TRANSPARENT MATERIAL PROCESSING WITH AN ULTRASHORT PULSE LASER
First Claim
1. A method of scribing a transparent material, comprising:
- using a single scan of a focused beam of ultrashort laser pulses to simultaneously create a surface groove in said material and at least one modified region within the bulk of said material.
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Abstract
Methods for ultrashort pulse laser processing of optically transparent materials. A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. This enables clean breaking of transparent materials at a higher speed than conventional techniques. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with side-illumination and not clearly visible without side-illumination. In addition, a method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. The ultrashort pulse duration causes nonlinear absorption of the laser radiation, and the high repetition rate of the laser causes pulse-to-pulse accumulation of heat within the materials. The laser is focused near the interface of the materials, generating a high energy fluence at the region to be welded. This minimizes damage to the rest of the material and enables fine weld lines.
145 Citations
3 Claims
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1. A method of scribing a transparent material, comprising:
using a single scan of a focused beam of ultrashort laser pulses to simultaneously create a surface groove in said material and at least one modified region within the bulk of said material.
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2. A method for scribing a transparent material, comprising:
using a single scan of a focused beam of ultrashort laser pulses to simultaneously create a plurality of modification regions within the bulk of said material.
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3. A transparent material scribed at two or more points in a depth direction thereof by a single scan of a focused beam of ultrashort laser pulses.
Specification