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Semiconductor device and method of manufacturing the same

  • US 20100007035A1
  • Filed: 07/07/2009
  • Published: 01/14/2010
  • Est. Priority Date: 07/09/2008
  • Status: Active Grant
First Claim
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1. A semiconductor device, comprising:

  • a substrate;

    an alignment mark formed on said substrate and composed of a metal film;

    a cover insulating film formed on said alignment mark and covering an entire surface of said alignment mark; and

    a polyimide film formed on said cover insulating film, and having an opening, which is opened on said alignment mark and has an end face aligning with an end face of said alignment mark, in plan view.

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