INTEGRATED CIRCUIT PACKAGE FORMATION

• US 20100112756A1
• Filed: 11/06/2008
• Published: 05/06/2010
• Est. Priority Date: 11/06/2008
• Status: Active Grant

• Current Assignee: North Star Innovations Inc. (Wi-LAN Inc.)
• Original Assignee: Freescale Semiconductor, Inc. (NXP Semiconductors NV)
• Inventors: Lytle, William H., Amrine, Craig S.
• Granted Patent: US 7,741,151 B2
• Time in Patent Office: Days
• US Class Current: 438/113
• CPC Class Codes: H01L 21/568 Temporary substrate used as encapsulation process aid H01L21/4832 and H01L21/566 take precedence
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 2221/68345 used as a support during the manufacture of self supporting substrates
• CPC Class Codes: H01L 2221/68359 used as a support during manufacture of interconnect decals or build up layers
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/12105 Bump connectors formed on an encapsulation of the semiconductor or solid-state body, e.g. bumps on chip-scale packages
• CPC Class Codes: H01L 2224/24137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/24227 the HDI interconnect not connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the semiconductor or solid-state body being mounted in a cavity or on a protrusion of the item
• CPC Class Codes: H01L 2224/82 by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/3128 the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 23/5389 the chips being integrally enclosed by the interconnect and support structures
• CPC Class Codes: H01L 24/19 Manufacturing methods of high density interconnect preforms
• CPC Class Codes: H01L 24/24 of an individual high density interconnect connector
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/0104 : Zirconium [Zr]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/04941 : TiN
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/1433 : Application-specific integrated circuit [ASIC]
• CPC Class Codes: H01L 2924/1461 : MEMS
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19042 : being an inductor

Abstract

Integrated circuit packages are formed from a panel where the panel is separated by laser cutting the panel. In some embodiments, the panel is attached to the carrier for the formation of interconnect layers on the panel. Afterwards, the panel is cut with a laser while on the carrier to separate the integrated circuit packages. A tape or other type of structure may be attached to the top of the packages after the laser cutting. The integrated circuit packages are removed from the carrier by releasing the adhesive and removing the integrated circuit packages with the tape. The packages are then removed from the tape.

Claims

1. A method for making an integrated circuit package comprising:

providing a panel attached to a carrier, the panel including a first major surface attached to the carrier, the panel including a plurality of integrated circuit chips encapsulated with an encapsulant;

forming at least one interconnect layer on a second major surface of the panel, the second major surface being an opposite surface to the first major surface, the panel being supported by the carrier during the forming;

laser cutting the panel into a plurality of integrated circuit packages after the forming, the panel being supported by the carrier during the laser cutting, wherein each integrated circuit package includes at least one integrated circuit chip of the plurality of integrated circuits chips;

removing the plurality of integrated circuit packages from the carrier after the laser cutting.

2. The method of claim 1 further comprising:

after the removing, attaching a second panel to the carrier, the second panel including a first major surface attached to the carrier, the second panel including a second plurality of integrated circuit chips encapsulated with an encapsulant;

forming at least one interconnect layer on the second major surface of the second panel, the second major surface of the second panel being an opposite surface to the first major surface of the second panel, the second panel being supported by the carrier during the forming;

laser cutting the second panel into a second plurality of integrated circuit packages after the forming, the second panel being supported by the carrier during the laser cutting, wherein each integrated circuit package of the second plurality of integrated circuit packages includes at least one integrated circuit chip of the second plurality of integrated circuit chips;

removing the second plurality of integrated circuit packages from the carrier after the laser cutting.

3. The method of claim 1 wherein the laser cutting the panel includes laser cutting with a laser beam having a wavelength in a range of 350-530 nanometers.

4. The method of claim 1 wherein the laser cutting the panel includes laser cutting with a laser beam at a power level in a range of 5-50 watts.

5. The method of claim 1 wherein the laser cutting the panel includes laser cutting with a laser beam at a first power level and a first wavelength, wherein the carrier is of a material that is resistant to damage of the laser beam during the laser cutting.

6. The method of claim 5 wherein the carrier is made of ceramic alumina.

7. The method of claim 1 wherein the panel is attached to the carrier with an adhesive, wherein the removing the plurality of integrated circuit packages from the carrier includes exposing the carrier to a solution for releasing the adhesive.

8. The method of claim 1 further comprising:

after the laser cutting and before the removing, attaching a tape to each of the integrated circuit packages of the plurality of integrated circuit packages with an adhesive;

removing the plurality of integrated circuit packages from the tape after the removing the plurality of integrated circuit packages from the carrier.

9. A method of making an integrated circuit package comprising:

providing a panel attached to a carrier, the panel including a first major surface attached to the carrier with an adhesive of a first releasing type, the panel including a plurality of integrated circuit chips encapsulated with an encapsulant;

laser cutting the panel into a plurality of integrated circuit packages, the panel being supported by the carrier during the laser cutting, wherein each integrated circuit package of the plurality of integrated circuit packages includes at least one integrated circuit chip of the plurality of integrated circuit chips;

after the laser cutting, attaching a first structure to each integrated circuit package of the plurality of integrated circuit packages at an opposite side from the first major surface of the panel with an adhesive of a second releasing type that is different from the first releasing type;

removing the plurality of integrated circuit packages from the carrier after the laser cutting and while the plurality of integrated circuit packages are attached to the first structure;

removing the plurality of integrated circuit packages from the first structure after the removing the plurality of integrated circuit packages from the carrier.

10. The method of claim 9 wherein the first structure is a tape material.

11. The method of claim 9 wherein the first releasing type is characterized as a solution releasing type, wherein the removing the plurality of integrated circuit packages from the carrier includes exposing the adhesive of the first releasing type to a solution for releasing the adhesive.

12. The method of claim 11 where the adhesive of a second type is characterized as an ultraviolet (UV) release adhesive, wherein the removing the plurality of integrated circuit packages from the first structure includes exposing the adhesive of the second releasing type to UV radiation.

13. The method of claim 9 further comprising:

prior to the laser cutting, forming at least one interconnect layer on a second major surface of the panel, the panel being supported by the carrier during the forming.

14. The method of claim 9 wherein the laser cutting the panel includes laser cutting with a laser beam having a wavelength in a range of 350-530 nanometers.

15. The method of claim 9 wherein the laser cutting the panel includes laser cutting with a laser beam at a power level in a range of 5-50 watts.

16. The method of claim 9 wherein the laser cutting the panel includes laser cutting with a laser beam at a first power level and a first wavelength, wherein the carrier is of a material that is resistant to damage of the laser beam during the laser cutting.

17. The method of claim 9 further comprising:

after removing the plurality of integrated circuit packages from the carrier, attaching a second panel to the carrier, the second panel including a first major surface attached to the carrier with an adhesive of the first releasing type, the second panel including a second plurality of integrated circuit chips encapsulated with an encapsulant;

laser cutting the second panel into a second plurality of integrated circuit packages after the attaching the second panel to the carrier, the second panel being supported by the carrier during the laser cutting, wherein each integrated circuit package of the second plurality of integrated circuit packages includes at least one integrated circuit chip of the second plurality of integrated circuit chips;

removing the second plurality of integrated circuit packages from the carrier after the laser cutting.

18. The method of claim 9 wherein the carrier is made of ceramic alumina.

19. The method of claim 9 wherein the removing the plurality of integrated circuit packages from the first structure includes individually removing each integrated circuit package of the plurality of integrated circuit packages with an automatic package picking device.

20. A method of making an integrated circuit package comprising:

attaching a panel to a carrier, the panel including a first major side and a second major side, the second major side being an opposing side to the first major side, the attaching includes attaching the panel to the carrier at the first major side with an adhesive of a first releasing type, the panel including a plurality of integrated circuit chips encapsulated with an encapsulant;

forming at least one interconnect layer on the second major side, the panel being supported by the carrier during the forming;

laser cutting the panel into a plurality of integrated circuit packages after the forming, the panel being supported by the carrier during the laser cutting, wherein each integrated circuit package of the plurality of integrated circuit packages includes at least one integrated circuit chip of the plurality of integrated circuit chips;

after the laser cutting, attaching a tape to each integrated circuit package of the plurality of integrated circuit packages at an opposite side to the first major side of the panel with an adhesive of a second releasing type that is different from the first releasing type;

removing the plurality of integrated circuit packages from the carrier after the laser cutting and while the plurality of integrated circuit packages are attached to the tape;

removing the plurality of integrated circuit packages from the tape.