Piezoelectric component and manufacturing method thereof

• US 20100045145A1
• Filed: 08/04/2009
• Published: 02/25/2010
• Est. Priority Date: 08/19/2008
• Status: Abandoned Application

• Current Assignee: Nihon Dempa Kogyo Company Limited
• Original Assignee: Nihon Dempa Kogyo Company Limited
• Inventors: Tsuda, Toshimasa
• Application Number:
  US12/462,477
• Publication Number:
  US 20100045145A1
• Time in Patent Office: Days
• US Class Current: 310/365
• CPC Class Codes: H03H 2009/0019 Surface acoustic wave multichip
• CPC Class Codes: H03H 3/08 for the manufacture of resonators or networks using surface acoustic waves
• CPC Class Codes: H03H 9/059 consisting of mounting pads or bumps
• CPC Class Codes: H03H 9/1085 the enclosure being defined by a non-uniform sealing mass covering the non-active sides of the BAW device
• CPC Class Codes: Y10T 29/42 Piezoelectric device making

Abstract

An object of the present invention is to; miniaturize, increase the capacity, and reduce the price of piezoelectric components. The present invention relates to a piezoelectric component and a manufacturing method thereof, characterized in that: there are bonded and laminated at least two or more piezoelectric elements in which comb-teeth electrodes, wiring electrodes having element wirings that are arranged adjacent to the comb-teeth electrodes, and electrode terminals connected to the wiring electrodes, are formed on a principal surface of a plurality of piezoelectric substrates, while forming hollow sections between the respective piezoelectric elements; through electrodes are formed in the respective piezoelectric substrates so as to pass therethrough; the through electrodes are connected to the electrode terminals; and the piezoelectric substrates are sealed by a resin sealing layer.

Claims

1. A piezoelectric component comprising:

at least bonded and laminated two or more piezoelectric elements in which comb-teeth electrodes, wiring electrodes having element wirings that are arranged adjacent to the comb-teeth electrodes, and electrode terminals connected to the wiring electrodes, are formed on a principal surface of a piezoelectric substrate, hollow sections formed between said respective piezoelectric elements; and

through electrodes formed in said respective piezoelectric substrates so as to pass therethrough;

in which said through electrodes are connected to said electrode terminals; and

said piezoelectric substrates are sealed by a resin sealing layer.

2. A piezoelectric component according to claim 1, wherein terminal electrodes for surface mounting are provided on a bottom end of said through electrodes.

3. A piezoelectric component according to claim 1, wherein:

there are provided a plurality of said through electrodes;

on an active surface of said piezoelectric element and on a back surface side of said piezoelectric element, there are respectively provided wiring electrodes to serve as inductor components; and

with use of these inductor components, piezoelectric elements are combined to constitute an impedance circuit.

4. A piezoelectric component according to claim 1, wherein on an outer wall surface of said sealing resin and on surfaces of said comb-teeth electrodes and said wiring electrodes, there is formed a metallic layer whose primary component is gold.

5. A piezoelectric component according to claim 1, wherein at least one piezoelectric substrate of said piezoelectric substrates is formed from;

silica glass, epoxy resin, polyimide resin, cardo resin, fluorine resin, or Si.

6. A piezoelectric component according to claim 1, wherein said piezoelectric element is a SAW element.

7. A piezoelectric component according to claim 1, wherein said piezoelectric element is an FBAR.

8. A piezoelectric component according to claim 1, wherein said piezoelectric element is an MEMS.

9. A piezoelectric component according to claim 1, wherein said element wirings are formed from:

a material whose primary component is any one of Al, Cu, Au, Cr, Ru, Ni, Ti, W, V, Ta, Mo, Ag, In, and Sn;

an alloy of these materials;

or wirings laminated in multiple layers.

10. A piezoelectric component according to claim 1, wherein said piezoelectric substrate is a piezoelectric substrate of LiTaO₃, LiNbO₃, quartz, or the like, or is a piezoelectric substrate having a piezoelectric function formed on said piezoelectric substrate.

11. A piezoelectric component manufacturing method comprising the steps of:

preparing a piezoelectric substrate having comb-teeth electrodes and wiring electrodes formed on a principal surface thereof, and forming a protective film on the principal surface;

removing, by means of photolithography and dry etching, said protective film on the surface of said comb-teeth electrodes and said wiring electrode sections thereby exposing them;

forming a seed layer on the surface of said wiring electrode sections by means of photolithography;

applying Cu and Sn electrolytic plating on said seed layer;

laminating a cover film on an entire surface, on which said electrolytic plating has been applied;

grinding a back surface of said piezoelectric substrate by a predetermined amount, and after thinning the thickness thereof, further applying sandblasting on the back surface;

forming partial through holes in the back surface of said piezoelectric substrate by means of photolithography and sandblasting;

forming further complete through holes by any one of or a combination of wet etching, sandblasting, excimer laser, and dry etching;

removing the photoresist remaining on the back surface of said piezoelectric substrate, and then forming a seed layer on said wiring electrodes;

forming cavities for forming wiring electrodes, electrode terminals, and through electrodes, by means of photolithography, and applying electrolytic Cu plating to the cavities, thereby forming said wiring electrodes, said electrode terminals, and said through electrodes;

removing the photoresist, and removing said seed layer by means of etching;

laminating at least two of the piezoelectric substrates that have been processed in said respective previous steps, while the piezoelectric element formation surfaces thereof are made to face each other, and bonding them on another piezoelectric substrate that has already been patterned;

sequentially affixing a heat resistant tape and a dicing film on a bottom surface of said bonded piezoelectric substrate, and then dividing only said bonded piezoelectric substrate into individual pieces by means of dicing;

removing said dicing film, and then laminating and thereby resin-sealing with a resin film, the piezoelectric substrate that has been divided into individual pieces; and

dividing the resin-sealed piezoelectric substrate into individual piezoelectric components by means of dicing.

12. A piezoelectric component manufacturing method according to claim 11, wherein said through electrode is formed by any one of;

plating, filling with melted solder, or filling with an electrode paste.

13. A piezoelectric component manufacturing method according to claim 11, wherein bonding of said piezoelectric substrates is achieved by any one of:

Au—

Au thermocompression bonding;

solid-phase diffusion bonding of Cu—

Sn—

Cu or Au—

In metal;

soldering with Au—

Sn, Au—

Ge, Au—

Si, or Sn—

Ag—

Cu based solder; and

cold bonding based on ion beam activation with use of Cu, Ag, or Au.

14. A piezoelectric component manufacturing method according to claim 11, characterized in protecting a piezoelectric element active surface of said piezoelectric substrate with a protective tape, and then thinning by grinding a back surface of said piezoelectric substrate with a diamond grinding wheel or the like.

15. A piezoelectric component manufacturing method according to claim 11, wherein grinding a back surface of said piezoelectric substrate and then roughening the back surface by sandblasting.

16. A piezoelectric component manufacturing method according to claim 11, wherein combining said piezoelectric substrate and then thinning said back surface by grinding.

17. A piezoelectric component manufacturing method according to claim 11, wherein before combining said piezoelectric substrate, thinning said back surface by grinding.

18. A piezoelectric component manufacturing method according to claim 11, wherein forming said through electrode by plating, after laminating said piezoelectric substrate.

19. A piezoelectric component manufacturing method according to claim 11, wherein using a solution of HF and HNO₃ in said wet etching.