HEAT SINK FOR NONINVASIVE MEDICAL SENSOR

• US 20100004518A1
• Filed: 07/02/2009
• Published: 01/07/2010
• Est. Priority Date: 07/03/2008
• Status: Abandoned Application

• Current Assignee: Masimo Corporation
• Original Assignee: Masimo Laboratories, Inc. (Masimo Corporation)
• Inventors: Kiani, Massi Joe E., Lesmana, Ferdyan, Bruinsma, Johannes, Merritt, Sean, Vo, Hung, Lamego, Marcelo, Poeze, Jeroen, Dalvi, Cristiano, Olsen, Greg
• Application Number:
  US12/497,506
• Publication Number:
  US 20100004518A1
• Time in Patent Office: Days
• US Class Current: 600/310
• CPC Class Codes: A61B 2562/0233 Special features of optical sensors or probes classified in A61B5/00
• CPC Class Codes: A61B 2562/04 Arrangements of multiple sensors of the same type
• CPC Class Codes: A61B 2562/046 in a matrix array
• CPC Class Codes: A61B 2562/146 for optical coupling
• CPC Class Codes: A61B 5/02416 using photoplethysmograph signals, e.g. generated by infrared radiation A61B5/14552 takes precedence
• CPC Class Codes: A61B 5/02427 Details of sensor
• CPC Class Codes: A61B 5/14532 for measuring glucose, e.g. by tissue impedance measurement
• CPC Class Codes: A61B 5/14546 for measuring analytes not otherwise provided for, e.g. ions, cytochromes
• CPC Class Codes: A61B 5/1455 using optical sensors, e.g. spectral photometrical oximeters
• CPC Class Codes: A61B 5/14551 for measuring blood gases
• CPC Class Codes: A61B 5/14552 Details of sensors specially adapted therefor
• CPC Class Codes: A61B 5/4875 Hydration status, fluid retention of the body
• CPC Class Codes: A61B 5/6816 Ear lobe
• CPC Class Codes: A61B 5/6826 Finger
• CPC Class Codes: A61B 5/6829 Foot or ankle
• CPC Class Codes: A61B 5/6838 Clamps or clips
• CPC Class Codes: A61B 5/6843 Monitoring or controlling sensor contact pressure
• CPC Class Codes: A61B 5/70 Means for positioning the patient in relation to the detecting, measuring or recording means
• CPC Class Codes: A61B 5/7275 Determining trends in physiological measurement data; Predicting development of a medical condition based on physiological measurements, e.g. determining a risk factor

Abstract

A noninvasive physiological sensor for measuring one or more physiological parameters of a medical patient can include a bump interposed between a light source and a photodetector. The bump can be placed in contact with body tissue of a patient and thereby reduce a thickness of the body tissue. As a result, an optical pathlength between the light source and the photodetector can be reduced. In addition, the sensor can include a heat sink that can direct heat away from the light source. Moreover, the sensor can include shielding in the optical path between the light source and the photodetector. The shielding can reduce noise received by the photodetector.

Claims

1. A physiological sensor capable of outputting a signal responsive to a blood analyte present in a monitored patient, the sensor comprising:

a sensor housing comprising an optical source configured to emit optical radiation on a body tissue of a medical patient;

a heat sink associated with the sensor, the heat sink operative to receive thermal energy from the optical source and release thermal energy outside of the sensor housing; and

a plurality of photodetectors each configured to detect the optical radiation from the optical source after attenuation by the body tissue of the medical patient and to output a signal responsive to the detected optical radiation, the signal reflecting one or more physiological parameters of the medical patient.

2. The sensor of claim 1, wherein the heat sink is at least partially exposed to air when the sensor is applied to the patient.

3. The sensor of claim 1, wherein the heat sink comprises a conductive shield of a medical cable, the conductive shield being in electrical communication with a substrate, the substrate being in electrical communication with the optical source.

4. The sensor of claim 3, further comprising an insulator connected to the substrate.

5. The sensor of claim 1, further comprising a heat sink layer in electrical communication with the substrate and the conductive shielding.

6. The sensor of claim 5, further comprising an insulator connected to the substrate and to the heat sink layer.

7. The sensor of claim 1, wherein the heat sink comprises one or more fins.

8. The sensor of claim 1, wherein the heat sink comprises a comb.

9. The sensor of claim 1, wherein the heat sink comprises a metalicized plastic.

10. The sensor of claim 1, wherein the heat sink comprises carbon and aluminum material.

11. A physiological sensor capable of outputting a signal responsive to a blood analyte present in a monitored patient, the sensor comprising:

a sensor housing comprising an optical source configured to emit optical radiation on a body tissue of a medical patient, the optical source comprising one or more emitters disposed on a submount;

a conductive shield of a medical cable configured to be in electrical communication with the submount, such that the conductive shield acts at least in part as a heat sink for the one or more emitters; and

a plurality of photodetectors each configured to detect the optical radiation from the optical source after attenuation by the body tissue of the medical patient and to output a signal responsive to the detected optical radiation, the signal reflecting one or more physiological parameters of the medical patient.

12. The sensor of claim 11, wherein the conductive shield is soldered to the submount.

13. The sensor of claim 11, further comprising a heat sink layer connected to the submount.

14. The sensor of claim 13, wherein the conductive shield is soldered to the heat sink layer.

15. A heat sink of a noninvasive optical medical sensor capable of detecting light attenuated by body tissue, the heat sink comprising:

a heat producing part of an electronic device; and

a cable in thermal communication with the heat producing part, the cable comprising a conductor configured to draw heat from the heat producing part.

16. The heat sink of claim 15, wherein the conductor comprises shielding.

17. The heat sink of claim 15, wherein a portion of the shielding is thermally coupled with the heat producing part.

18. The heat sink of claim 15, wherein the conductor comprises a wire of a twisted pair of wires.

19. The heat sink of claim 15, further comprising a heat sink layer in thermal communication with the heat producing part and with the conductor.

20. The heat sink of claim 15, wherein the heat producing part comprises an emitter of an optical sensor.

21. The heat sink of claim 20, wherein the conductor is soldered to a submount of the emitter.