MICROELECTROMICHANICAL SYSTEM PACKAGE WITH STRAIN RELIEF BRIDGE

• US 20100038733A1
• Filed: 08/14/2008
• Published: 02/18/2010
• Est. Priority Date: 08/14/2008
• Status: Active Grant

• Current Assignee: Knowles Electronics Llc (Knowles Corporation)
• Original Assignee: Knowles Electronics Llc (Knowles Corporation)
• Inventors: Minervini, Anthony
• Granted Patent: US 8,450,817 B2
• Time in Patent Office: Days
• US Class Current: 257/416
• CPC Class Codes: B81B 2201/0257 Microphones or microspeakers
• CPC Class Codes: B81B 2201/0264 Pressure sensors
• CPC Class Codes: B81B 2203/0109 Bridges
• CPC Class Codes: B81B 7/0048 between the MEMS die and the substrate
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H04R 1/04 Structural association of microphone with electric circuitry therefor in deaf-aid sets H04R25/00
• CPC Class Codes: H04R 2201/003 Mems transducers or their use of the electrostatic type H04R19/005

Abstract

A strain absorption bridge for use in a MEMS package includes a first substrate that is configured to be attachable to a circuit board. A first elastically deformable element is coupled to the first substrate and the first elastically deformable element is configured to be attachable to a MEMS device. Alternatively, the MEMS device may be attached to the first substrate. The elastically deformable element at least partially absorbs and dissipates mechanical strain communicated from the circuit board before the mechanical strain can reach the MEMS device.

Claims

1. A strain absorption bridge for use in a MicroElectroMechanical System (MEMS) package comprising:

a first substrate;

a second substrate;

a elastically deformable element positioned between the first substrate and the second substrate, the elastically deformable element being connectable to a MEMS device;

a plurality of contact members applied to the first substrate and the second substrate, the plurality of contact members at least partially surrounding the elastically deformable element, the plurality of contact members being connectable to a circuit board; and

wherein the elastically deformable element at least partially absorbs and dissipates mechanical strain communicated from the circuit board before the mechanical strain can reach the MEMS device.

2. The strain absorption bridge of claim 1 wherein the first substrate is ring-shaped and defines a first opening extending to the elastically deformable element and the second substrate is ring-shaped and defines a second opening extending to the elastically deformable element.

3. The strain absorption bridge of claim 1 wherein the elastically deformable element defines at least one opening and the at least one opening completely extends through the elastically deformable element.

4. The strain absorption bridge of claim 3 wherein the elastically deformable element further comprises an environmental layer that prevents at least some debris from traversing the at least one opening.

5. The strain absorption bridge of claim 4 wherein the environmental layer comprises a material selected from a group comprising:

a perforated polyimide material, a poly-tetrafluoro-ethylene (PTFE) material, a porous aluminum material, and a micromesh metal material.

6. The strain absorption bridge of claim 1 wherein the first substrate is ring shaped and defines an opening extending to the elastically deformable element, and the MEMS device resides in the opening and is coupled therein to the elastically deformable element.

7. The strain absorption bridge of claim 6 wherein the bridge resides over a opening in the circuit board such that the MEMS device resides at least partially in the opening.

8. The strain absorption bridge of claim 1 wherein the elastically deformable element further comprises an acoustic port and the MEMS device communicates with the port.

9. The strain absorption bridge of claim 1 wherein the elastically deformable element is an material selected from a group comprising a polyimide material and a poly-tetrafluoro-ethylene (PTFE) material.

10. The strain absorption bridge of claim 1 further comprising a plurality of sealing rings, the plurality of sealing rings being coupled to the first substrate and the circuit board.

11. The strain absorption bridge of claim 1 further comprising at least one conductive layer.

14. The MEMS package of claim 10 wherein the MEMS device is a microphone.

15. The MEMS package of claim 10 wherein the circuit board defines an opening and the bridge member at least partially covers the opening.

16. The MEMS package of claim 15 wherein the MEMS device at least partially resides within the opening in the circuit board.

12. A MicroElectroMechanical System (MEMS) package comprising:

a MEMS device;

a circuit board; and

a elastically deformable bridge member coupled to the MEMS device and the circuit board, the elastically deformable bridge member at least partially absorbing and dissipating mechanical strain communicated from the circuit board to the elastically deformable bridge member before the mechanical strain can reach the MEMS device.

13. The MEMS package of claim 12 wherein the elastically deformable bridge member comprises:

a first substrate;

a second substrate; and

a elastically deformable element residing between the first substrate and the second substrate, the elastically deformable element being coupled to the MEMS device;

a plurality of contact members applied to the first substrate and the second substrate, the plurality of contact members at least partially surrounding the elastically deformable element, the plurality of contact members being coupled to the circuit board.

17. A method for manufacturing a MicroElectroMechanical (MEMS) package comprising:

forming a first substrate and a second substrate;

forming a elastically deformable element between the first substrate and the second substrate;

coupling a MEMS device to the elastically deformable element;

applying a plurality of contact members to the first substrate and the second substrate so as to at least partially surround the elastically deformable element; and

attaching a circuit board to the contact members.

18. The method of claim 17 further comprising forming a plurality of openings extending through the elastically deformable element.

19. The method of claim 18 wherein forming a elastically deformable element comprises forming an environmental layer that provides at least a partial barrier in at least one of the plurality of openings.

20. The method of claim 17 further comprising forming an acoustic port in the elastically deformable element that communicates with the MEMS device.

21. A strain absorption bridge for use in a MicroElectroMechanical System (MEMS) package comprising:

a first substrate configured to be attachable to a circuit board;

a first elastically deformable element coupled to the first substrate, the first elastically deformable element configured to be attachable to a MicroElectroMechanical (MEMS) device; and

wherein the elastically deformable element at least partially absorbs and dissipates mechanical strain communicated from the circuit board before the mechanical strain can reach the MEMS device.

22. The strain absorption bridge of claim 21 wherein the first substrate is ring-shaped and defines a first opening extending to the circuit board.

23. The strain absorption bridge of claim 21 further comprising a housing, the housing being coupled to the first substrate.

24. The strain absorption bridge of claim 21 further comprising a housing, the housing being coupled to the first elastically deformable element.

25. The strain absorption bridge of claim 21 further comprising a second elastically deformable element that is arranged to at least partially enclose the MEMS device and the first elastically deformable element.

26. The strain absorption bridge of claim 25 further comprising a second substrate that is coupled to the first substrate and wherein the second elastically deformable element is supported by the second substrate.

27. The strain absorption bridge of claim 21 further comprising a second substrate, and wherein the first elastically deformable element is coupled to the first substrate and the second substrate.

28. A strain absorption bridge for use in a MicroElectroMechanical System (MEMS) package comprising:

a first substrate wherein the first substrate is configured to be coupled to a MicroElectroMechanical (MEMS) device; and

a first elastically deformable element coupled to the first substrate and which at least partially absorbs and dissipates mechanical strain communicated from a circuit board before the mechanical strain can reach the MEMS device.

29. The strain absorption bridge of claim 28 wherein the first elastically deformable element defines an opening extending to the first substrate.

30. The strain absorption bridge of claim 28 wherein the first elastically deformable element is configured to be coupled to the circuit board.

31. The strain absorption bridge of claim 30 further comprising a second elastically deformable element that at least partially encloses the first elastically deformable element.

32. The strain absorption bridge of claim 28 further comprising a housing that is configured to enclose the MEMS device.

33. The strain absorption bridge of claim 28 further comprising a second substrate, wherein the first elastically deformable element is configured to be coupled to the second substrate.

34. The strain absorption bridge of claim 33 further comprising a second elastically deformable element that at least partially encloses the MEMS device.

35. The strain absorption bridge of claim 34 wherein the second elastically deformable element is coupled to the second substrate.

36. The strain absorption bridge of claim 34 wherein the second elastically deformable element is coupled to the first substrate.

37. The strain absorption bridge of claim 28 further comprising a housing and wherein the housing is coupled to the first substrate and at least partially encloses the MEMS device.