LIGHT-EMITTING MODULE AND ILLUMINATION DEVICE

• US 20100117100A1
• Filed: 11/04/2009
• Published: 05/13/2010
• Est. Priority Date: 11/07/2008
• Status: Abandoned Application

• Current Assignee: Toshiba Lighting & Technology Corporation (Toshiba Corporation)
• Original Assignee: Toshiba Lighting & Technology Corporation (Toshiba Corporation)
• Inventors: Nishimura, Kiyoshi, Ogawa, Kozo
• Application Number:
  US12/612,373
• Publication Number:
  US 20100117100A1
• Time in Patent Office: Days
• US Class Current: 257/88
• CPC Class Codes: F21K 9/68 Details of reflectors forming part of the light source
• CPC Class Codes: F21V 21/30 Pivoted housings or frames
• CPC Class Codes: F21Y 2103/00 Elongate light sources, e.g. fluorescent tubes
• CPC Class Codes: F21Y 2105/10 comprising a two-dimensional array of point-like light-generating elements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/641 characterized by the materials

Abstract

There is provided a light-emitting module which makes it difficult to sense glare and which suppresses the temperature rise of light-emitting diode chips and has a cost advantage. The light-emitting module is provided with a base body formed with a non-metallic member having a thermal conductivity of 1 W/mk or less. In the base body, a plurality of LED chips are spaced 10 to 30 mm apart from each other, and their junction temperature when they are normally lit is preferably set at 90° C. or less. A translucent sealing member covering an area between the adjacent light-emitting diode chips is provided.

Claims

1. A light-emitting module comprising:

a base body formed with a non-metallic member having a thermal conductivity of 1 W/mk or less;

a plurality of light-emitting diode chips spaced 10 to 30 mm apart from each other at a front surface of the base body, an electric power of 0.06 to 0.10 W being supplied to each of the plurality of light-emitting diode chips; and

a translucent sealing member covering the plurality of light-emitting diode chips and an area between adjacent light-emitting diode chips.

2. The light-emitting module of claim 1,

wherein, between adjacent light-emitting diode chips, the base body includes a reflector covered with the translucent sealing member reflecting light emitted from the light-emitting diode chips in a direction of the front surface.

3. The light-emitting module of claim 1, further comprising:

a translucent front surface cover arranged on a front surface side of the sealing member without an air layer being interposed between the sealing member and the front surface cover.

4. An illumination device comprising:

a light-emitting module including;

a base body formed with a non-metallic member having a thermal conductivity of 1 W/mk or less,

a plurality of light-emitting diode chips spaced 10 to 30 mm apart from each other at a front surface of the base body, an electric power of 0.06 to 0.10 W being supplied to each of the plurality of light-emitting diode chips, and

a translucent sealing member covering the plurality of light-emitting diode chips and an area between adjacent light-emitting diode chips,

an apparatus main body provided with the light-emitting module; and

a lighting device lighting the light-emitting module.

5. The illumination device of claim 4, wherein between adjacent light-emitting diode chips, the base body includes a reflector covered with the translucent sealing member reflecting light emitted from the light-emitting diode chips in a direction of the front surface.

6. The illumination device of claim 4, wherein the light-emitting module further includes a translucent front surface cover arranged on a front surface side of the sealing member without an air layer being interposed between the sealing member and the front surface cover.