Antenna using buildup structure and method of manufacturing the same

• US 20100156744A1
• Filed: 12/21/2009
• Published: 06/24/2010
• Est. Priority Date: 12/24/2008
• Status: Active Grant

• Current Assignee: Korea Electronics Technology Institute (Government of South Korea)
• Original Assignee: Korea Electronics Technology Institute (Government of South Korea)
• Inventors: Lee, Ho-Jun
• Granted Patent: US 8,350,760 B2
• Time in Patent Office: Days
• US Class Current: 343/846
• CPC Class Codes: H01Q 1/2225 used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 1/40 Radiating elements coated with or embedded in protective material
• CPC Class Codes: H01Q 23/00 Antennas with active circuits or circuit elements integrated within them or attached to them
• CPC Class Codes: Y10T 29/49016 Antenna or wave energy "plumbing" making
• CPC Class Codes: Y10T 29/49018 with other electrical component

Abstract

There are provided an antenna using a buildup structure and a method of manufacturing the same. In the antenna, a tag chip is positioned within a dielectric and is connected to a radiator through a connection line or a via-hole, thereby being strong against external environments, decreasing a defective rate and enabling to be used for the special purpose of being positioned within a metal or liquid.

Claims

1. An antenna using a buildup structure, comprising:

a dielectric layer including a first dielectric, and a second dielectric stacked on the first dielectric;

a radiator positioned on an upper surface of the dielectric layer;

a ground positioned at an under surface of the dielectric layer;

a ground line connecting the radiator and the ground; and

a chip positioned within the second dielectric, wherein the dielectric layer includes at least one via-hole to connect input/output terminals of the chip and the radiator.

2. The antenna according to claim 1, wherein the first dielectric and the second dielectric consist of the same material.

3. The antenna according to claim 1, wherein the first dielectric and the second dielectric consist of different materials.

4. The antenna according to claim 1, wherein the at least one via-hole is printed with a conductor.

5. The antenna according to claim 1, wherein the at least one via-hole is filled with a conductor.

6. An antenna using a buildup structure, comprising:

a dielectric layer including a first dielectric, a second dielectric stacked on the first dielectric, and a third dielectric positioned amid the second dielectric and stacked on the first dielectric;

a radiator positioned on an upper surface of the dielectric layer;

a ground positioned at an under surface of the dielectric layer;

a ground line connecting the radiator and the ground;

a chip positioned within the third dielectric; and

a connection line connecting the chip and the radiator.

7. The antenna according to claim 6, wherein one or more of the first, second and third dielectrics consist of different materials.

8. A method of manufacturing an antenna using a buildup structure, the method comprising:

coating a first dielectric on an upper surface of a ground formed of a conductor;

stacking a chip on an upper surface of the first dielectric;

coating a second dielectric on the upper surface of the first dielectric on which the chip is stacked;

coating a radiator on an upper surface of the second dielectric; and

forming a ground line passing through the first and second dielectrics, to connect the radiator and the ground, and forming at least one via-hole passing through the second dielectric, to connect the radiator and input/output terminals of the chip.

9. The method according to claim 8, wherein the first dielectric and the second dielectric consist of the same material.

10. The method according to claim 8, wherein the first dielectric and the second dielectric consist of different materials.

11. The method according to claim 8, wherein the radiator is connected with the input/output terminals of the chip by printing a conductor.

12. The method according to claim 8, wherein the radiator is connected with the input/output terminals of the chip by filling a conductor.

13. A method of manufacturing an antenna using a buildup structure, the method comprising:

coating a first dielectric on an upper surface of a ground formed of a conductor;

coating a second dielectric on an upper surface of the first dielectric;

etching a middle part of the second dielectric and stacking a chip on the etched part of the second dielectric;

coating a radiator on an upper surface of the second dielectric so that the radiator is connected to a connection line of the chip;

coating a third dielectric on the part where the chip is stacked; and

forming a ground line passing through the first and second dielectrics to connect the radiator and the ground.

14. The method according to claim 13, wherein one or two of the first, second and third dielectrics consist of different materials.