee: Snaptrack Incorporated (Qualcomm, Inc.)
• Original Assignee: Qualcomm MEMS Technologies Incorporated (Qualcomm, Inc.)
• Inventors: Sampsell, Jeffrey B.
• Granted Patent: US 7,746,539 B2
• Time in Patent Office: Days
• US Class Current: 359/290
• CPC Class Codes: B81B 2201/047 Optical MEMS not provided for in B81B2201/042 - B81B2201/045
• CPC Class Codes: B81C 1/00317 Packaging optical devices
• CPC Class Codes: B81C 2203/0118 Bonding a wafer on the substrate, i.e. where the cap consists of another wafer
• CPC Class Codes: B81C 2203/051 Active alignment, e.g. using internal or external actuators, magnets, sensors, marks or marks detectors
• CPC Class Codes: G02B 26/001 based on interference in an adjustable optical cavity interference filters G02B5/28; devices or arrangements using multiple reflections in spectrometry or monochromators G01J3/26
• CPC Class Codes: G09G 3/3466 based on interferometric effect
• CPC Class Codes: Y10T 29/49124 On flat or curved insulated base, e.g., printed circuit, etc.

Abstract

A method for packaging a display device and the device obtained thereof are disclosed. In one aspect, the method comprises providing a substrate. The method further comprises manufacturing an array of display elements on a back side of the substrate, the array comprising a plurality of posts between the display elements connecting electrodes of the display elements. The method further comprises providing a back plate. The method further comprises sealing the back plate to the back side of the substrate, wherein one or more posts are in contact with the back plate after sealing the back plate to the back side of the substrate.

Claims

1. A method of packaging a display device, comprising:

providing a substrate;

manufacturing an array of display elements on a back side of the substrate, the array comprising a plurality of posts between the display elements connecting electrodes of the display elements;

providing a back plate; and

sealing the back plate to the back side of the substrate, wherein one or more posts are in contact with the back plate after sealing the back plate to the back side of the substrate.

2. The method of claim 1, wherein each display element comprises a MEMS display element.

3. The method of claim 2, wherein each MEMS display element comprises an interferometric modulator.

4. The method of claim 3, wherein each interferometric modulator comprises:

a cavity defined by a fixed first layer deposited on the substrate and a movable second layer connected to the substrate, each of the first and second layer comprising an electrode;

wherein light incident to the interferometric modulator is interferometrically modulated by the first and second layer.

5. The method of claim 4, wherein the second layer is movable between a first and a second position.

6. The method of claim 5, wherein each interferometric modulator is configured to transmit or absorb a substantial amount of visible light while the second layer is in a second position.

7. The method of claim 5, wherein each interferometric modulator is configured to reflect light of a particular wavelength range while the second layer is in a first position.

8. A display device packaged by the method of claim 1.

9. A method of packaging a display device, comprising:

providing a substrate;

manufacturing an array of display elements on a back side of the substrate comprising suitable landing areas between the display elements and a plurality of posts between the display elements connecting electrodes of the display elements;

providing a back plate comprising a plurality of support posts; and

sealing the back plate to the back side of the substrate by aligning the support posts with the landing areas.

10. The method of claim 9, wherein each display element comprises a MEMS display element.

11. The method of claim 10, wherein the support posts are substantially the same.

12. The method of claim 10, wherein the support posts are of appropriate height such that the posts on the array are not in contact with the back plate.

13. The method of claim 10, wherein each landing area is formed as a hole, and wherein the sealing of the back plate comprises dropping the support posts into the holes of the landing areas.

14. A display device packaged by the method of claim 9.

15. A method of packaging a display device, comprising:

providing a substrate;

manufacturing an array of display elements on a back side of the substrate comprising a plurality of support posts between the display elements and a plurality of connection posts between the display elements connecting electrodes of the display elements;

providing a back plate; and

sealing the back plate to the back side of the substrate.

16. The method of claim 15, wherein each display element comprises a MEMS display element.

17. The method of claim 16, wherein the support posts are substantially the same.

18. The method of claim 16, wherein the support posts are of appropriate height such that the connection posts on the array are not in contact with the back plate.

19. A display device packaged by the method of claim 15.

20. A display device, comprising:

a front panel comprising an array of display elements on a back side of a substrate, the array comprising a plurality of posts between the display elements connecting electrodes of the display elements; and

a back plate sealed to the back side of the substrate,

wherein at least one of the posts is in contact with the back plate.

21. A display device, comprising:

a front panel comprising an array of display elements on a back side of a substrate, the array comprising suitable landing areas between the display elements and a plurality of posts between the display elements connecting electrodes of the display elements; and

a back plate sealed to the back side of the substrate, the back plate comprising a plurality of support posts,

wherein at least one of the support posts is in contact with one of the landing areas.

22. The device of claim 21, wherein each display element comprises a MEMS display element.

23. The device of claim 22, wherein the support posts align with the landing areas.

24. The device of claim 22, wherein the support posts are substantially the same.

25. The device of claim 22, wherein the support posts are of appropriate height such that the posts on the array are not in contact with the back plate.

26. The device of claim 22, wherein each landing area is formed as a hole, wherein the support posts are dropped into the holes of the landing areas.

27. A display device, comprising:

a front panel comprising an array of display elements on a back side of a substrate, the array comprising a plurality of support posts between the display elements and a plurality of connection posts between the display elements connecting electrodes of the display elements; and

a back plate sealed to the back side of the substrate,

wherein at least one of the support posts is in contact with the back plate.

28. The device of claim 27, wherein each display element comprises a MEMS display element.

29. The device of claim 28, wherein the support posts are substantially the same.

30. The device of claim 28, wherein the support posts are of appropriate height such that the connection posts on the array are not in contact with the back plate.

31. The device of claim 28, further comprising:

a display;

a processor that is configured to communicate with said display, said processor being configured to process image data; and

a memory device that is configured to communicate with said processor.

32. The device of claim 31, further comprising a driver circuit configured to send at least one signal to the display.

33. The device of claim 32, further comprising a controller configured to send at least a portion of the image data to the driver circuit.

34. The device of claim 31, further comprising an image source module configured to send said image data to said processor.

35. The device of claim 34, wherein the image source module comprises at least one of a receiver, transceiver, and transmitter.

36. The device of claim 31, further comprising an input device configured to receive input data and to communicate said input data to said processor.

37. A display device, comprising:

means for modulating light comprising an array of display elements;

means for supporting the modulating means, wherein the modulating means is configured to modulate light transmitted through the supporting means;

means for enclosing the modulating means; and

means for providing support to said enclosing means when the enclosing means is joined to the supporting means to form a package.

38. The device of claim 37, wherein the supporting means comprises a transparent substrate.

39. The device of claim 37, wherein the modulating means comprises an array of interferometric modulators.

40. The device of claim 37, wherein the enclosing means comprises a back plate.

41. The device of claim 39, wherein the providing means comprises a plurality of support posts on the enclosing means, the support posts being aligned to landing areas between the interferometric modulators.

42. The device of claim 39, wherein the providing means comprises a plurality of posts between the interferometric modulators.

43. The device of claim 42, wherein the posts are further configured to connect electrodes of the interferometric modulators.