RADIO IC DEVICE

• US 20100103058A1
• Filed: 01/15/2010
• Published: 04/29/2010
• Est. Priority Date: 07/18/2007
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: KATAYA, Takeshi, DOKAI, Yuya, KATO, Noboru, ISHINO, Satoshi, IKEMOTO, Nobuo, KIMURA, Ikuhei
• Granted Patent: US 9,460,376 B2
• Time in Patent Office: Days
• US Class Current: 343/702
• CPC Class Codes: G06K 19/06187 with magnetically detectable marking
• CPC Class Codes: G06K 19/0723 the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07756 the connection being non-galvanic, e.g. capacitive
• CPC Class Codes: G06K 19/07773 Antenna details antennas for wireless devices, e.g. RFID tags, in general H01Q1/22
• CPC Class Codes: G06K 19/07779 the inductive antenna being a coil
• CPC Class Codes: G06K 19/07783 the coil being planar
• CPC Class Codes: G06K 19/07784 the inductive antenna consisting of a plurality of coils stacked on top of one another
• CPC Class Codes: G06K 19/07786 the antenna being of the HF type, such as a dipole
• CPC Class Codes: H01L 2223/6655 Matching arrangements, e.g. arrangement of inductive and capacitive components
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 23/49838 Geometry or layout
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H01Q 1/36 : Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewithH01Q1/08, H01Q1/14 take precedence
• CPC Class Codes: H01Q 1/38 : formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 1/42 : Housings not intimately mechanically associated with radiating elements, e.g. radome
• CPC Class Codes: H01Q 1/44 : using equipment having another main function to serve additionally as an antenna , e.g. means for giving an antenna an aesthetic aspectH01Q1/27 - H01Q1/34 take precedence
• CPC Class Codes: H01Q 13/10 : Resonant slot antennas
• CPC Class Codes: H01Q 7/00 : Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
• CPC Class Codes: H01Q 9/16 : with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole H01Q9/44 takes precedence
• CPC Class Codes: H01Q 9/30 : with feed to end of elongated active element, e.g. unipole H01Q9/44 takes precedence
• CPC Class Codes: H05K 1/0216 : Reduction of cross-talk, noise or electromagnetic interference grounding H05K1/0215
• CPC Class Codes: H05K 1/0237 : High frequency adaptations H05K1/0216 takes precedence
• CPC Class Codes: H05K 1/0239 : Signal transmission by AC coupling
• CPC Class Codes: H05K 1/141 : One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 1/16 : incorporating printed electric components, e.g. printed resistor, capacitor, inductor
• CPC Class Codes: H05K 1/181 : associated with surface mounted components
• CPC Class Codes: H05K 2201/10015 : Non-printed capacitor
• CPC Class Codes: H05K 2201/10022 : Non-printed resistor
• CPC Class Codes: H05K 2201/1003 : Non-printed inductor
• CPC Class Codes: H05K 2201/10098 : Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
• CPC Class Codes: H05K 2201/10371 : Shields or metal cases
• CPC Class Codes: H05K 2201/10522 : Adjacent components

Abstract

A radio IC device includes an electromagnetic coupling module includes a radio IC chip arranged to process transmitted and received signals and a feed circuit board including an inductance element. The feed circuit board includes an external electrode electromagnetically coupled to the feed circuit, and the external electrode is electrically connected to a shielding case or a wiring cable. The shielding case or the wiring cable functions as a radiation plate. The radio IC chip is operated by a signal received by the shielding case or the wiring, and the answer signal from the radio IC chip is radiated from the shielding case or the wiring cable to the outside. A metal component functions as the radiation plate, and the metal component may be a ground electrode disposed on the printed wiring board.

Claims

1. A radio IC device comprising:

a high frequency device defined by an electromagnetic coupling module, the electromagnetic coupling module including a radio IC arranged to process transmitted and received signals and a feed circuit board including a feed circuit including an inductance element electrically connected to or electromagnetically coupled to the radio IC and coupled to an external circuit; and

a radiation plate arranged so as to be coupled to the high frequency device;

wherein

the radiation plate is defined by a case of an apparatus and/or a metal component disposed in the apparatus; and

the feed circuit board includes a resonance circuit through which the radio IC is operated by a signal received by the radiation plate, and through which an answer signal from the radio IC is radiated from the radiation plate to the outside.

2. The radio IC device according to claim 1, wherein the metal component is at least one of a first wiring electrode disposed in the apparatus, a shielding case, a wiring electrode on a wiring board, a ground electrode on the wiring board, or a connector connected to the wiring electrode or the ground electrode.

3. The radio IC device according to claim 1, wherein the feed circuit board includes a matching circuit.

4. The radio IC device according to claim 2, wherein the inductance element is defined by a spiral electrode, and the spiral electrode is arranged so as to be coupled with a magnetic field generated from the wiring electrode on the wiring board.

5. The radio IC device according to claim 2, wherein the wiring electrode and the ground electrode on the wiring board are isolated from each other, and the feed circuit board is arranged across a region between the wiring electrode and the ground electrode.

6. The radio IC device according to claim 1, wherein the case is made of a metal, and the case defines the radiation plate by itself.

7. The radio IC device according to claim 1, wherein the case is made of a non-conductive material, and an electroconductive electrode film is provided on the case to define the radiation plate.

8. The radio IC device according to claim 1, wherein the high frequency device is arranged together with another electronic component on a printed wiring board, and the case covers the high frequency device and the electronic component.

9. The radio IC device according to claim 8, wherein the printed wiring board includes a second wiring electrode coupling the feed circuit and the radiation plate.

10. The radio IC device according to claim 9, wherein the second wiring electrode is a loop electrode.

11. The radio IC device according to claim 10, wherein the loop electrode is disposed on an auxiliary substrate on which the feed circuit board is disposed.

12. The radio IC device according to claim 8, wherein the printed wiring board includes a plurality of printed wiring boards, the high frequency device is disposed on at least one of the printed wiring boards, and the case covers the high frequency device and at least one of the electronic components.

13. The radio IC device according to claim 8, wherein the printed wiring board includes a second wiring electrode coupling the feed circuit and the radiation plate, and the case covers all the electronic components disposed on the printed wiring board and the high frequency device.

14. The radio IC device according to claim 9, wherein the second wiring electrode defines a portion of the radiation plate.

15. The radio IC device according to claim 8, wherein at least a portion of the electronic component defines a portion of the radiation plate.

16. The radio IC device according to claim 9, wherein the printed wiring board includes a ground electrode, and the second wiring electrode is electrically connected to the ground electrode.

17. The radio IC device according to claim 9, wherein the second wiring electrode is provided on the surface of or within the printed wiring board.

18. The radio IC device according claim 8, wherein the printed wiring board is made of a resin or a ceramic.

19. The radio IC device according to claim 1, wherein an external electrode arranged to be coupled to the feed circuit is provided on the surface of the feed circuit board.

20. The radio IC device according to claim 1, wherein the feed circuit board includes a multilayer substrate.

21. The radio IC device according to claim 1, wherein the feed circuit board includes a flexible substrate.