ARRANGEMENT FOR VAPORIZING MATERIALS AND METHOD FOR COATING SUBSTRATES

• US 20100098853A1
• Filed: 10/22/2008
• Published: 04/22/2010
• Est. Priority Date: 10/22/2008
• Status: Abandoned Application

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: HOFFMANN, Uwe, MARTINI, Marcel, GERTMANN, Reiner, RIES, Florian, SOMMER, Elisabeth
• Application Number:
  US12/256,421
• Publication Number:
  US 20100098853A1
• Time in Patent Office: Days
• US Class Current: 427/255.6
• CPC Class Codes: C23C 14/12 Organic material
• CPC Class Codes: C23C 14/562 for coating elongated substrates
• CPC Class Codes: H01L 21/67109 mainly by convection
• CPC Class Codes: H01L 21/67721 the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames H01L21/6773 takes precedence
• CPC Class Codes: H01L 21/6776 Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
• CPC Class Codes: H10K 71/164 using vacuum deposition

Abstract

The invention relates to an arrangement for the vaporization of materials, and specifically of organic materials, such as are utilized for example in the production of OLEDs. A heating element and a device for transporting a carrier for a layer to be vaporized are herein provided. The carrier with the layer to be vaporized is guided over the heating element where the layer is vaporized and deposited on a substrate.

Claims

1. Arrangement for vaporizing materials, characterized by

a) a stationary heating element,

b) a device for transporting a carrier relative to the stationary heating element, wherein this carrier is provided with a layer whose vaporization temperature is lower than the vaporization temperature of the carrier.

2. Arrangement as claimed in claim 1, characterized in that the stationary heating element is a heating plate.

3. Arrangement as claimed in claim 1, characterized in that the stationary heating element is a heating cylinder.

4. Arrangement as claimed in claim 1, characterized in that the carrier is a band.

5. Arrangement as claimed in claim 1, characterized in that the carrier is a wire.

6. Arrangement as claimed in claim 1, characterized in that the carrier is comprised of a woven material.

7. Arrangement as claimed in claim 1, characterized in that the carrier is a film.

8. Arrangement as claimed in claim 1, characterized in that the layer is an organic layer.

9. Arrangement as claimed in claim 3, characterized in that at least the carrier forms with a line perpendicular to the rotational axis of the heating cylinder an angle α

or β

.

10. Arrangement as claimed in claim 9, characterized in that the angles α

or β

, respectively, are determined by means of deflection rollers.

11. Arrangement as claimed in claim 1, characterized in that a substrate is provided which is disposed adjacent to the layer.

12. Arrangement as claimed in claim 1, characterized in that the carrier and layer are disposed on a first roller within a vaporizer chamber and the carrier without the layer is disposed on a second roller within the vaporizer chamber.

13. Method for coating substrates with vaporized organic material, characterized by the following steps:

a) the organic material is applied onto a carrier,

b) the carrier with the organic material is transported into a vacuum chamber,

c) the organic material is vaporized,

d) the vaporized material is deposited on the substrate

14. Method as claimed in claim 13, characterized in that the carrier with the organic material is set into the vacuum chamber as a roller.

15. Method as claimed in claim 13, characterized in that the carrier with the organic material is disposed in a cassette which is disposed on the vacuum chamber.

16. Method as claimed in claim 13, characterized in that the carrier with the organic material is disposed in a cassette which is disposed in the vacuum chamber.