Electrophoretic display device and packing structure thereof

• US 20100013756A1
• Filed: 12/24/2008
• Published: 01/21/2010
• Est. Priority Date: 07/18/2008
• Status: Abandoned Application

• Current Assignee: LG Display Co., Ltd.
• Original Assignee: LG Display Co., Ltd.
• Inventors: Park, Sang-Hyun
• Application Number:
  US12/318,300
• Publication Number:
  US 20100013756A1
• Time in Patent Office: Days
• US Class Current: 345/107
• CPC Class Codes: G02F 1/13452 Conductors connecting driver circuitry and terminals of panels
• CPC Class Codes: G02F 1/167 by electrophoresis
• CPC Class Codes: G02F 1/16753 Structures for supporting or mounting cells, e.g. frames or bezels
• CPC Class Codes: G02F 2202/28 Adhesive materials or arrangements

Abstract

An electrophoretic display device includes: an electrophoretic display panel; a COF (Chip On Film) attached to at least one side of the display panel and having a driving element mounted thereon; and a support frame installed on a rear surface of the electrophoretic display panel, wherein the COF is attached to the support frame through a double-sided tape.

Claims

1. An electrophoretic display device comprising:

an electrophoretic display panel;

a COF (Chip On Film) attached to at least one side of the display panel and having a driving element mounted thereon; and

a support frame installed on a rear surface of the electrophoretic display panel,

wherein the COF is attached to the support frame through a double-sided tape.

2. The device of claim 1, wherein the electrophoretic display panel comprises:

first and second substrates;

a thin film transistor (TFT) formed on the first substrate;

a pixel electrode formed on the first substrate and receiving a signal via the TFT;

a common electrode formed on the second substrate; and

an electronic ink layer formed between the first and second substrates and including capsules including white particles and black particles which are moved according to application of a signal to thus implement an image.

3. The device of claim 1, wherein the support frame is a mold frame.

4. The device of claim 3, wherein the electrophoretic display panel is supported by a main support, and the support frame is installed on a rear surface of the main support.

5. The device of claim 1, wherein the support frame is installed along at least one side of the electrophoretic display panel.

6. The device of claim 1, wherein the support frame is coupled to the rear surface of the electrophoretic display panel by a screw or a double-sided tape.

7. The device of claim 1, wherein the COF comprises:

a TCP (Taped Carrier Package) with a driving element and wirings formed thereon; and

a PCB (Printed Circuit Board) with electronic components mounted thereon

8. A packing structure of an electrophoretic display device, comprising:

an electrophoretic display device comprising an electrophoretic display panel, a COF (Chip On Film) attached to at least one side of the display panel and having a driving element mounted thereon, and a support frame installed on a rear surface of the electrophoretic display panel; and

a packing material for packing the electrophoretic display device,

wherein the COF of the electrophoretic display device is attached to the support frame by a double-sided tape to prevent an impact from being applied to the COF due to wobbling of the electrophoretic display device packed by the packing material.