×

METHODS FOR PRINTING AN INK ON A TEXTURED WAFER SURFACE

  • US 20090325336A1
  • Filed: 04/24/2008
  • Published: 12/31/2009
  • Est. Priority Date: 04/24/2008
  • Status: Active Grant
First Claim
Patent Images

1. A method of coating a wafer with an ink, the wafer including a surface with a set of non-rounded peaks and a set of non-rounded valleys, wherein each non-rounded peak of the set of non-rounded peaks includes a first apex surface area, wherein each non-rounded valley of the set of non-rounded valleys is defined between two proximally located non-rounded peaks, and wherein each non-rounded valley further includes a first valley surface area, comprising,exposing the wafer including at least some of the non-rounded peaks and at least some of the non-rounded valleys in a region to an etchant, wherein a set of rounded peaks and a set of rounded valleys are formed, each rounded peak of the set of rounded peaks having a second apex surface area smaller than the first apex surface area, each rounded valley of the set of the rounded valleys having a second valley surface area smaller than the first valley surface area;

  • and,depositing the ink on the region.

View all claims
  • 2 Assignments
Timeline View
Assignment View
    ×
    ×