WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

• US 20100065320A1
• Filed: 12/06/2007
• Published: 03/18/2010
• Est. Priority Date: 12/07/2006
• Status: Abandoned Application

• Current Assignee: NEC Corporation
• Original Assignee: NEC Corporation
• Inventors: Urano, Wataru
• Application Number:
  US12/517,286
• Publication Number:
  US 20100065320A1
• Time in Patent Office: Days
• US Class Current: 174/261
• CPC Class Codes: D03D 1/0082 Fabrics for printed circuit boards
• CPC Class Codes: D03D 1/0088 Fabrics having an electronic function
• CPC Class Codes: D03D 15/67 Metal wires
• CPC Class Codes: D10B 2101/20 Metallic fibres
• CPC Class Codes: D10B 2401/16 antistatic; conductive
• CPC Class Codes: H05K 1/038 Textiles used as reinforcing materials for organic insulating substrates H05K1/0366
• CPC Class Codes: H05K 2201/0281 Conductive fibers
• CPC Class Codes: H05K 2201/029 Woven fibrous reinforcement or textile textile substrates H05K1/038
• CPC Class Codes: H05K 2203/107 Using laser light shaping a substrate by laser ablation H05K3/0026
• CPC Class Codes: H05K 2203/1189 Pressing leads, bumps or a die through an insulating layer
• CPC Class Codes: H05K 3/3457 Solder materials or compositions; Methods of application thereof
• CPC Class Codes: H05K 3/4084 by deforming at least one of the conductive layers
• CPC Class Codes: Y10T 29/49162 by using wire as conductive path

Abstract

Disclosed is a wiring board comprising a plurality of conductors (11) having a conductive member including first conductive material (1) and second conductive material (2), and insulating member (3) covering the conductive member. A plurality of conductors (11) are arranged lattice-like and are weaved like a woven cloth, and sections intersecting with each other are electrically connected.

Claims

1. A wiring board, comprising a plurality of conductors having a conductive member including a first conductive material and a second conductive material, and an insulating member covering the conductive member, wherein

the plurality of conductors being arranged lattice-like and weaved like a woven cloth, sections intersecting with each other being electrically connected.

2. The wiring board according to claim 1, wherein

the first conductive material and the second conductive material of the conductive member constitute a two-layered structure.

3. The wiring board according to claim 1, wherein

the first and second conductive materials are formed of a metal material, the second conductive material covers the linear first conductive material, and the insulating member is formed of a resin material having a function of activating an oxidized surface of a bonded object, to which the first conductive material is to be bonded, when the second conductive material is molten.

4. The wiring board according to claim 1, wherein

the first and second conductive materials are formed of a metal material, the second conductive material is formed into a plurality of particles, and scattered in the insulating member covering the linear first conductive material, and the insulating member is formed of a resin material having a action of activating an oxidized surface of a bonded object, which the first conductive material is to be bonded, when the second conductive material is molten.

5. The wiring board according to claim 2, wherein

the conductive member is formed into a strip by stacking the first conductive material and the second conductive material, and

the plurality of conductors are weaved, matching the directions of the first conductive materials and the second conductive materials of the conductive members.

6. The wiring board according to claim 1, wherein

the second conductive material covers a portion of the outer circumference of the first conductive material.

7. The wiring board according to claim 3, wherein

the conductor is constructed of the plurality of conductive members, which are covered with the insulating member.

8. The wiring board according to claim 1, wherein

in the intersecting sections of the plurality of conductors, the second conductive materials are molten, so that the first conductive materials intersecting with each other are bonded.

9. A wiring board structure, wherein

the wiring board according to claim 1, which is stacked in a plural number and which is electrically connected.

10. A method for manufacturing a wiring board where a plurality of conductors, having a conductive member including a first conductive material and a second conductive material and an insulating member covering the conductive member, are arranged lattice-like and weaved like a woven cloth,

the method for manufacturing the wiring board, comprising a process of melting the second conductive material of the conductive member, and bonding the first conductive material to the first conductive material of another conductor intersecting therewith, by pressurizing and heating intersecting sections of the plurality of conductors.

11. The method according to claim 10, wherein

the conductive member, is constructed of a two-layered structure in which the first conductive material and the second conductive material are stacked.