LIGHT EMITTING DEVICE

• US 20100123156A1
• Filed: 12/19/2008
• Published: 05/20/2010
• Est. Priority Date: 11/18/2008
• Status: Active Grant

• Current Assignee: Seoul Semiconductor Co., Ltd.
• Original Assignee: Seoul Semiconductor Co., Ltd.
• Inventors: Cho, Jae Ho, Kim, Bang Hyun, SEO, Eun Jung
• Granted Patent: US 7,964,943 B2
• Time in Patent Office: Days
• US Class Current: 257/99
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/483 Containers
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/52 Encapsulations
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

Provided is a light emitting device. The light emitting device includes: a plurality of lead frame units spaced apart from each other, each of the lead frame units being provided with at least one fixing space perforating a body thereof in a vertical direction; a light emitting diode chip mounted on one of the lead frame units; and a molding unit that is integrally formed on top surfaces of the lead frame units and in the fixing spaces to protect the light emitting diode chip.

Claims

1. A light emitting device comprising:

a plurality of lead frame units spaced apart from each other, each of the lead frame units being provided with at least one fixing space perforating a body thereof in a vertical direction;

a light emitting diode chip mounted on one of the lead frame units; and

a molding unit that is integrally formed on top surfaces of the lead frame units and in the fixing spaces to protect the light emitting diode chip.

2. The light emitting device of claim 1, wherein the fixing spaces comprise outer fixing holes that are formed at all or some of a region where the lead frame units face each other and opposite side edge regions of the lead frame units.

3. The light emitting device of claim 1, wherein the fixing spaces comprise at least one inner fixing hole formed in an inner region of the lead frame units.

4. The light emitting device of claim 1, wherein stepped portions are formed on sidewalls of the fixing spaces spaces so that a lower portion area of the fixing space is greater than an upper portion area of the fixing space.

5. The light emitting device of claim 2, wherein stepped portions are formed on sidewalls of the fixing spaces spaces so that a lower portion area of the fixing space is greater than an upper portion area of the fixing space.

6. The light emitting device of claim 3, wherein stepped portions are formed on sidewalls of the fixing spaces so that a lower portion area of the fixing space is greater than an upper portion area of the fixing space.

7. The light emitting device of claim 1, wherein inclined surfaces are formed at the sidewalls of the fixing spaces so that a lower portion area of the fixing space is greater than an upper portion area of the fixing space.

8. The light emitting device of claim 2, wherein inclined surfaces are formed at the sidewalls of the fixing spaces so that a lower portion area of the fixing space is greater than an upper portion area of the fixing space.

9. The light emitting device of claim 3, wherein inclined surfaces are formed at the sidewalls of the fixing spaces so that a lower portion area of the fixing space is greater than an upper portion area of the fixing space.

10. The light emitting device of claim 1, further comprising a reflector formed on top surfaces of the lead frame units and surrounding the light emitting diode chip.

11. The light emitting device of claim 1, wherein the molding unit comprises a phosphor to alter a wavelength of light emitted from the light emitting diode chip.