METHODS FOR PRINTING AN INK ON A TEXTURED WAFER SURFACE
First Claim
1. A method of coating a wafer with an ink, the wafer including a surface with a set of non-rounded peaks and a set of non-rounded valleys, wherein each non-rounded peak of the set of non-rounded peaks includes a first apex surface area, wherein each non-rounded valley of the set of non-rounded valleys is defined between two proximally located non-rounded peaks, and wherein each non-rounded valley further includes a first valley surface area, comprising,exposing the wafer including at least some of the non-rounded peaks and at least some of the non-rounded valleys in a region to an etchant, wherein a set of rounded peaks and a set of rounded valleys are formed, each rounded peak of the set of rounded peaks having a second apex surface area smaller than the first apex surface area, each rounded valley of the set of the rounded valleys having a second valley surface area smaller than the first valley surface area;
- and,depositing the ink on the region.
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Accused Products
Abstract
A method of printing an ink on a wafer surface configured with a set of non-rounded peaks and a set of non-rounded valleys is disclosed. The method includes exposing the wafer including at least some non-rounded peaks and at least some of the non-rounded valleys in a region to an etchant. The method further includes depositing the ink on the region, wherein a set of rounded peaks and a set of rounded valleys are formed.
49 Citations
24 Claims
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1. A method of coating a wafer with an ink, the wafer including a surface with a set of non-rounded peaks and a set of non-rounded valleys, wherein each non-rounded peak of the set of non-rounded peaks includes a first apex surface area, wherein each non-rounded valley of the set of non-rounded valleys is defined between two proximally located non-rounded peaks, and wherein each non-rounded valley further includes a first valley surface area, comprising,
exposing the wafer including at least some of the non-rounded peaks and at least some of the non-rounded valleys in a region to an etchant, wherein a set of rounded peaks and a set of rounded valleys are formed, each rounded peak of the set of rounded peaks having a second apex surface area smaller than the first apex surface area, each rounded valley of the set of the rounded valleys having a second valley surface area smaller than the first valley surface area; - and,
depositing the ink on the region. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
- and,
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13. A method of coating a wafer with an ink, the wafer including a surface with a set of non-rounded peaks and a set of non-rounded valleys, wherein each non-rounded peak of the set of non-rounded peaks includes a first apex surface area, wherein each non-rounded valley of the set of non-rounded valleys is defined between two proximally located non-rounded peaks, and wherein each non-rounded valley further includes a first valley surface area, comprising:
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heating a region including at least some of the set of non-rounded peaks and the set of non-rounded valleys with a set of laser pulses from a laser apparatus, wherein each laser pulse of the set of laser pulses has a pulse duration, a fluence, and a wavelength, wherein a set of rounded peaks and a set of rounded valleys are formed, each rounded peak of the set of rounded peaks having a second apex surface area smaller than the first apex surface area, each rounded valley of the set of the rounded valleys having a second valley surface area smaller than the first valley surface area; and
,depositing the ink on the region. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21, 22, 23)
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24. A method of coating a wafer with an ink, the wafer including a surface with a set of non-rounded peaks and a set of non-rounded valleys, wherein each non-rounded peak of the set of non-rounded peaks includes a first apex surface area, wherein each non-rounded valley of the set of non-rounded valleys is defined between two proximally located non-rounded peaks, and wherein each non-rounded valley further includes a first valley surface area, comprising:
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exposing the wafer including at least some non-rounded peaks and at least some of the non-rounded valleys in a region to an etchant, wherein the set of non-rounded peaks and the set of non rounded valleys are substantially removed; and depositing the ink on the region.
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Specification