APPARATUS AND METHOD FOR REDUCING SLIPPAGE BETWEEN STRUCTURES IN AN INTERFEROMETRIC MODULATOR

• US 20100080890A1
• Filed: 12/04/2009
• Published: 04/01/2010
• Est. Priority Date: 09/27/2004
• Status: Active Grant

• Current Assignee: Snaptrack Incorporated (Qualcomm, Inc.)
• Original Assignee: Qualcomm MEMS Technologies Incorporated (Qualcomm, Inc.)
• Inventors: Cummings, Williams J., Floyd, Philip D., Tung, Ming-Hau, Arbuckle, Brian W.
• Granted Patent: US 7,948,671 B2
• Time in Patent Office: Days
• US Class Current: 427/58
• CPC Class Codes: G02B 26/001 based on interference in an adjustable optical cavity interference filters G02B5/28; devices or arrangements using multiple reflections in spectrometry or monochromators G01J3/26

Abstract

A support structure within an interferometric modulator device may contact various other structures within the device. Increased bond strengths between the support structure and the other structures may be achieved in various ways, such as by providing roughened surfaces and/or adhesive materials at the interfaces between the support structures and the other structures. In an embodiment, increased adhesion is achieved between a support structure and a substrate layer. In another embodiment, increased adhesion is achieved between a support structure and a moveable layer. Increased adhesion may reduce undesirable slippage between the support structures and the other structures to which they are attached within the interferometric modulator.

Claims

1. A method of making an electromechanical device, the method comprising:

forming a substrate layer, the substrate layer comprising a first reflective surface;

treating at least a portion of a support region of the substrate layer to form a treated support region; and

forming a support structure on the treated support region;

the treated support region being configured to increase adhesion between the substrate layer and the support structure.

2. The method of claim 1, wherein treating comprises roughening at least a portion of the support region of the substrate layer.

3. The method of claim 2, wherein roughening comprises etching the support region of the substrate layer.

4. The method of claim 2, wherein roughening comprises roughening a portion of the first reflective surface.

5. The method of claim 1, wherein treating comprises depositing an adhesive over at least a portion of the support region of the substrate layer.

6. The method of claim 5, wherein the adhesive comprises aluminum.

7. The method of claim 1, further comprising depositing a sacrificial layer over the substrate layer.

8. The method of claim 7, further comprising depositing a second reflective layer over the sacrificial layer.

9. The method of claim 8, further comprising removing the sacrificial layer to form a cavity positioned between the first reflective layer and the second reflective layer.

10. The method of claim 1, wherein the substrate layer comprises a transparent substrate.

11. An electromechanical device made by the method of claim 1.

12. A method of making an electromechanical device, comprising:

forming a substrate layer;

forming a support structure on the substrate layer;

treating the support structure to form a treated support structure; and

forming a movable layer on the treated support structure, wherein the treated support structure is configured to increase adhesion between the support structure and the movable layer.

13. The method of claim 12, wherein treating comprises roughening at least a portion of the support structure.

14. The method of claim 12, wherein treating comprises depositing an adhesive over at least a portion of the support structure.

15. The method of claim 14, wherein the adhesive comprises aluminum.

16. The method of claim 12, wherein the substrate layer comprises a transparent substrate.

17. The method of claim 12, further comprising forming a reflective layer on the substrate layer.

18. The method of claim 17, further comprising depositing a sacrificial layer over the reflective layer.

19. The method of claim 18, further comprising removing the sacrificial layer to form a cavity positioned between the reflective layer and the moveable layer.

20. An electromechanical device made by the method of claim 12.