ORGANIC LIGHT EMITTING DISPLAY AND METHOD OF MANUFACTURING THE SAME

• US 20100072482A1
• Filed: 04/15/2009
• Published: 03/25/2010
• Est. Priority Date: 09/25/2008
• Status: Active Grant

• Current Assignee: Thinheat LLC
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Kim, Sun-Min, Woo, Doo-Hyung, Shin, Kwang-Sub, Kim, Young-Il, Eom, Ji-Hye
• Granted Patent: US 8,084,772 B2
• Time in Patent Office: Days
• US Class Current: 257/72
• CPC Class Codes: H10K 2102/331 Nanoparticles used in non-emissive layers, e.g. in packaging layer
• CPC Class Codes: H10K 50/81 Anodes
• CPC Class Codes: H10K 50/824 combined with auxiliary electrodes
• CPC Class Codes: H10K 50/8423 Metallic sealing arrangements
• CPC Class Codes: H10K 50/8426 Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 59/131 Interconnections, e.g. wiring lines or terminals
• CPC Class Codes: H10K 71/50 Forming devices by joining two substrates together, e.g. lamination techniques

Abstract

Disclosed are an organic light emitting display and a method of manufacturing the same. The organic light emitting includes a first substrate, a first electrode, an organic light emitting layer, and a second electrode. The first substrate includes a pixel region showing an image and a peripheral region surrounding the pixel region. The first electrode is formed in the pixel region of the first substrate. The organic light emitting layer is formed on the first electrode. The second electrode is formed on the organic light emitting layer and extends to the peripheral region. An auxiliary electrode is formed on the second electrode to contact the second electrode on an entire surface of the first substrate, thereby applying a voltage having the same voltage level as that of the second electrode.

Claims

1. An organic light emitting display, comprising:

a first substrate comprising a pixel region to display an image and a peripheral region surrounding the pixel region;

a first electrode arranged in the pixel region;

an organic light emitting layer arranged on the first electrode;

a second electrode arranged on the organic light emitting layer, the second electrode extending to the peripheral region;

a common voltage line arranged in the peripheral region of the first substrate, the common voltage line being connected to the second electrode to apply a voltage to the second electrode; and

an auxiliary electrode arranged on the second electrode and connected to the second electrode, the auxiliary electrode being connected to the common voltage line in the peripheral region of the first substrate.

2. The organic light emitting display of claim 1, further comprising an auxiliary electrode line arranged in the peripheral region of the first substrate, the auxiliary electrode line being connected to the auxiliary electrode to apply a voltage to the auxiliary electrode.

3. The organic light emitting display of claim 2, wherein the auxiliary electrode line and the common voltage line have the same level of applied voltage.

4. The organic light emitting display of claim 2, wherein the common voltage line and the auxiliary electrode line are connected to one voltage source.

5. The organic light emitting display of claim 1, wherein the auxiliary electrode comprises a plurality of opening patterns.

6. The organic light emitting display of claim 1, wherein the auxiliary electrode comprises an oxide conductor.

7. The organic light emitting display of claim 6, wherein the oxide conductor comprises one of indium tin oxide, tin oxide, and zinc oxide doped with aluminum.

8. The organic light emitting display of claim 1, wherein the auxiliary electrode is a metal thin film.

9. The organic light emitting display of claim 1, wherein the auxiliary electrode comprises a conductive organic material.

10. The organic light emitting display of claim 1, further comprising:

a filler arranged on the auxiliary electrode; and

a second substrate arranged on the filler.

11. The organic light emitting display of claim 10, further comprising a sealant , the sealant disposed between the first and second substrates.

12. The organic light emitting display of claim 11, wherein the sealant comprises a conductive material, and a portion of the auxiliary electrode line contacts the sealant.

13. The organic light emitting display of claim 12, wherein the pixel region is surrounded by the auxiliary electrode line along the sealant.

14. The organic light emitting display of claim 12, wherein the auxiliary electrode line is divided into a plurality of lines.

15. The organic light emitting display of claim 2, further comprising a connection pad arranged on the common voltage line and the auxiliary electrode line, the connection pad contacting the second electrode and the auxiliary electrode.

16. The organic light emitting display of claim 2, further comprising a thin film transistor arranged on the first substrate,

the thin film transistor comprising:

a gate electrode arranged on the first substrate;

a gate insulating layer arranged on the gate electrode;

a semiconductor layer arranged on the gate insulating layer; and

a source electrode and a drain electrode separated from the source electrode, the source electrode and the drain electrode being arranged on the semiconductor layer, and the drain electrode being connected to the first electrode.

17. The organic light emitting display of claim 16, wherein the common voltage line and the auxiliary electrode line are arranged directly on the same layer as the source electrode and the drain electrode.

18. A method of manufacturing an organic light emitting display, the method comprising:

forming a thin film transistor in a pixel region of a first substrate;

forming a common voltage line in a peripheral region of the first substrate;

forming a first electrode in the pixel region of the first substrate, the first electrode being connected to the thin film transistor;

forming an organic light emitting layer on the first electrode;

forming a second electrode on an entire surface of the pixel region with the second electrode extending to the common voltage line of the peripheral region, the second electrode to being connected to the common voltage line;

forming a filler on an entire surface of a second substrate;

forming an auxiliary electrode on the entire surface of the second substrate having the filler; and

connecting the auxiliary electrode to the second electrode by coupling the first substrate to the second substrate.

19. The method of claim 18, further comprising forming an auxiliary electrode line in the peripheral region of the first substrate, wherein connecting the auxiliary electrode to the second electrode further comprises connecting the auxiliary electrode to the auxiliary electrode line.

20. The method of claim 19, wherein forming the thin film transistor comprises:

forming a gate electrode in the pixel region of the first substrate;

forming a gate insulating layer on the first substrate;

forming a semiconductor layer in the pixel region of the first substrate; and

depositing a first conductive material on the first substrate and then patterning the first conductive material to form a source electrode and a drain electrode on the semiconductor layer in the pixel region.

21. The method of claim 20, wherein the common voltage line and the auxiliary electrode line are formed together with the source electrode and the drain electrode through a single process, the single process comprising depositing the first conductive material on the first substrate and then patterning the first conductive material.

22. The method of claim 20, wherein forming the first electrode comprises:

forming an insulating layer on an entire surface of the pixel region of the first substrate and patterning the insulating layer to form a contact hole to expose a portion of the drain electrode; and

depositing a second conductive material on the entire surface of the pixel region of the first substrate and patterning the second conductive material to form the first electrode, the first electrode being connected to the drain electrode through the contact hole.

23. The method of claim 22, further comprising forming a connection pad on the common voltage line and the auxiliary electrode line to connect the common voltage line and the auxiliary electrode line, wherein forming the connection pad comprises:

forming an insulating layer on an entire surface of the peripheral region of the first substrate and patterning the insulating layer to form contact holes exposing a portion of the auxiliary electrode line and the common voltage line, respectively; and

depositing a second conductive material on the first substrate and patterning the second conductive material to form the connection pad, the connection pad being connected to the common voltage line and the auxiliary electrode line through the contact holes.

24. The method of claim 23, wherein the first electrode and the connection pad are formed through a single process.

25. The method of claim 18, wherein the auxiliary electrode is formed through one of an evaporation scheme using heat or an electronic beam, a dipping scheme, a spin coating scheme, a sol-gel scheme, and a lamination scheme.

26. The method of claim 25, wherein the auxiliary electrode is formed by laminating a conductive film.

27. The method of claim 18, wherein the auxiliary electrode is formed by depositing a third conductive material using heat or an electronic beam and patterning the third conductive material to form a plurality of openings.

28. The method of claim 18, wherein the auxiliary electrode is formed by laminating a conductive film comprising a plurality of opening patterns.