Method and apparatus for attaching chip to a textile

• US 20100071205A1
• Filed: 09/22/2008
• Published: 03/25/2010
• Est. Priority Date: 09/22/2008
• Status: Active Grant

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Graumann, David, Bruneau, David
• Granted Patent: US 9,758,907 B2
• Time in Patent Office: Days
• US Class Current: 29/825
• CPC Class Codes: D03D 1/0088 Fabrics having an electronic function
• CPC Class Codes: D03D 15/67 Metal wires
• CPC Class Codes: D03J 1/00 Auxiliary apparatus combined with or associated with looms
• CPC Class Codes: D10B 2101/20 Metallic fibres
• CPC Class Codes: D10B 2201/02 Cotton
• CPC Class Codes: D10B 2211/02 Wool
• CPC Class Codes: D10B 2401/16 antistatic; conductive
• CPC Class Codes: D10B 2503/04 Floor or wall coverings; Carpets
• CPC Class Codes: D10B 2505/08 Upholstery, mattresses
• CPC Class Codes: H05K 1/038 Textiles used as reinforcing materials for organic insulating substrates H05K1/0366
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 2201/0281 Conductive fibers
• CPC Class Codes: H05K 2201/029 Woven fibrous reinforcement or textile textile substrates H05K1/038
• CPC Class Codes: H05K 2201/10977 Encapsulated connections applying non-metallic protective coatings for encapsulating mounted components H05K3/284
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/5313 Means to assemble electrical device

Abstract

Embodiments disclosed herein provide approaches for attaching scan control and other electronic chips to textiles, e.g., on a loom as part of a real-time manufacturing process.

Claims

1. A method, comprising:

making a textile on a loom, said textile having a chip line;

securing a target site that includes the chip line;

mounting a chip package to the chip line; and

attaching the chip line to the chip package at two or more locations so that when it is severed between the two or more locations, the chip line retains sufficient tension within the textile.

2. The method of claim 1, comprising locating the chip line with an inductive sensor.

3. The method of claim 1, in which the chip package is mounted while the textile is moving on the loom.

4. The method of claim 1, in which the chip line comprises a group of chip lines aligned in parallel with one another.

5. The method of claim 1, in which mounting the chip package includes attaching first and second chip package layers to one another from opposite sides of said textile.

6. The method of claim 5, in which the package layers are joined together using an epoxy material.

7. The method of claim 1, in which the chip package comprises a connector with leading edge pads and trailing edge pads overlapping gaps between the leading edge pads.

8. An apparatus, comprising:

a portion of a chip package to be mounted to a textile, said portion having a connector with a first set of pads having gaps between the pads and a second set of pads to overlap the gaps of the first set of pads.

9. The apparatus of claim 8, in which the first and second sets of pads include more pads than are to be coupled to wires in the textile.

10. The apparatus of claim 8, in which the portion comprises a switch circuit to route selected ones of the first and second groups of pads to signal nodes.

11. The apparatus of claim 10, in which the portion comprises a supply reference detect circuit to provide supply references from the first and second groups of pads.

12. The apparatus of claim 8, in which the first set of pads are leading edge pads.

13. The apparatus of claim 8, in which the portion comprises access ports for cutting wires to be mounted to the pads.

14. The apparatus of claim 8, in which the portion is to be mounted to a second package portion.

15. The apparatus of claim 14, in which the first and second portions are to be initially mechanically joined followed by a more secure joining.

16. An apparatus, comprising:

an electronic module package to mount to a textile, the package having first and second portions, the first portion having redundant pads for connection to wires in the textile.

17. The apparatus of claim 16, in which the redundant pads comprise a first group of aligned pads and a second group of aligned pads, wherein at least some of the pads in the second group overlap gaps between at least some of the pads in the first group.

18. The apparatus of claim 16, in which the first and second package portions mount to one another from opposite sides of the textile.